Patents by Inventor Hiroyuki Yamagishi

Hiroyuki Yamagishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180264597
    Abstract: A laser processing apparatus 10 includes a continuous-wave laser oscillator 12 for generating a continuous-wave laser beam, a condenser lens 18 for concentrating a continuous-wave laser beam onto a workpiece, and a delay time setting means for calculating an energy value for each processing by a continuous-wave laser beam irradiation on the basis of processing data and accumulating the calculated energy value, and setting a predetermined delay time between the processings when the accumulated energy value exceeds a predetermined threshold.
    Type: Application
    Filed: March 16, 2018
    Publication date: September 20, 2018
    Inventors: Hiroyuki YAMAGISHI, Toshitaka NAMBA
  • Publication number: 20180103133
    Abstract: A connector is formed by fixing two or more connector parts each made from a resin to each other by press fitting or with an adhesive. At least one weld part regulating thermal deformation between the connector parts is formed in a boundary portion between the adjoining connector parts.
    Type: Application
    Filed: October 4, 2017
    Publication date: April 12, 2018
    Inventor: Hiroyuki YAMAGISHI
  • Publication number: 20180093345
    Abstract: A joint structure comprises a light-absorbable member having at least one opening portion and a light-permeable member superposed on the light-absorbable member so as to cover the opening portion, wherein a first annular weld part is formed so as to enclose the opening portion and join the light-absorbable member and the light-permeable member, and a second dot-like weld part(s) joining the light-absorbable member and the light-permeable member is/are formed in a position adjacent to the first weld part.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 5, 2018
    Inventor: Hiroyuki YAMAGISHI
  • Publication number: 20180093423
    Abstract: A joint structure comprises a light-absorbable member having at least one opening portion and a light-permeable member superposed on the light-absorbable member so as to cover the opening portion, wherein an annular weld part is formed so as to enclose the opening portion and join the light-absorbable member and the light-permeable member, and the light-permeable member is formed into a thin sheet adhering to the light-absorbable member by deforming at a depressurized state of an interior of the opening portion before the formation of the annular weld part.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 5, 2018
    Inventor: Hiroyuki YAMAGISHI
  • Publication number: 20180093346
    Abstract: A joint structure comprising a light-absorbable member having at least one opening portion and a light-permeable member superposed on the light-absorbable member so as to cover the opening portion, wherein an annular weld part is formed so as to enclose the opening portion and join the light-absorbable member and the light-permeable member, and an area ratio of a portion at the side of the light-absorbable member to a portion at the side of the light-permeable member side is in a range of 12-35 viewing a section perpendicular to the extending direction of the annular weld part.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 5, 2018
    Inventor: Hiroyuki YAMAGISHI
  • Publication number: 20180076501
    Abstract: A connector device according to the present disclosure includes a first connector section and a second connector section. The first connector section includes a waveguide for transmitting a high-frequency signal. The second connector section includes a waveguide for transmitting a high-frequency signal, a yoke disposed to cover the waveguide, and a magnet forming a magnetic circuit with the yoke, and is couplable to the first connector section by the attractive force of the magnet. A communication system according to the present disclosure includes two communication devices and a connector device. The connector device has the above-described configuration and transmits a high-frequency signal between the two communication devices.
    Type: Application
    Filed: January 19, 2016
    Publication date: March 15, 2018
    Inventors: ISAO MATSUMOTO, TAKAYUKI MOGI, KENICHI KAWASAKI, TETSUYA MAKITA, TATSUHITO AONO, YU SHIGETA, SHINTARO NONAKA, TAKAHIRO TAKEDA, YASUHIRO OKADA, HIROYUKI YAMAGISHI
  • Patent number: 9632110
    Abstract: A semiconductor inspection device (1) equipped with a contacting unit (7) having a contacting side surface (7a) electrically contacting a semiconductor element (3), and which inspects the semiconductor element (3) by making the contacting unit (7) electrically contact the semiconductor element (3). The contacting side surface (7a) is provided with a plurality of projecting units (13), and the semiconductor element inspection device (1) is equipped with a hitting mark detecting unit (11) configured to detect hitting marks of the projecting unit (13) transferred to the semiconductor element (3) when the contacting side surface (7a) contacts the semiconductor element (3), and a control unit (17) configured to determine whether or not an inspection of the semiconductor element (3) is performed appropriately, on the basis of the hitting marks detected by the hitting mark detecting unit (11).
    Type: Grant
    Filed: August 14, 2013
    Date of Patent: April 25, 2017
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigeto Akahori, Shinyu Hirayama, Hiroyuki Yamagishi, Yoko Yamaji
  • Patent number: 9417264
    Abstract: Provided are a current application device capable of improving the electrical contact between projections of a contact section and a surface electrode when applying a test current to a semiconductor element, and a method of manufacturing a semiconductor element properly tested by using the current application device. The current application device includes a contact section that has a plurality of projections, which are brought into contact with a surface electrode of a semiconductor element to apply a test current, and a pressing section that presses the contact section against the semiconductor element such that the projections penetrate a film to come in contact with the surface electrode. The contact section has a plurality of the projections on a plane that has been formed in a curved shape, and the curved-shaped plane is deformed into a planar shape by being pressed by the pressing section.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: August 16, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigeto Akahori, Hitoshi Saito, Hiroyuki Yamagishi, Shinyu Hirayama, Satoshi Hasegawa, Yoko Yamaji, Koichiro Sato, Machie Saitou
  • Patent number: 9291643
    Abstract: A current applying device is provided in which a contact body which surface-contacts with an inspection target body makes contact with the surface of the inspection target body uniformly; current can be favorably applied from the contact body to the inspection target body; and the contact body alone can be replaced. A probe device 1 for applying current by being in pressure-contact with the power semiconductor H includes: a contact body 2 which surface-contacts with the power semiconductor H; and a plurality of electrically-conductive two-tier springs 31 which press the contact body 2 onto the power semiconductor H; the contact body 2 and the plurality of electrically-conductive two-tier springs 31 are separate bodies, and the plurality of electrically-conductive two-tier springs 31 electrify the contact body 2 while providing pressing force F to each of a plurality of sections of the contact body 2.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: March 22, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigeto Akahori, Hiroyuki Yamagishi, Satoshi Hasegawa, Yoko Yamaji, Nobuo Kambara, Shinyu Hirayama
  • Patent number: 9253387
    Abstract: There is provided a camera module including: a lens; an image pickup device arranged on an optical axis of the lens; and an actuator section configured to reciprocate the image pickup device in an optical axis direction of the lens, wherein the actuator section includes a movable joint section on which the image pickup device is fixed, a parallel link mechanism section having a movable end section attached to the movable joint section and a mounting end section, and a movable element that is configured to perform displacement motion by a displacement amount depending on a level of a voltage to be applied and that is coupled to a coupling region between the movable joint section and the movable end section of the parallel link mechanism section in such a manner that the displacement motion is transmittable.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: February 2, 2016
    Assignee: SONY CORPORATION
    Inventors: Toshihiro Furusawa, Yoshihito Higashitsutsumi, Yoshiteru Kamatani, Yukihisa Kinugasa, Hideo Kawabe, Takehisa Ishida, Yusaku Kato, Nobuyuki Nagai, Masayoshi Morita, Hiroyuki Yamagishi
  • Publication number: 20150194353
    Abstract: Provided are a current application device capable of improving the electrical contact between projections of a contact section and a surface electrode when applying a test current to a semiconductor element, and a method of manufacturing a semiconductor element properly tested by using the current application device. The current application device includes a contact section that has a plurality of projections, which are brought into contact with a surface electrode of a semiconductor element to apply a test current, and a pressing section that presses the contact section against the semiconductor element such that the projections penetrate a film to come in contact with the surface electrode. The contact section has a plurality of the projections on a plane that has been formed in a curved shape, and the curved-shaped plane is deformed into a planar shape by being pressed by the pressing section.
    Type: Application
    Filed: January 5, 2015
    Publication date: July 9, 2015
    Inventors: Shigeto Akahori, Hitoshi Saito, Hiroyuki Yamagishi, Shinyu Hirayama, Satoshi Hasegawa, Yoko Yamaji, Koichiro Sato, Machie Saitou
  • Patent number: 9054078
    Abstract: A signal processing device includes: signal processing circuits. The signal processing circuit includes an input/output circuit configured by an input circuit serving as an input interface of a signal of a predetermined frequency band and/or an output circuit serving as an output interface of a signal of the frequency band and performs transmission of a signal of the frequency band between the signal processing circuit and another signal processing circuit. The output circuits of one and another signal processing circuits include circuits having the same configuration. The input circuits of the one and another signal processing circuits include other circuits having the same configurations. The input/output circuits of the one and another signal processing circuits can perform transmission of a signal of the predetermined frequency band even when any one of transmission media having mutually different characteristics is mediated.
    Type: Grant
    Filed: February 8, 2012
    Date of Patent: June 9, 2015
    Assignee: SONY CORPORATION
    Inventors: Kenichi Kawasaki, Yusuke Tanaka, Hiroyuki Yamagishi, Ali Hajimiri
  • Publication number: 20150070565
    Abstract: There is provided a camera module including: a lens; an image pickup device arranged on an optical axis of the lens; and an actuator section configured to reciprocate the image pickup device in an optical axis direction of the lens, wherein the actuator section includes a movable joint section on which the image pickup device is fixed, a parallel link mechanism section having a movable end section attached to the movable joint section and a mounting end section, and a movable element that is configured to perform displacement motion by a displacement amount depending on a level of a voltage to be applied and that is coupled to a coupling region between the movable joint section and the movable end section of the parallel link mechanism section in such a manner that the displacement motion is transmittable.
    Type: Application
    Filed: February 28, 2013
    Publication date: March 12, 2015
    Applicant: SONY CORPOTATION
    Inventors: Toshihiro Furusawa, Yoshihito Higashitsutsumi, Yoshiteru Kamatani, Yukihisa Kinugasa, Hideo Kawabe, Takehisa Ishida, Yusaku Kato, Nobuyuki Nagai, Masayoshi Morita, Hiroyuki Yamagishi
  • Patent number: 8762812
    Abstract: A decoding device includes: a determination unit that determines whether or not a decoding ending condition is satisfied at an interval shorter than an interval of one decoding process in repeated decoding and ends the process in the middle of the one decoding process in a case where the decoding ending condition is satisfied.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: June 24, 2014
    Assignee: Sony Corporation
    Inventor: Hiroyuki Yamagishi
  • Publication number: 20140125373
    Abstract: A semiconductor inspection device (1) equipped with a contacting unit (7) having a contacting side surface (7a) electrically contacting a semiconductor element (3), and which inspects the semiconductor element (3) by making the contacting unit (7) electrically contact the semiconductor element (3). The contacting side surface (7a) is provided with a plurality of projecting units (13), and the semiconductor element inspection device (1) is equipped with a hitting mark detecting unit (11) configured to detect hitting marks of the projecting unit (13) transferred to the semiconductor element (3) when the contacting side surface (7a) contacts the semiconductor element (3), and a control unit (17) configured to determine whether or not an inspection of the semiconductor element (3) is performed appropriately, on the basis of the hitting marks detected by the hitting mark detecting unit (11).
    Type: Application
    Filed: August 14, 2013
    Publication date: May 8, 2014
    Applicant: Honda Motor Co., Ltd.
    Inventors: Shigeto Akahori, Shinyu Hirayama, Hiroyuki Yamagishi, Yoko Yamaji
  • Publication number: 20140015558
    Abstract: A current applying device is provided in which a contact body which surface-contacts with an inspection target body makes contact with the surface of the inspection target body uniformly; current can be favorably applied from the contact body to the inspection target body; and the contact body alone can be replaced. A probe device 1 for applying current by being in pressure-contact with the power semiconductor H includes: a contact body 2 which surface-contacts with the power semiconductor H; and a plurality of electrically-conductive two-tier springs 31 which press the contact body 2 onto the power semiconductor H; the contact body 2 and the plurality of electrically-conductive two-tier springs 31 are separate bodies, and the plurality of electrically-conductive two-tier springs 31 electrify the contact body 2 while providing pressing force F to each of a plurality of sections of the contact body 2.
    Type: Application
    Filed: July 5, 2013
    Publication date: January 16, 2014
    Inventors: Shigeto Akahori, Hiroyuki Yamagishi, Satoshi Hasegawa, Yoko Yamaji, Nobuo Kambara, Shinyu Hirayama
  • Patent number: 8583994
    Abstract: Disclosed herein is a coding apparatus handling quasi-cyclic codes in which a given code word cyclically shifted by p symbols provides another code word, wherein parallel processing is executed in units of mp (a multiple of p) symbols; mp generator polynomials are used; and the generator polynomials gj(x) are selected such that a coefficient of degree deg(gi(x)) of x becomes zero for all gi(x) lower in degree than that and circuits in which these generator polynomials gj(x) are combined are connected with each other.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: November 12, 2013
    Assignee: Sony Corporation
    Inventor: Hiroyuki Yamagishi
  • Publication number: 20130205049
    Abstract: A signal processing device includes: signal processing circuits. The signal processing circuit includes an input/output circuit configured by an input circuit serving as an input interface of a signal of a predetermined frequency band and/or an output circuit serving as an output interface of a signal of the frequency band and performs transmission of a signal of the frequency band between the signal processing circuit and another signal processing circuit. The output circuits of one and another signal processing circuits include circuits having the same configuration. The input circuits of the one and another signal processing circuits include other circuits having the same configurations. The input/output circuits of the one and another signal processing circuits can perform transmission of a signal of the predetermined frequency band even when any one of transmission media having mutually different characteristics is mediated.
    Type: Application
    Filed: February 8, 2012
    Publication date: August 8, 2013
    Applicant: SONY CORPORATION
    Inventors: Kenichi Kawasaki, Yusuke Tanaka, Hiroyuki Yamagishi, Ali Hajimiri
  • Patent number: 8327251
    Abstract: A transmission apparatus includes: a CRC encoding processing unit configured to include a plurality of generating polynomials for an CRC encoding processing with each of a plurality of data of which the code lengths differ as a target, and employ the optimal generating polynomial out of the plurality of generating polynomials to perform the CRC encoding processing; and a transmission unit configured to transmit data obtained by the CRC encoding processing unit performing the CRC encoding processing.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: December 4, 2012
    Assignee: Sony Corporation
    Inventors: Masashi Shinagawa, Makoto Noda, Hiroyuki Yamagishi, Keitarou Kondou
  • Publication number: 20120173954
    Abstract: A decoding device includes: a determination unit that determines whether or not a decoding ending condition is satisfied at an interval shorter than an interval of one decoding process in repeated decoding and ends the process in the middle of the one decoding process in a case where the decoding ending condition is satisfied.
    Type: Application
    Filed: January 25, 2012
    Publication date: July 5, 2012
    Applicant: Sony Corporation
    Inventor: Hiroyuki Yamagishi