Patents by Inventor Hiroyuki Yamagishi

Hiroyuki Yamagishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10781837
    Abstract: A joint structure comprises a light-absorbable member having at least one opening portion and a light-permeable member superposed on the light-absorbable member so as to cover the opening portion, wherein an annular weld part is formed so as to enclose the opening portion and join the light-absorbable member and the light-permeable member, and the light-permeable member is formed into a thin sheet adhering to the light-absorbable member by deforming at a depressurized state of an interior of the opening portion before the formation of the annular weld part.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: September 22, 2020
    Assignee: FUJIKURA, LTD.
    Inventor: Hiroyuki Yamagishi
  • Patent number: 10781836
    Abstract: A joint structure comprises a light-absorbable member having at least one opening portion and a light-permeable member superposed on the light-absorbable member so as to cover the opening portion, wherein a first annular weld part is formed so as to enclose the opening portion and join the light-absorbable member and the light-permeable member, and a second dot-like weld part(s) joining the light-absorbable member and the light-permeable member is/are formed in a position adjacent to the first weld part.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: September 22, 2020
    Assignee: FUJIKURA, LTD.
    Inventor: Hiroyuki Yamagishi
  • Patent number: 10511465
    Abstract: The present technology relates to a transmitter, a transmission method, a receiver, and a reception method that can keep upsizing and cost increase to a minimum. The transmitter and the receiver have a detection mode and a communication mode as operation modes. The detection mode detects contact between a first waveguide on the side of the transmitter and a second waveguide on the side of the receiver. The communication mode sends or receives a modulated signal, acquired through frequency conversion of a baseband signal, via the first and second waveguides. The transmitter sends a given signal to the first waveguide in the detection mode. The transmitter and the receiver go from the detection mode to the communication mode in response to a given signal received by the receiver via the second waveguide and send and receive the modulated signal via the first and second waveguides in the communication mode.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: December 17, 2019
    Assignee: SONY CORPORATION
    Inventors: Kenichi Kawasaki, Hiroyuki Yamagishi, Takahiro Takeda
  • Publication number: 20190296379
    Abstract: Provided is a method for inspecting a current leak of a fuel cell, which is provided with an anode electrode, a cathode electrode, and an electrolyte membrane sandwiched between the anode electrode and the cathode electrode, the method including: a first process in which a first voltage, which is a limit voltage of the electrolyte membrane, is applied to the fuel cell; a second process in which a second voltage, which is lower than the first voltage, is applied to the fuel cell after the first process; a third process in which a third voltage, which is lower than the second voltage, is applied to the fuel cell after the second process; and a determination process in which a value of a current flowing through the fuel cell in the third process is detected, and whether the detected current value is lower than a prescribed current value is determined.
    Type: Application
    Filed: February 28, 2019
    Publication date: September 26, 2019
    Inventors: Masaaki Kishimoto, Hiroyuki Yamagishi, Hiroshi Sakai
  • Publication number: 20190239773
    Abstract: [Object] To provide a signal processing device capable of distinguishing and measuring a plurality of measurement targets even with simple configuration. [Solution] Provided is a signal processing device including: a reception processing unit configured to receive a response to a predetermined signal transmitted from a transmission antenna; and a determination unit configured to determine the plurality of measurement targets by a response to a plurality of signals corresponding to a second direction having a predetermined range different from a first direction having a predetermined range.
    Type: Application
    Filed: October 11, 2017
    Publication date: August 8, 2019
    Inventors: SHIGENORI UCHIDA, KENICHI KAWASAKI, HIROYUKI YAMAGISHI
  • Patent number: 10374279
    Abstract: A connector device according to the present disclosure includes a first connector section and a second connector section. The first connector section includes a waveguide for transmitting a high-frequency signal. The second connector section includes a waveguide for transmitting a high-frequency signal, a yoke disposed to cover the waveguide, and a magnet forming a magnetic circuit with the yoke, and is couplable to the first connector section by the attractive force of the magnet. A communication system according to the present disclosure includes two communication devices and a connector device. The connector device has the above-described configuration and transmits a high-frequency signal between the two communication devices.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: August 6, 2019
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Isao Matsumoto, Takayuki Mogi, Kenichi Kawasaki, Tetsuya Makita, Tatsuhito Aono, Yu Shigeta, Shintaro Nonaka, Takahiro Takeda, Yasuhiro Okada, Hiroyuki Yamagishi
  • Publication number: 20190219669
    Abstract: [Object] To provide a signal processing device capable of enabling phase detection and achieving enhanced azimuth resolution with a small number of antenna elements. [Solution] There is provided a signal processing device including: a matrix generation unit configured to generate a matrix by multiplying a received signal vector of a reception signal by a transpose vector of the received signal vector, the reception signal being received by a reception array antenna including a plurality of reception antennas; and an estimation unit configured to estimate at least a phase of the reception signal on a basis of the matrix.
    Type: Application
    Filed: May 17, 2017
    Publication date: July 18, 2019
    Inventors: Sachio Iida, Kenichi Kawasaki, Hiroyuki Yamagishi
  • Patent number: 10298729
    Abstract: A connector is formed by fixing two or more connector parts each made from a resin to each other by press fitting or with an adhesive. At least one weld part regulating thermal deformation between the connector parts is formed in a boundary portion between the adjoining connector parts.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: May 21, 2019
    Assignee: FUJIKURA, LTD.
    Inventor: Hiroyuki Yamagishi
  • Publication number: 20190013975
    Abstract: The present technology relates to a transmitter, a transmission method, a receiver, and a reception method, and particularly to a transmitter, a transmission method, a receiver, and a reception method that can keep upsizing and cost increase to a minimum. The transmitter and the receiver have a detection mode and a communication mode as operation modes. The detection mode detects contact between a first waveguide on the side of the transmitter and a second waveguide on the side of the receiver. The communication mode sends or receives a modulated signal, acquired through frequency conversion of a baseband signal, via the first and second waveguides. The transmitter sends a given signal to the first waveguide in the detection mode. The transmitter and the receiver go from the detection mode to the communication mode in response to a given signal received by the receiver via the second waveguide and send and receive the modulated signal via the first and second waveguides in the communication mode.
    Type: Application
    Filed: January 4, 2017
    Publication date: January 10, 2019
    Inventors: KENICHI KAWASAKI, HIROYUKI YAMAGISHI, TAKAHIRO TAKEDA
  • Publication number: 20190013563
    Abstract: The present disclosure relates to a connector module, a communication circuit board, and an electronic device that are capable of satisfactorily suppressing the leakage of high-frequency electromagnetic waves. The connector module includes an opening and a conductive spring. The opening accepts the insertion of an end of a waveguide that transmits high-frequency electromagnetic waves. The conductive spring locks the waveguide when the waveguide inserted into the opening is pressed toward one inner side surface of the opening. Further, the conductive spring is disposed in a gap between the opening and the waveguide so as to come into contact with the opening and with the waveguide along a direction in which the waveguide transmits the electromagnetic waves. The present technology is applicable, for example, to an electronic device that establishes communication by using millimeter waves.
    Type: Application
    Filed: January 6, 2017
    Publication date: January 10, 2019
    Applicant: Sony Corporation
    Inventors: Takahiro TAKEDA, Yasuhiro OKADA, Hiroyuki YAMAGISHI, Kenichi KAWASAKI
  • Publication number: 20180264597
    Abstract: A laser processing apparatus 10 includes a continuous-wave laser oscillator 12 for generating a continuous-wave laser beam, a condenser lens 18 for concentrating a continuous-wave laser beam onto a workpiece, and a delay time setting means for calculating an energy value for each processing by a continuous-wave laser beam irradiation on the basis of processing data and accumulating the calculated energy value, and setting a predetermined delay time between the processings when the accumulated energy value exceeds a predetermined threshold.
    Type: Application
    Filed: March 16, 2018
    Publication date: September 20, 2018
    Inventors: Hiroyuki YAMAGISHI, Toshitaka NAMBA
  • Publication number: 20180103133
    Abstract: A connector is formed by fixing two or more connector parts each made from a resin to each other by press fitting or with an adhesive. At least one weld part regulating thermal deformation between the connector parts is formed in a boundary portion between the adjoining connector parts.
    Type: Application
    Filed: October 4, 2017
    Publication date: April 12, 2018
    Inventor: Hiroyuki YAMAGISHI
  • Publication number: 20180093423
    Abstract: A joint structure comprises a light-absorbable member having at least one opening portion and a light-permeable member superposed on the light-absorbable member so as to cover the opening portion, wherein an annular weld part is formed so as to enclose the opening portion and join the light-absorbable member and the light-permeable member, and the light-permeable member is formed into a thin sheet adhering to the light-absorbable member by deforming at a depressurized state of an interior of the opening portion before the formation of the annular weld part.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 5, 2018
    Inventor: Hiroyuki YAMAGISHI
  • Publication number: 20180093346
    Abstract: A joint structure comprising a light-absorbable member having at least one opening portion and a light-permeable member superposed on the light-absorbable member so as to cover the opening portion, wherein an annular weld part is formed so as to enclose the opening portion and join the light-absorbable member and the light-permeable member, and an area ratio of a portion at the side of the light-absorbable member to a portion at the side of the light-permeable member side is in a range of 12-35 viewing a section perpendicular to the extending direction of the annular weld part.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 5, 2018
    Inventor: Hiroyuki YAMAGISHI
  • Publication number: 20180093345
    Abstract: A joint structure comprises a light-absorbable member having at least one opening portion and a light-permeable member superposed on the light-absorbable member so as to cover the opening portion, wherein a first annular weld part is formed so as to enclose the opening portion and join the light-absorbable member and the light-permeable member, and a second dot-like weld part(s) joining the light-absorbable member and the light-permeable member is/are formed in a position adjacent to the first weld part.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 5, 2018
    Inventor: Hiroyuki YAMAGISHI
  • Publication number: 20180076501
    Abstract: A connector device according to the present disclosure includes a first connector section and a second connector section. The first connector section includes a waveguide for transmitting a high-frequency signal. The second connector section includes a waveguide for transmitting a high-frequency signal, a yoke disposed to cover the waveguide, and a magnet forming a magnetic circuit with the yoke, and is couplable to the first connector section by the attractive force of the magnet. A communication system according to the present disclosure includes two communication devices and a connector device. The connector device has the above-described configuration and transmits a high-frequency signal between the two communication devices.
    Type: Application
    Filed: January 19, 2016
    Publication date: March 15, 2018
    Inventors: ISAO MATSUMOTO, TAKAYUKI MOGI, KENICHI KAWASAKI, TETSUYA MAKITA, TATSUHITO AONO, YU SHIGETA, SHINTARO NONAKA, TAKAHIRO TAKEDA, YASUHIRO OKADA, HIROYUKI YAMAGISHI
  • Patent number: 9632110
    Abstract: A semiconductor inspection device (1) equipped with a contacting unit (7) having a contacting side surface (7a) electrically contacting a semiconductor element (3), and which inspects the semiconductor element (3) by making the contacting unit (7) electrically contact the semiconductor element (3). The contacting side surface (7a) is provided with a plurality of projecting units (13), and the semiconductor element inspection device (1) is equipped with a hitting mark detecting unit (11) configured to detect hitting marks of the projecting unit (13) transferred to the semiconductor element (3) when the contacting side surface (7a) contacts the semiconductor element (3), and a control unit (17) configured to determine whether or not an inspection of the semiconductor element (3) is performed appropriately, on the basis of the hitting marks detected by the hitting mark detecting unit (11).
    Type: Grant
    Filed: August 14, 2013
    Date of Patent: April 25, 2017
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigeto Akahori, Shinyu Hirayama, Hiroyuki Yamagishi, Yoko Yamaji
  • Patent number: 9417264
    Abstract: Provided are a current application device capable of improving the electrical contact between projections of a contact section and a surface electrode when applying a test current to a semiconductor element, and a method of manufacturing a semiconductor element properly tested by using the current application device. The current application device includes a contact section that has a plurality of projections, which are brought into contact with a surface electrode of a semiconductor element to apply a test current, and a pressing section that presses the contact section against the semiconductor element such that the projections penetrate a film to come in contact with the surface electrode. The contact section has a plurality of the projections on a plane that has been formed in a curved shape, and the curved-shaped plane is deformed into a planar shape by being pressed by the pressing section.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: August 16, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigeto Akahori, Hitoshi Saito, Hiroyuki Yamagishi, Shinyu Hirayama, Satoshi Hasegawa, Yoko Yamaji, Koichiro Sato, Machie Saitou
  • Patent number: 9291643
    Abstract: A current applying device is provided in which a contact body which surface-contacts with an inspection target body makes contact with the surface of the inspection target body uniformly; current can be favorably applied from the contact body to the inspection target body; and the contact body alone can be replaced. A probe device 1 for applying current by being in pressure-contact with the power semiconductor H includes: a contact body 2 which surface-contacts with the power semiconductor H; and a plurality of electrically-conductive two-tier springs 31 which press the contact body 2 onto the power semiconductor H; the contact body 2 and the plurality of electrically-conductive two-tier springs 31 are separate bodies, and the plurality of electrically-conductive two-tier springs 31 electrify the contact body 2 while providing pressing force F to each of a plurality of sections of the contact body 2.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: March 22, 2016
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigeto Akahori, Hiroyuki Yamagishi, Satoshi Hasegawa, Yoko Yamaji, Nobuo Kambara, Shinyu Hirayama
  • Patent number: 9253387
    Abstract: There is provided a camera module including: a lens; an image pickup device arranged on an optical axis of the lens; and an actuator section configured to reciprocate the image pickup device in an optical axis direction of the lens, wherein the actuator section includes a movable joint section on which the image pickup device is fixed, a parallel link mechanism section having a movable end section attached to the movable joint section and a mounting end section, and a movable element that is configured to perform displacement motion by a displacement amount depending on a level of a voltage to be applied and that is coupled to a coupling region between the movable joint section and the movable end section of the parallel link mechanism section in such a manner that the displacement motion is transmittable.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: February 2, 2016
    Assignee: SONY CORPORATION
    Inventors: Toshihiro Furusawa, Yoshihito Higashitsutsumi, Yoshiteru Kamatani, Yukihisa Kinugasa, Hideo Kawabe, Takehisa Ishida, Yusaku Kato, Nobuyuki Nagai, Masayoshi Morita, Hiroyuki Yamagishi