Patents by Inventor Hisashi Nakamura

Hisashi Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5462032
    Abstract: A fuel injection timing control device includes a lift sensor for detecting a lift amount of a needle valve of a fuel injection nozzle, rectangular wave conversion means for converting an output signal of the lift sensor to a rectangular wave with a predetermined threshold level, and ignition point calculating means for calculating a timing for actual fuel ignition on the basis of the converted rectangular wave in accordance with a driving condition of the internal combustion engine, wherein the fuel injection control is performed on the basis of the calculated ignition timing.
    Type: Grant
    Filed: August 30, 1994
    Date of Patent: October 31, 1995
    Assignee: Zexel Corporation
    Inventor: Hisashi Nakamura
  • Patent number: 5426613
    Abstract: A semiconductor memory device is provided which includes a substrate arrangement which is suitable for forming a large number of types of DRAMs having different package specifications, different bit structure and different operating modes. In conjunction with this, the bonding pads are arranged at optimum locations for accommodating the different package types. Various layout arrangements are also provided to minimize space and to improve access time. Additional features are provided, including improved output buffer circuitry, protection circuitry and testing methods to facilitate operation of the semiconductor memory device.
    Type: Grant
    Filed: November 6, 1992
    Date of Patent: June 20, 1995
    Assignees: Hitachi, Ltd., Hitachi VLSI Engineering Corp.
    Inventors: Yasushi Takahashi, Hidetoshi Iwai, Satoshi Oguchi, Hisashi Nakamura, Hiroyuki Uchiyama, Toshitugu Takekuma, Shigetoshi Sakomura, Kazuyuki Miyazawa, Masamichi Ishihara, Ryoichi Hori, Takeshi Kizaki, Yoshihisa Koyama, Haruo Ii, Masaya Muranaka, Hidetomo Aoyagi, Hiromi Matsuura
  • Patent number: 5410269
    Abstract: A sample-and-hold circuit, capable of charging and discharging its holding capacitor quickly regardless of a voltage of an analog input signal and an output impedance of an analog driving source, includes a pre-sampling capacitor and at least one CMOS inverter. Before the holding capacitor holds the sampled signal, the pre-sampling capacitor stores the signal level of the analog input signal, and then the CMOS inverter charges and discharges the one side of the holding capacitor according to the stored voltage in the pre-sampling capacitor. Since the one side of the holding capacitor is charged and discharged by the CMOS inverter thus controlled, the sample-and-hold circuit can operate with high speed and handle a wide range of the analog input signal.
    Type: Grant
    Filed: May 18, 1993
    Date of Patent: April 25, 1995
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Mitsuya Ohie, Hisashi Nakamura
  • Patent number: 5309011
    Abstract: To achieve higher packaging density and one wafer level for a full-sized wafer memory, or wafer-scale integration memory system, the wafers are vertically stacked with each other at a predetermined interval. A packaging technique is improved in such a way that a memory system layout can be precisely realized and a precise through hole can be formed. Moreover, other chips are fixed on the wafer so as to achieve furthermore the high packaging density.
    Type: Grant
    Filed: October 14, 1992
    Date of Patent: May 3, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Masanori Tazunoki, Hiromitsu Mishimagi, Makoto Homma, Toshiyuki Sakuta, Hisashi Nakamura, Keiji Sasaki, Minoru Enomoto, Toshihiko Satoh, Kunizo Sahara, Shigeo Kuroda, Kanji Otsuka, Masao Kawamura, Hinoko Kurosawa, Kazuya Ito
  • Patent number: 5303512
    Abstract: A method and apparatus for grinding a cylindrical surface of a workpiece by a traverse movement of a grinding wheel having a relatively narrow grinding surface. To improve the cylindricity of cylindrical surface, the traverse grinding is divided into a rough traverse grinding and a finish traverse grinding. In the rough traverse grinding, a traverse girding is carried out with a large depth of cut which would causes a deterioration of the cylindricity at one end of the cylindrical surface. In the finish traverse grinding, a traverse girding is carried out with a small depth of cut to improve the cylindricity. In another embodiment, one of grinding conditions such as the traverse speed of the grinding wheel, the rotational speed of the workpiece and the peripheral speed of the grinding wheel is changed when the grinding wheel approaches an end of the cylindrical surface at which the traverse grinding ends so as to make the grinding force constant, thereby improving the cylindricity of the cylindrical surface.
    Type: Grant
    Filed: June 23, 1992
    Date of Patent: April 19, 1994
    Assignee: Toyoda Koki Kabushiki Kaisha
    Inventors: Toshio Tsujiuchi, Tomoyasu Imai, Norio Ohta, Yukio Oda, Ryohei Mukai, Hisashi Nakamura, Takayuki Yoshimi
  • Patent number: 5264712
    Abstract: A semiconductor integrated circuit comprising first n-channel MISFETs constituting the memory cells of a storage system, second n-channel MISFETs constituting the peripheral circuits of the storage system, and third n-channel MISFETs constituting the output circuit among the peripheral circuits. The respective threshold voltages of the first n-channel MISFETs, the second n-channel MISFETs and the third n-channel MISFETs are decreased in that order when the respective gate lengths of those MISFETs are substantially the same.
    Type: Grant
    Filed: May 7, 1992
    Date of Patent: November 23, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Jun Murata, Yoshitaka Tadaki, Hiroko Kaneko, Toshihiro Sekiguchi, Hiroyuki Uchiyama, Hisashi Nakamura, Toshio Maeda, Osamu Kasahara, Hiromichi Enami, Atsushi Ogishima, Masaki Nagao, Michimasa Funabashi, Yasuo Kiguchi, Masayuki Kojima, Atsuyoshi Koike, Hiroyuki Miyazawa, Masato Sadaoka, Kazuya Kadota, Tadashi Chikahara, Kazuo Nojiri, Yutaka Kobayashi
  • Patent number: 5228241
    Abstract: A machine for grinding a cylindrical surface and the end surface of a shoulder portion, both formed on a workpiece, using an angular grinding wheel. The end surface is perpendicular to the cylindrical surface. The grinding wheel has a first outer surface parallel to the axis of the workpiece and a second outer surface perpendicular to the first outer surface. The first outer surface has a cylinder-grinding parallel surface and a cylinder-grinding tilted surface. The parallel surface has a generatrix parallel to the generatrix of the cylindrical surface to be ground. The tilted surface is continuous with the parallel surface and has a generatrix tilted away from the generatrix of the cylindrical surface. The second outer surface has a shoulder-grinding parallel surface and a shoulder-grinding tilted surface continuous with this parallel surface. The shoulder-grinding parallel surface has a generatrix parallel to the end surface of the shoulder portion.
    Type: Grant
    Filed: September 17, 1991
    Date of Patent: July 20, 1993
    Assignee: Toyoda Koki Kabushiki Kaisha
    Inventors: Norio Ohta, Yukio Oda, Hisashi Nakamura, Toshiaki Naya
  • Patent number: 5217917
    Abstract: A semiconductor memory device is provided which includes a substrate arrangement which is suitable for forming a large number of types of DRAMs having different package specifications, different bit structure and different operating modes. In conjunction with this, the bonding pads are arranged at optimum locations for accommodating the different package types. Various layout arrangements are also provided to minimize space and to improve access time. Additional features are provided, including improved output buffer circuitry, protection circuitry and testing methods to facilitate operation of the semiconductor memory device.
    Type: Grant
    Filed: March 20, 1990
    Date of Patent: June 8, 1993
    Assignees: Hitachi, Ltd., Hitachi VLSI Engineering Corp.
    Inventors: Yasushi Takahashi, Hidetoshi Iwai, Satoshi Oguchi, Hisashi Nakamura, Hiroyuki Uchiyama, Toshitugu Takemuma, Shigetoshi Sakomura, Kazuyuki Miyazawa, Masamichi Ishihara, Ryoichi Hori, Takeshi Kizaki, Yoshihisa Koyama, Haruo Ii, Masaya Muranaka, Hidetomo Aoyagi, Hiromi Matsuura
  • Patent number: 5208782
    Abstract: A semiconductor integrated circuit memory structure is provided which uses macro-cellulated circuit blocks that can permit a very large storage capability (for example, on the order of 64 Mbits in a DRAM) on a single chip. To achieve, this, a plurality of macro-cellulated memory blocks can be provided, with each of the memory blocks including a memory array as well as additional circuitry such as address selection circuits and input/output circuits. Other peripheral circuits are provided on the chip which are common to the plurality of macro-cell memory blocks. The macro-cell memory blocks themselves can be formed in an array so that their combined storage capacity will form the large overall storage capacity of the chip. The combination of the macro-cell memory blocks and the common peripheral circuitry for controlling the memory blocks permits a faster and more efficient refreshing operation for a DRAM. This is enhanced by a LOC (Lead On Chip) arrangement used in conjunction with the memory blocks.
    Type: Grant
    Filed: May 29, 1992
    Date of Patent: May 4, 1993
    Assignees: Hitachi, Ltd., Hitachi Vlsi Engineering Corp.
    Inventors: Toshiyuki Sakuta, Masamichi Ishihara, Kazuyuki Miyazawa, Masanori Tazunoki, Hidetoshi Iwai, Hisashi Nakamura, Yasushi Takahashi, Toshio Maeda, Hiromi Matsuura, Ryoichi Hori, Toshio Sasaki, Osamu Sakai, Hiroyuki Uchiyama, Eiji Miyamoto, Kazuyoshi Oshima, Yasuhiro Kasama
  • Patent number: 5191224
    Abstract: To achieve higher packaging density and one wafer level for a full-sized wafer memory, or wafer-scale integration memory system, the wafers are vertically stacked with each other at a predetermined interval. A packaging technique is improved in such a way that a memory system layout can be precisely realized and a precise through hole can be formed. Moreover, other chips are fixed on the wafer so as to achieve furthermore the high packaging density.
    Type: Grant
    Filed: December 13, 1990
    Date of Patent: March 2, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Masanori Tazunoki, Hiromitsu Mishimagi, Makoto Homma, Toshiyuki Sakuta, Hisashi Nakamura, Keiji Sasaki, Minoru Enomoto, Toshihiko Satoh, Kunizo Sahara, Shigeo Kuroda, Kanji Otsuka, Masao Kawamura, Hinoko Kurosawa, Kazuya Ito
  • Patent number: 5165851
    Abstract: There is disclosed an improved cam for a fuel injection pump. The cam has a mountain-like cam projection at its surface disposed in contact with a roller. The cam projection has a lift region extending from a leading end thereof to a peak thereof. At the lift region, the cam is lifted in response to the rotation of the cam, so that a plunger is moved to pressurize fuel in a pump chamber. The lift region has first, second and third angle portions arranged in this order from the leading end of the cam projection toward the peak of the cam projection. The first angle portion serves to increase a lift speed of the cam, and terminates in a position where the lift speed becomes the maximum. The second angle portion serves to lower the lift speed. The deceleration is greater at an initial section of the second angle portion than at a final portion of the second angle portion.
    Type: Grant
    Filed: April 18, 1991
    Date of Patent: November 24, 1992
    Assignee: Zexel Corporation
    Inventors: Kenichi Kubo, Hisashi Nakamura, Akira Kunishima, Fumitsugu Yoshizu
  • Patent number: 5160944
    Abstract: A thermal printer includes a platen roller on which a recording sheet is wound in such a manner that the recording sheet is laid over a part of the cylindrical wall of the platen roller. A thermal head is pushed against the platen roller to heat heating points selected for transferring ink from an ink sheet onto the recording sheet. A sheet pulling means pulls the recording sheet in a predetermined direction. A pinch roller on the sheet supplying side pushes the recording sheet against the platen roller with a predetermined force of depression so that the recording sheet is wound on the platen roller. A pinch roller rotating means is provided at at least one end of the pinch roller for rotating the pinch roller at a peripheral speed lower than that of the platen roller.
    Type: Grant
    Filed: April 11, 1991
    Date of Patent: November 3, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroshi Fukumoto, Koji Namura, Hisashi Nakamura, Keiichi Fukazawa, Kenichi Naruki
  • Patent number: 5155694
    Abstract: An apparatus for measuring groove positions of a workpiece includes a sensor for detecting grooves formed on the workpiece and a position sensor for detecting angular position of the workpiece with respect to a predetermined standard position, a measuring cycle memory means for storing several predetermined measuring cycles, a data input means for imputting and storing groove data indicating groove shape, a measuring control means for selecting a specific measurement cycle from the measurement cycle memory means based on the groove data to execute selected measurement cycle, a calculation processing means for executing calculation processing for determining the center positions of grooves, and a data output means for outputting and displaying the results of the calculations in order to inform an operator of the center positions of the grooves.
    Type: Grant
    Filed: October 30, 1990
    Date of Patent: October 13, 1992
    Assignee: Toyoda Koki Kabushiki Kaisha
    Inventors: Takao Yoneda, Norio Ohta, Hiroshi Nakano, Hisashi Nakamura, Yasuyuki Sato
  • Patent number: 5125802
    Abstract: A fuel injection timing control apparatus for a distributor type fuel injection pump which enables the advantages of a servo valve arrangement provided in a timing piston to be utilized with the servo valve being disposed on the timing piston high-pressure chamber side. The fuel injection apparatus can be applied to engines with parts on the timer low-pressure chamber side without this causing interference, because the servo valve and any control mechanism are provided on the high-pressure chamber side.
    Type: Grant
    Filed: November 19, 1990
    Date of Patent: June 30, 1992
    Assignee: Zexel Corporation
    Inventors: Hisashi Nakamura, Satoru Ito
  • Patent number: 5115783
    Abstract: A method for varying the flow rate of fuel in a distributor-type electronic control fuel-injection pump. A single solenoid valve is used to control the timing of initiating and terminating fuel delivery. A cam is operated under four different modes, a low idle or a low speed/low load zone, a middle load zone, a high load zone, and a governing or high idle zone in that order as the cam is rotated. At the governing or high idle zone, the solenoid valve is closed before the cam is lifted and is opened to control fuel delivery when it is terminated.
    Type: Grant
    Filed: December 19, 1990
    Date of Patent: May 26, 1992
    Assignee: Zexel Corporation
    Inventors: Hisashi Nakamura, Kenichi Kubo, Takashi Ohishi, Hosokawa Hitoshi
  • Patent number: 5100608
    Abstract: In-core nuclear instrumentation for a fast breeder reactor includes a neutron flux measuring unit disposed in a control rod assembly, whereby it is possible to measure a change in in-core neutron flux reliably and highly accurately without requiring a major modification in core design.
    Type: Grant
    Filed: March 23, 1990
    Date of Patent: March 31, 1992
    Assignee: Doryokuro Kakunenryo Kaihatsu Jigyodan
    Inventors: Mamoru Konomura, Hisashi Nakamura
  • Patent number: 5013519
    Abstract: An autonomous, decentralized fast breeder reactor includes a single reactor main vessel which houses a plurality of small-size reactor subsystems each having a small-scale fast breeder reactor core, and a plurality steam generator subsystems. These subsystems function in an autonomous manner and are caused to undergo a heat transfer with one another by a coolant circulating naturally through the interior of the main vessel, thereby constructing a cooperatively operating system. Steam generated by the steam generators is introduced to a turbine system and utilized in generating electricity. The condensate from the turbines is cooled by a heat accumulating pool, and the heat is utilized in a separate system. The entire system is installed underground and use is made of the difference in elevation. Use also is made of solid bedrock to construct a housing facility for the reactor.
    Type: Grant
    Filed: January 30, 1990
    Date of Patent: May 7, 1991
    Assignee: Doryokuro Kakunenryo Kaihatsu Jigyodan
    Inventors: Hisashi Nakamura, Hideo Sakaba, Kunihiko Yokoyama, Hitoshi Hayashida, Toshio Yatabe, Makinori Ikeda, Hiroaki Ohhira, Naoyuki Kisohara, Minoru Gunji, Satoru Nakai, Akira Ohtaki
  • Patent number: 5000668
    Abstract: In a distribution-type fuel injection pump, a fuel supply passageway, through which a feed pump and a fuel pressurizing chamber communicate with each other, is isolated from a cam chamber and bypasses the same. In order to simplify the construction, the fuel supply passageway is formed in a peripheral wall portion of a housing. On the other hand, a cam mechanism comprises a spring assembly including at least one spring, first and second annular spring seats and an engaging member. The first spring seat has an annular base section and an extension extending from a peripheral edge of the base section toward the second spring seat. The engaging member is fixedly mounted to a forward end of the extension. Prior to incorporation the spring assembly into a hollow body of the housing, the spring assembly is in a state in which the peripheral edge of the second spring seat is engaged with the engaging member under elastic force of the spring.
    Type: Grant
    Filed: April 11, 1989
    Date of Patent: March 19, 1991
    Assignee: Diesel Kiki Co., Ltd.
    Inventors: Hisashi Nakamura, Toshiro Hirakawa, Ken-ichi Kubo
  • Patent number: D340741
    Type: Grant
    Filed: September 6, 1991
    Date of Patent: October 26, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Midori Yonezawa, Masaharu Sawatani, Hisashi Nakamura
  • Patent number: D344285
    Type: Grant
    Filed: September 6, 1991
    Date of Patent: February 15, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Midori Yonezawa, Masaharu Sawatani, Hisashi Nakamura