Patents by Inventor Hisashi Shimizu

Hisashi Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190256780
    Abstract: Disclosed is a flame-retardant synthetic resin composition containing: 20 to 50 parts by mass of at least one melamine salt selected from the group consisting of melamine orthophosphate, melamine pyrophosphate, and melamine polyphosphate (component (A)); 50 to 80 parts by mass of at least one piperazine salt selected from the group consisting of piperazine orthophosphate, piperazine pyrophosphate, and piperazine polyphosphate (component (B)), provided that the sum of components (A) and (B) is 100 parts by mass; and 1 to 50 parts by mass of a compound represented by general formula (1) (component (C)): wherein R1 represents an aliphatic or aromatic monocarboxylic acid residue.
    Type: Application
    Filed: June 5, 2017
    Publication date: August 22, 2019
    Inventors: Yang NI, Hisashi SAKURAI, Tatsuya SHIMIZU, Yutaka YONEZAWA, Naoko TANJI
  • Patent number: 10343938
    Abstract: A magnetic separation device includes magnetic separation units in each of which a flow direction of raw water in a separation vessel is set to the same direction as a rotation direction of a magnetic drum. In the left-side magnetic separation unit, a raw water feeding channel is connected to the left side of the separation vessel, so that the raw water flows from left to right in the separation vessel and the treated water flows out of a discharge channel. The magnetic drum rotates in a counter clockwise direction. In the right-side magnetic separation unit, the raw water feeding channel is connected to the right side of the separation vessel, so that the raw water flows from right to left in the separation vessel and the treated water flows out of the discharge channel. The magnetic drum also rotates in the clockwise direction.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: July 9, 2019
    Assignee: HITACHI, LTD.
    Inventors: Manabu Yamada, Kazutaka Fukumoto, Hiroyoshi Shimizu, Kei Hayashida, Hisashi Isogami
  • Patent number: 10347734
    Abstract: A semiconductor device includes a nitride semiconductor layer, a first electrode and second electrode on the nitride semiconductor layer, a gate electrode, and a gate insulating layer between the nitride semiconductor layer and the gate electrode. The gate insulating layer has a first oxide region containing at least any one element of aluminum and boron, gallium, and silicon. When a distance between the first end portion and the second end portion of the first oxide region is defined as d1, and a position separated by d1/10 from the first end portion toward the second end portion is defined as a first position, an atomic concentration of gallium at the first position is 80% or more and 120% or less of that of the at least any one element.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: July 9, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tatsuo Shimizu, Hisashi Saito, Hiroshi Ono, Toshiya Yonehara
  • Publication number: 20190200841
    Abstract: Disclosed herein is useful as a stored object detector and a method of detecting stored objects configured to capture an image a movable storage portion, and objects stored in the storage portion, and configured to acquire storage information including at least one of position, size and quantity of the stored object based on the captured image. In addition, disclosed herein is a dishwasher configured to identify at least storage area of dish stored in a dish storage basket. It is possible to estimate a position of a basket, although the number of feature points is small. Therefore, when installing a detection indicator corresponding to the feature point, which is separated from the general configuration, to the basket, it is not required to install a large number of detection indicator, and thus it is possible to improve the appearance of the dishwasher.
    Type: Application
    Filed: August 31, 2017
    Publication date: July 4, 2019
    Inventors: Morio YOSHIMOTO, Katsunori ARAKI, Hisashi KAWASAKI, Toshihiro KAMII, Kazuo SHIMIZU
  • Publication number: 20190195255
    Abstract: The accessory attachment structure for attaching an accessory to a steel plate-reinforced concrete structure, the steel plate-reinforced concrete structure being provided with a steel plate frame, bars fixedly installed on an inner face of an outside steel plate, and concrete, the accessory attachment structure includes an attachment plate in which one face thereof is attached to the outside steel plate and the accessory is attached to the other face thereof. The size of the other face of the attachment plate is larger than that of a whole attachment face to be attached to the attachment plate of the accessory, the size if the one face is equal to or greater than the other face, and the length of the attachment plate in any direction along the one face of the attachment plate is at least two times greater than a mutual interval between the bars.
    Type: Application
    Filed: September 9, 2011
    Publication date: June 27, 2019
    Inventors: Hiroshi Shimizu, Hiromu Okamoto, Katsumi Takagi, Takao Hagishita, Ryo Fujimoto, Hiroyuki Iseki, Hisashi Sekimoto
  • Publication number: 20190198634
    Abstract: A semiconductor device includes a semiconductor region, a gate electrode, and a first gate insulating film provided between the semiconductor region and the gate electrode and containing a material having a chemical composition expressed by (SiO2)n (Si3N4)m (wherein n and m are positive integers), in the material, at least one silicon atom being bonded with at least one oxygen atom and at least one nitrogen atom.
    Type: Application
    Filed: February 27, 2019
    Publication date: June 27, 2019
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Tatsuo SHIMIZU, Hisashi Saito
  • Publication number: 20190195466
    Abstract: A device including a phosphor layer having a plurality of air gaps arranged within the phosphor layer to block lateral light transmission. The phosphor layer can be sized and positioned to be continuously extend over a plurality of LED emitter pixels.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 27, 2019
    Applicant: Lumileds LLC
    Inventors: Kentaro SHIMIZU, Venkata Ananth TAMMA, Hisashi MASUI
  • Publication number: 20190189865
    Abstract: A wavelength converting layer is partially diced to generate a first and second wavelength converting layer segment and to allow partial isolation between the first segment and the second segment such that the wavelength converting layer segments are connected by a connecting wavelength converting layer. The first and second wavelength converting layer segments are attached to a first and second light emitting device, respectively to create a first and second pixel. The connecting wavelength converting layer segment is removed to allow complete isolation between the first pixel and the second pixel. An optical isolation material is applied to exposed surfaces of the first and second pixel and a sacrificial portion of the wavelength converting layer segments and optical isolation material attached to the sacrificial portion is removed from a surface facing away from the first light emitting device, to expose a emitting surface of the first wavelength converting layer segment.
    Type: Application
    Filed: December 19, 2018
    Publication date: June 20, 2019
    Applicant: Lumileds LLC
    Inventors: Kentaro SHIMIZU, Hisashi MASUI, Yu-Chen SHEN, Danielle Russell CHAMBERLIN, Peter Josef SCHMIDT
  • Patent number: 10319828
    Abstract: A semiconductor device according to an embodiment includes a semiconductor region, a gate electrode, and a first gate insulating film provided between the semiconductor region and the gate electrode and containing a material having a chemical composition expressed by (SiO2)n(Si3N4)m (where n and m are positive integers), in the material, at least one silicon atom being bonded with at least one oxygen atom and at least one nitrogen atom.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: June 11, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tatsuo Shimizu, Hisashi Saito
  • Patent number: 10301286
    Abstract: To provide a compound which can be used as an MC4 receptor agonist. The present inventors have investigated MC4 receptor agonists, and have found that a piperazine derivative has an action related to the agonists, thereby completing the present invention. That is, the piperazine derivative of the present invention has an MC4 receptor agonistic action, and can be used as an agent for preventing or treating bladder and/or urinary tract diseases, in particular, underactive bladder, hypotonic bladder, acontractile bladder, detrusor underactivity, neurogenic bladder, urethral relaxation failure, detrusor-external urethral sphincter dyssynergia, and voiding dysfunctions in benign prostatic hyperplasia.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: May 28, 2019
    Assignee: Astellas Pharma Inc.
    Inventors: Takashi Sugane, Takuya Makino, Daisuke Yamashita, Yasuhiro Yonetoku, Daisuke Tanabe, Hisashi Mihara, Norio Asai, Kazuhiko Osoda, Takafumi Shimizu, Hiroyuki Moritomo, Keizo Sugasawa, Kyoichi Maeno, Naomi Hosogai
  • Patent number: 10290731
    Abstract: A semiconductor device of an embodiment includes a nitride semiconductor layer, a first electrode provided on the nitride semiconductor layer, a second electrode provided on the nitride semiconductor layer, a third electrode provided above the nitride semiconductor layer, the third electrode provided between the first electrode and the second electrode, the third electrode containing a polycrystalline nitride semiconductor containing a p-type impurity, and a first insulating layer provided between the nitride semiconductor layer and the third electrode.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: May 14, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hisashi Saito, Tatsuo Shimizu
  • Patent number: 9726916
    Abstract: To provide a member bonding apparatus that can accurately position two members for bonding. Member alignment preprocessing device 15 adjusts to align one of the two members received by member receiving device 11 with another member in X and Y-axis directions so that the positions of bonding surfaces of the two members approximately correspond, adhesive application device 12 applies adhesive to a bonding surface of one of the two members approximately aligned, member alignment device 16 adjusts to align another member with one of the two members in X, Y, Z-axis and ?, ?, ?-axis directions based on images of the two members captured by a CCD camera so that positions of the bonding surfaces of the two members correspond, member bonding device 13 makes the bonding surfaces of the two members aligned be bonded to each other through the adhesive, and member delivery device 14 unloads and delivers the bonded member.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: August 8, 2017
    Assignee: Origin Electric Company, Limited
    Inventors: Koji Yamaguchi, Yutaka Matsumoto, Hisashi Shimizu, Tetsuya Okamoto
  • Publication number: 20150370098
    Abstract: To provide a member bonding apparatus that can accurately position two members for bonding. Member alignment preprocessing device 15 adjusts to align one of the two members received by member receiving device 11 with another member in X and Y-axis directions so that the positions of bonding surfaces of the two members approximately correspond, adhesive application device 12 applies adhesive to a bonding surface of one of the two members approximately aligned, member alignment device 16 adjusts to align another member with one of the two members in X, Y, Z-axis and ?, ?, ?-axis directions based on images of the two members captured by a CCD camera so that positions of the bonding surfaces of the two members correspond, member bonding device 13 makes the bonding surfaces of the two members aligned be bonded to each other through the adhesive, and member delivery device 14 unloads and delivers the bonded member.
    Type: Application
    Filed: January 28, 2014
    Publication date: December 24, 2015
    Inventors: Koji YAMAGUCHI, Yutaka MATSUMOTO, Hisashi SHIMIZU, Tetsuya OKAMOTO
  • Patent number: 8013056
    Abstract: A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: September 6, 2011
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yusuke Taguchi, Kazutoshi Tomiyoshi, Tomoyoshi Tada, Hisashi Shimizu
  • Patent number: 7563854
    Abstract: Provided is a method of producing a high molecular weight organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×104, comprising the steps of producing an organopolysiloxane by subjecting a silane compound having a hydrolyzable group to a first hydrolysis and condensation, and then subjecting that organopolysiloxane to an additional second hydrolysis and condensation. The high molecular weight organopolysiloxane is stable, resistant to gelling, and resistant to cracking even when formed as a thick film. A resin composition comprising the high molecular weight organopolysiloxane and a condensation catalyst is useful for sealing an optical element and for producing an optical semiconductor device.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: July 21, 2009
    Assignee: Shin-Estu Chemical Co., Ltd.
    Inventors: Hisashi Shimizu, Toshio Shiobara, Tsutomu Kashiwagi
  • Publication number: 20090171013
    Abstract: A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.
    Type: Application
    Filed: December 24, 2008
    Publication date: July 2, 2009
    Inventors: Yusuke TAGUCHI, Kazutoshi Tomiyoshi, Tomoyoshi Tada, Hisashi Shimizu
  • Patent number: 7550204
    Abstract: The present invention provides a composition for sealing an optical device comprising (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4?a?b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, RE to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0 b 2, and a+b satisfies 1.00 a+b 2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: June 23, 2009
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hisashi Shimizu, Toshio Shiobara, Tsutomu Kashiwagi
  • Publication number: 20090095007
    Abstract: The indoor unit comprises a body and a cover member. The body has a rear ledge. The rear ledge can be embedded in a wall. The cover member has a plurality of cover elements. The plurality of cover elements is aligned along the direction in which the rear ledge is embedded in a wall. The plurality of cover elements can be partitioned. The cover member covers at least part of the rear ledge.
    Type: Application
    Filed: December 25, 2006
    Publication date: April 16, 2009
    Applicant: Daikin Industries, Ltd.
    Inventors: Hiroshi Ohmae, Toshihiro Kizawa, Hisashi Shimizu, Kenjirou Suzuki
  • Publication number: 20080008867
    Abstract: Provided is a resin composition for sealing an optical device that has favorable curability, exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and yields a cured product that enables an improvement in the light extraction efficiency from a semiconductor light emitting element at a high refractive index. The above resin composition for sealing an optical device comprises: (A) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 3×103, represented by an average composition formula: R1a(OX)bSiO(4?a?b)/2 (wherein, each R1 represents, independently, an alkyl group of 1 to 6 carbon atoms, an alkenyl group of 2 to 6 carbon atoms, or an aryl group of 6 to 10 carbon atoms, each X represents, independently, a hydrogen atom, or an alkyl group, alkenyl group, alkoxyalkyl group or acyl group of 1 to 6 carbon atoms, a represents a number within a range from 1.00 to 1.
    Type: Application
    Filed: July 3, 2007
    Publication date: January 10, 2008
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hisashi Shimizu, Tsutomu Kashiwagi
  • Patent number: D553725
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: October 23, 2007
    Assignee: Daikin Industries Ltd.
    Inventor: Hisashi Shimizu