Patents by Inventor Hisashi Shimizu

Hisashi Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210325023
    Abstract: A device including a phosphor layer having a plurality of holes or pockets arranged within the phosphor layer to reduce lateral light transmission. The phosphor layer can be sized and positioned to extend over a plurality of LED emitter pixels.
    Type: Application
    Filed: June 30, 2021
    Publication date: October 21, 2021
    Applicant: Lumileds LLC
    Inventors: Kentaro SHIMIZU, Venkata Ananth TAMMA, Hisashi MASUI
  • Patent number: 11127887
    Abstract: A semiconductor light emitting device (100;200;300;400,400B,400C;500;600;700) may have a reflective side coating (120;220;320;420;520;620;720) disposed on a sidewall (118;215;315;415,435;515) of a semiconductor light emitting device structure. Such a device may be fabricated by dicing a semiconductor structure to separate a semiconductor light emitting device structure and then forming a reflective side coating (120;220;320;420;520;620;720) on a sidewall (118;215;315;415,435;515) of the separated semiconductor light emitting device structure.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: September 21, 2021
    Assignee: Lumileds LLC
    Inventors: Hisashi Masui, Oleg B. Shchekin, Ken Shimizu, Lex Kosowsky, Ken Davis
  • Publication number: 20210283246
    Abstract: An examination system that recognizes a glycosylated antigen in Dane particles of hepatitis B virus (HBV) and a neutralizing antibody that recognizes the glycosylated antigen and that exhibits an infection-inhibiting activity. It was elucidated that Dane particles are associated with specific glycan structures, and this enabled the construction of a new detection system for infectious, i.e., nucleic acid-containing, hepatitis B virus particles and the provision of a neutralizing antibody that recognizes a glycosylated antigen and that exhibits an infection-inhibiting activity.
    Type: Application
    Filed: June 6, 2019
    Publication date: September 16, 2021
    Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, UNIVERSITY OF TOYAMA
    Inventors: Hisashi NARIMATSU, Kiyohiko ANGATA, Hiroyuki KAJI, Atsushi KUNO, Takashi SATO, Yasunori CHIBA, Akira TOGAYACHI, Hiroki SHIMIZU, Maki SOGABE, Takanori WAGATSUMA, Masashi MIZOKAMI, Masaaki KORENAGA, Kazuto TAJIRI, Tatsuhiko OZAWA
  • Publication number: 20210193475
    Abstract: In one embodiment, a method of manufacturing a semiconductor device includes etching a film with etching gas that includes a chain hydrocarbon compound expressed as CxHyFz where C, H and F respectively denote carbon, hydrogen and fluorine, “x” denotes an integer of three or more, and “y” and “z” respectively denote integers of one or more. Furthermore, the CxHyFz is the chain hydrocarbon compound in which each of terminal carbon atoms on a carbon chain of the chain hydrocarbon compound is bonded only to fluorine atoms out of hydrogen and fluorine atoms.
    Type: Application
    Filed: March 10, 2021
    Publication date: June 24, 2021
    Applicants: Kioxia Corporation, KANTO DENKA KOGYO CO., LTD.
    Inventors: Takaya ISHINO, Toshiyuki SASAKI, Mitsuharu SHIMODA, Hisashi SHIMIZU
  • Publication number: 20200234962
    Abstract: A dry etching gas composition is used which contains a saturated or unsaturated hydrofluorocarbon compound (excluding 1,2,2,3-pentafluorocyclobutane and 1,1,2,2-tetrafluorocyclobutane) represented by a general formula (1): CxHyFz (where x, y, and z are integers that satisfy 2?x?4, y+z?2x+2, and 0.5<z/y<2). Use of the etching gas composition containing the above-described hydrofluorocarbon makes it possible to selectively etch a nitrogen-containing silicon-based film (b1) with respect to a silicon oxide film, a non-silicon-based mask material, or a polycrystalline silicon film.
    Type: Application
    Filed: April 2, 2018
    Publication date: July 23, 2020
    Inventors: Korehito KATO, Yoshihiko IKETANI, Yukinobu SHIBUSAWA, Hisashi SHIMIZU
  • Patent number: 9726916
    Abstract: To provide a member bonding apparatus that can accurately position two members for bonding. Member alignment preprocessing device 15 adjusts to align one of the two members received by member receiving device 11 with another member in X and Y-axis directions so that the positions of bonding surfaces of the two members approximately correspond, adhesive application device 12 applies adhesive to a bonding surface of one of the two members approximately aligned, member alignment device 16 adjusts to align another member with one of the two members in X, Y, Z-axis and ?, ?, ?-axis directions based on images of the two members captured by a CCD camera so that positions of the bonding surfaces of the two members correspond, member bonding device 13 makes the bonding surfaces of the two members aligned be bonded to each other through the adhesive, and member delivery device 14 unloads and delivers the bonded member.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: August 8, 2017
    Assignee: Origin Electric Company, Limited
    Inventors: Koji Yamaguchi, Yutaka Matsumoto, Hisashi Shimizu, Tetsuya Okamoto
  • Publication number: 20150370098
    Abstract: To provide a member bonding apparatus that can accurately position two members for bonding. Member alignment preprocessing device 15 adjusts to align one of the two members received by member receiving device 11 with another member in X and Y-axis directions so that the positions of bonding surfaces of the two members approximately correspond, adhesive application device 12 applies adhesive to a bonding surface of one of the two members approximately aligned, member alignment device 16 adjusts to align another member with one of the two members in X, Y, Z-axis and ?, ?, ?-axis directions based on images of the two members captured by a CCD camera so that positions of the bonding surfaces of the two members correspond, member bonding device 13 makes the bonding surfaces of the two members aligned be bonded to each other through the adhesive, and member delivery device 14 unloads and delivers the bonded member.
    Type: Application
    Filed: January 28, 2014
    Publication date: December 24, 2015
    Inventors: Koji YAMAGUCHI, Yutaka MATSUMOTO, Hisashi SHIMIZU, Tetsuya OKAMOTO
  • Patent number: 8013056
    Abstract: A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: September 6, 2011
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yusuke Taguchi, Kazutoshi Tomiyoshi, Tomoyoshi Tada, Hisashi Shimizu
  • Patent number: 7563854
    Abstract: Provided is a method of producing a high molecular weight organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×104, comprising the steps of producing an organopolysiloxane by subjecting a silane compound having a hydrolyzable group to a first hydrolysis and condensation, and then subjecting that organopolysiloxane to an additional second hydrolysis and condensation. The high molecular weight organopolysiloxane is stable, resistant to gelling, and resistant to cracking even when formed as a thick film. A resin composition comprising the high molecular weight organopolysiloxane and a condensation catalyst is useful for sealing an optical element and for producing an optical semiconductor device.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: July 21, 2009
    Assignee: Shin-Estu Chemical Co., Ltd.
    Inventors: Hisashi Shimizu, Toshio Shiobara, Tsutomu Kashiwagi
  • Publication number: 20090171013
    Abstract: A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.
    Type: Application
    Filed: December 24, 2008
    Publication date: July 2, 2009
    Inventors: Yusuke TAGUCHI, Kazutoshi Tomiyoshi, Tomoyoshi Tada, Hisashi Shimizu
  • Patent number: 7550204
    Abstract: The present invention provides a composition for sealing an optical device comprising (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4?a?b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, RE to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0 b 2, and a+b satisfies 1.00 a+b 2), and (ii) a condensation catalyst, as well as a transparent cured product obtained by curing the composition, and a method of sealing a semiconductor element that comprises a step of applying the composition to a semiconductor element, and a step of curing the composition that has been applied to the semiconductor element.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: June 23, 2009
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hisashi Shimizu, Toshio Shiobara, Tsutomu Kashiwagi
  • Publication number: 20090095007
    Abstract: The indoor unit comprises a body and a cover member. The body has a rear ledge. The rear ledge can be embedded in a wall. The cover member has a plurality of cover elements. The plurality of cover elements is aligned along the direction in which the rear ledge is embedded in a wall. The plurality of cover elements can be partitioned. The cover member covers at least part of the rear ledge.
    Type: Application
    Filed: December 25, 2006
    Publication date: April 16, 2009
    Applicant: Daikin Industries, Ltd.
    Inventors: Hiroshi Ohmae, Toshihiro Kizawa, Hisashi Shimizu, Kenjirou Suzuki
  • Publication number: 20080008867
    Abstract: Provided is a resin composition for sealing an optical device that has favorable curability, exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and yields a cured product that enables an improvement in the light extraction efficiency from a semiconductor light emitting element at a high refractive index. The above resin composition for sealing an optical device comprises: (A) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 3×103, represented by an average composition formula: R1a(OX)bSiO(4?a?b)/2 (wherein, each R1 represents, independently, an alkyl group of 1 to 6 carbon atoms, an alkenyl group of 2 to 6 carbon atoms, or an aryl group of 6 to 10 carbon atoms, each X represents, independently, a hydrogen atom, or an alkyl group, alkenyl group, alkoxyalkyl group or acyl group of 1 to 6 carbon atoms, a represents a number within a range from 1.00 to 1.
    Type: Application
    Filed: July 3, 2007
    Publication date: January 10, 2008
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hisashi Shimizu, Tsutomu Kashiwagi
  • Publication number: 20070099008
    Abstract: Provided is a method of producing a high molecular weight organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 5×104, comprising the steps of producing an organopolysiloxane by subjecting a silane compound having a hydrolyzable group to a first hydrolysis and condensation, and then subjecting that organopolysiloxane to an additional second hydrolysis and condensation. The high molecular weight organopolysiloxane is stable, resistant to gelling, and resistant to cracking even when formed as a thick film. A resin composition comprising the high molecular weight organopolysiloxane and a condensation catalyst is useful for sealing an optical element and for producing an optical semiconductor device.
    Type: Application
    Filed: October 26, 2006
    Publication date: May 3, 2007
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hisashi Shimizu, Toshio Shiobara, Tsutomu Kashiwagi
  • Publication number: 20070099009
    Abstract: The present invention provides a composition for sealing optical devices that can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and also provides a cured product of the composition, and a sealing method that uses the composition. A resin composition for sealing an optical device, comprising: (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4?a?b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, R2 to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0<b<2, and a+b satisfies 1.
    Type: Application
    Filed: October 26, 2006
    Publication date: May 3, 2007
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hisashi Shimizu, Toshio Shiobara, Tsutomu Kashiwagi
  • Publication number: 20060270786
    Abstract: A resin composition for sealing an optical device is provided. The composition includes (i) an organopolysiloxane with a polystyrene equivalent weight average molecular weight of at least 3×103, having an average composition formula: R1a(OX)bSiO(4-a-b)/2 wherein, R1 represents an alkyl, alkenyl or aryl group of 1 to 8 carbon atoms, X represents a hydrogen atom, or an alkyl, alkenyl, alkoxyalkyl or acyl group of 1 to 8 carbon atoms, a is a number within a range from 1.05 to 1.5, b is a number that satisfies 0<b<2, and 1.05<a+b<2, (ii) a condensation catalyst, and (iii) inorganic fine particles. The composition is excellent in light extraction efficiency from semiconductor light emitting elements, and useful for sealing LED and like.
    Type: Application
    Filed: May 26, 2006
    Publication date: November 30, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hisashi Shimizu, Tsutomu Kashiwagi, Toshio Shiobara
  • Patent number: D539884
    Type: Grant
    Filed: April 4, 2006
    Date of Patent: April 3, 2007
    Assignee: Daikin Industries Ltd.
    Inventor: Hisashi Shimizu
  • Patent number: D539885
    Type: Grant
    Filed: June 22, 2006
    Date of Patent: April 3, 2007
    Assignee: Daikin Industries Ltd.
    Inventor: Hisashi Shimizu
  • Patent number: D550822
    Type: Grant
    Filed: November 13, 2006
    Date of Patent: September 11, 2007
    Assignee: Daikin Industries Ltd.
    Inventor: Hisashi Shimizu
  • Patent number: D553725
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: October 23, 2007
    Assignee: Daikin Industries Ltd.
    Inventor: Hisashi Shimizu