Abstract: A thermosetting resin composition comprising a maleimide having at least one N-substituted maleimide group in the molecule thereof and a silicon compound having conjugated double bonds is easily workable and yields cured products having improved heat resistance.

Abstract: An epoxy resin having a propenyl group conjugated with an aromatic ring is heat resistant and is easily molded and cured into products having high strength and Tg. It is thus useful as a resin component or modifier.

Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, and a copolymer mixture comprising a long-chain organopolysiloxane copolymer [I] and a short-chain organopolysiloxane copolymer [II] which are each prepared by the addition reaction of an alkenyl-containing epoxy resin with a long-chain or short-chain organopolysiloxane containing pendant phenyl groups at a weight ratio of [II] to [I] of 0.3 to 0.6 is disclosed. The epoxy resin composition exhibits excellent printability, crack resistance, and moldability properties.

Abstract: A naphthalene of the following formula (1) having at least two allyl or propenyl groups ##STR1## wherein each G represents a hydrogen atoms or ##STR2## R.sup.1 's independently represent a hydrogen atom or an unsubstituted or substituted monovalent hydrocarbon group having from 1 to 6 carbon atoms, R.sup.2 's independently represent a hydrogen atom, an allyl group or a propenyl group, R.sup.3 represents an allyl group or a propenyl group, X represents a hydrogen atom or a halogen atom, and n is an integer of from 0 to 6. The derivative is useful for modifying curable resins or resin compositions to provide cured products which have a low water absorption, high strength and a high glass transition temperature. The derivative has good working properties and a good heat resistance.

Abstract: In a position closest to the mounting position of a microcomputer in a casing of a hybrid integrated circuit device on which is mounted the microcomputer and its peripheral circuit elements, an insertion hole is formed for a non-volatile memory which feeds data to the microcomputer. A socket for connecting the non-volatile memory is provided at the bottom of this insertion hole. Because of this configuration it is possible to connect the microcomputer and the non-volatile memory at an extremely short distance and the mounting efficiency of the integrated circuit device is increased. In addition, the non-volatile memory can detachably be mounted. Furthermore, the external shape of the insertion hole for the non-volatile memory is essentially the same as the external shape of the non-volatile memory so that when the non-volatile memory is inserted, the entire surface of this hybrid integrated circuit device is almost flat, providing excellent handling characteristics.

Abstract: An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.

Abstract: An electronic device comprises a first outer cover, a second outer cover and joining means. The first outer cover has a first insulator covering the surface of a first conductor having a through hole formed therein. The second outer cover, which is disposed in contact with the through hole, has a second conductor covered with a second insulator. The joining means has a conductivity and is adapted to be inserted in the through hole to be electrically coupled to the second conductor. When inserted in the through hole, the joining means penetrates the first insulator around the outer wall of the hole and comes in electric contact with the first insulator, thereby permitting the first and second outer covers to be electrically connected and form an electric wave shielding cover as a consequence.

Abstract: A resin-encapsulated semiconductor device is of the structure wherein a silicon chip on a die pad is encapsulated with a molding resin. The rear surface of the die pad remote from the silicon chip, preferably the entire surfaces of the elements are treated with a primer, typically a silane coupling agent and a low stress epoxy resin encapsulant is used, preventing the encapsulating resin from separating and cracking upon subsequent dipping in solder bath.

Abstract: An epoxy resin composition which comprises a curable epoxy resin, a curing agent, an inorganic filler, and at least one copolymer selected from copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and one or more alkenyl groups and the specific organopolysiloxanes; copolymers obtained by an addition reaction between aromatic polymers containing one or more epoxy groups and the specific amino group-containing organopolysiloxanes.

Abstract: An epoxy resin-based composition suitable for encapsulation of semiconductor devices is proposed. The resin composition is capable of giving a cured resin encapsulation highly resistant against crack formation by virtue of the unique ingredient therein, in addition to the thermally curable epoxy resin and an inorganic filler, which is a combination of an organopolysiloxane having a hydrocarbon group substituted by certain functional groups, e.g. glycidyl, amino, mercapto and the like, and a block copolymer composed of the segments of a polymeric aromatic moiety and segments of an organopolysiloxane moiety.

Abstract: The inventive method for forming a cured film on a substrate surface comprises coating the surface with a room temperature curable organosiloxazane polymer comprising, in a molecule, (a) at least one organosiloxane unit represented by the unit formula (a) at least one organosiloxane unit represented by the unit formulaR.sup.1.sub.a SiO.sub.(4-a)/2,and (b) at least one organosilazane unit represented by the unit formulaR.sup.2.sub.b Si(NR.sup.3).sub.(4-b)/2,in which R.sup.1, R.sup.2 and R.sup.3 are each a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group, not all of them being simultaneously hydrogen atoms, and the subscripts a and b are each a positive integer of 1, 2 or 3 with the proviso that a and b cannot be simultaneously equal to 3, in a molecule and subjecting the coating film to exposure to a moisture-containing atmosphere. The method is useful for forming a surface-protecting film or for imparting surface releasability.

Abstract: The invention provides a novel means for solving the problem of poor adhesion between the surface of a substrate of a metal or a plastic resin, e.g. polycarbonate resin, and a cured coating film of an organopolysiloxane formed thereon to impart good surface properties, e.g. hardness and weathering resistance, to the substrate surface by use of an adhesion improver as a primer which comprises a copolymer of an organosilicon compound having a hydrolyzable group and an ethylenic unsaturation in the molecule, glycidyl methacrylate and an organic monomer, e.g. methyl methacrylate and vinyl acetate, a reaction product of an aminoalkyl-containing organosilane compound and an acid anhydride and, optionally, an ultra-violet light absorber in a limited proportion.

Abstract: A novel compound cis-6-undecene-1-chloride is prepared by reacting cis-3-octene-1-chloride with metallic magnesium to give a Grignard reagent of the chloride and then reacting the Grignard reagent with 1-bromo-3-chloropropane in the presence of a lithium copper chloride as a catalyst. The inventive compound is a useful intermediate compound for the synthetic preparation of several kinds of so-called sexual pheromone compounds of noxious insects. As an example of such sexual pheromone compounds, the synthetic preparation of cis-9-tetradecenyl acetate is described.

Abstract: Control of an automotive vehicle component assembling system having one or more series of assembly lines used in common for assembling various models, standards and/or specifications of vehicle component is provided by converting information and instructions relating to various models, standards and/or specifications of vehicle component into a sign. The sign is fitted onto one of the part of the component. Information and instructions from the sign are detected automatically to control picking up of parts and assembling operations in each assembly line.

Abstract: The invention provides a novel class of organic compounds 1-halo-4-decene as a useful intermediate for the synthesis of cis-6-heneicosen-11-one which is a promising exterminating chemical of the noxious insect Douglas-fir tussock moth in North American forests acting as a sexual pheromone. The synthetic procedures for the synthetic preparation of the above 1-halo-4-decene are also described.