Patents by Inventor Hitoshi Kondo
Hitoshi Kondo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12191255Abstract: An interconnect substrate includes a pad for external connection and an insulating layer, wherein a portion of a lower surface of the pad is covered with the insulating layer, wherein an upper surface of the pad is situated at a lower position than an upper surface of the insulating layer, and wherein a groove whose bottom surface is formed by the insulating layer is formed around the pad in a plan view, and has an opening on an upper surface side of the insulating layer.Type: GrantFiled: October 14, 2022Date of Patent: January 7, 2025Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Hikaru Tanaka, Takashi Kasuga, Tomoyuki Shimodaira, Hitoshi Kondo
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Publication number: 20230123522Abstract: A wiring board includes a pad configured to make an external electrical connection, and an insulating layer. A portion of a lower surface of the pad is covered with the insulating layer. The pad includes a base portion, and an extending portion formed integrally with the base portion and extending toward an outer periphery of a side surface of the base portion in a plan view at a lower end of the side surface of the base portion. The insulating layer is provided with a groove that is located in a periphery of the pad in the plan view, exposes a side surface of the pad, and opens to an upper surface of the insulating layer.Type: ApplicationFiled: October 4, 2022Publication date: April 20, 2023Inventors: Hikaru TANAKA, Takashi KASUGA, Tomoyuki SHIMODAIRA, Hitoshi KONDO
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Publication number: 20230120515Abstract: An interconnect substrate includes a pad for external connection and an insulating layer, wherein a portion of a lower surface of the pad is covered with the insulating layer, wherein an upper surface of the pad is situated at a lower position than an upper surface of the insulating layer, and wherein a groove whose bottom surface is formed by the insulating layer is formed around the pad in a plan view, and has an opening on an upper surface side of the insulating layer.Type: ApplicationFiled: October 14, 2022Publication date: April 20, 2023Inventors: Hikaru TANAKA, Takashi KASUGA, Tomoyuki SHIMODAIRA, Hitoshi KONDO
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Publication number: 20230089948Abstract: A wiring board includes: a wiring layer; an insulating layer laminated on the wiring layer; an opening portion penetrating through the insulating layer to the wiring layer; a recess portion formed in a surface of the wiring layer exposed from the opening portion of the insulating layer; and a conductor film formed in the opening portion of the insulating layer and the recess portion of the wiring layer, wherein the recess portion of the wiring layer includes a raised portion, which is raised higher than an outer peripheral portion of a bottom surface, at a central portion of the bottom surface.Type: ApplicationFiled: September 19, 2022Publication date: March 23, 2023Inventors: Takashi Kasuga, Tomoyuki Shimodaira, Hikaru Tanaka, Naotaka Noguchi, Takashi Sato, Hitoshi Kondo
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Publication number: 20220346343Abstract: A liner for a teat cup of a milking device is provided. The liner has a cylindrical shape and including: a bore part in a cylindrical shell to form a space between an inner surface of the shell and the bore part, and elastically deformable; a mouthpiece part disposed at one end of the bore part and closing one end of the shell, and being configured to allow a teat to be inserted therethrough and provided with a vent; a short milk tube part disposed at the other end of the bore part, closing the other end of the shell, and allowing milk from the teat at the bore part to flow therethrough; and a groove shaped vent line on an inner surface of the liner and extending on the bore part from the vent.Type: ApplicationFiled: September 18, 2020Publication date: November 3, 2022Applicant: TOKUYAMA CORPORATIONInventors: Hitoshi Kondo, Yoji Inui
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Patent number: 11480697Abstract: A plurality of electrochemical corrosion protection systems (30) for underground buried structure installed geographically dispersed are utilized so as to predict an earthquake. Changes in amounts of current flowing through closed loop electric circuits (W) for electrochemical corrosion protection in the electrochemical corrosion protection systems (30) are detected and an earthquake is predicted based on the detected changes in the amounts of current.Type: GrantFiled: April 14, 2020Date of Patent: October 25, 2022Assignees: Genesis Research Institute, Inc., Toyota Jidosha Kabushiki Kaisha, Shinshu UniversityInventors: Hitoshi Kondo, Yuji Enomoto
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Publication number: 20220133459Abstract: The present invention provides an application auxiliary tool that enables easy and quick application of a protective patch to a teat of a domestic animal, and a method of easily and quickly applying a protective patch to a teat of a domestic animal using the application auxiliary tool. An application auxiliary tool (2) for applying a protective patch (54) to a teat (64) of a domestic animal so as to protect a teat orifice (66) of the domestic animal includes: paired operation pieces (4a, 4b) that are rotatably connected to each other at their base ends (10a, 10b); and an elastic member (6) located between free ends (12a, 12b) of the paired operation pieces (4a, 4b).Type: ApplicationFiled: June 13, 2019Publication date: May 5, 2022Applicant: TOKUYAMA CORPORATIONInventors: Emi USHIODA, Yoji INUI, Katsuhiro SHIRAI, Hitoshi KONDO, Kie YAMADA
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Patent number: 11186720Abstract: A new yellow pigment excellent in both brightness and coloring power is provided. It has been found that dimerization of a specific quinophthalone skeleton gives more selective absorption and transmittance. Furthermore, the dimerization method was also studied, and it has been found that excessive reddish tone can be suppressed by cleaving the conjugate using a methylene chain as a spacer instead of simply employing a direct bond. In addition, dispersibility has been improved by polyhalogenation and introduction of an imide structure. Furthermore, a coloring agent containing the quinophthalone compound and a coloring composition containing the coloring agent are provided.Type: GrantFiled: June 13, 2019Date of Patent: November 30, 2021Assignee: DIC CORPORATIONInventors: Hitoshi Kondo, Tatsuya Shigehiro, Kengo Yasui
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Publication number: 20210352866Abstract: A milking device (10) has a teat cup (1) with liner (3) and milk claw (30). The liner includes a bore part (3b) elastically deformable between an open and closed state arranged inside a shell (2) to form space between an inner surface of the shell and the bore part; a mouthpiece part 3a disposed at one end of the bore part and closes one end part of the shell and into which a teat is inserted; and a short milk tube part (3d) disposed at the other end side of the bore part and closes the other end part of the shell and through which milk from the teat at the bore part flows. A short milk tube part (3d) is coupled to the claw. Vents (3aa, 3da, 36) are provided to a plurality of places on the mouthpiece part, the short milk tube part, and the claw.Type: ApplicationFiled: September 17, 2019Publication date: November 18, 2021Applicant: TOKUYAMA CORPORATIONInventors: Hitoshi Kondo, Yoji Inui
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Publication number: 20210261783Abstract: A new yellow pigment excellent in both brightness and coloring power is provided. It has been found that dimerization of a specific quinophthalone skeleton gives more selective absorption and transmittance. Furthermore, the dimerization method was also studied, and it has been found that excessive reddish tone can be suppressed by cleaving the conjugate using a methylene chain as a spacer instead of simply employing a direct bond. In addition, dispersibility has been improved by polyhalogenation and introduction of an imide structure. Furthermore, a coloring agent containing the quinophthalone compound and a coloring composition containing the coloring agent are provided.Type: ApplicationFiled: June 13, 2019Publication date: August 26, 2021Applicant: DIC CorporationInventors: Hitoshi Kondo, Tatsuya Shigehiro, Kengo Yasui
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Patent number: 11001930Abstract: A method of manufacturing a wiring board, includes forming an interconnect layer on a first insulating layer, roughening a surface of the interconnect layer, not in contact with the first insulating layer, to form concavo-convex portions, forming a bond enhancing film on the concavo-convex portions, partially removing the bond enhancing film, using an acid solution, and forming a second insulating layer on the first insulating layer, to cover the interconnect layer.Type: GrantFiled: June 18, 2020Date of Patent: May 11, 2021Assignee: SHINKO ELECTRIC INDUSTRIES CO, LTD.Inventors: Tomoyuki Shimodaira, Hitoshi Kondo
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Patent number: 10980215Abstract: A teat opening protection patch is stuck to portions inclusive of the teat openings of livestock, and includes a laminate 1 of an elastic sheet 2 and an adhesive layer 3 laminated on one surface of the elastic sheet 2, the laminate 1 having a double-stretched tensile stress in a range of 0.1 to 5 N.Type: GrantFiled: October 8, 2019Date of Patent: April 20, 2021Assignee: TOKUYAMA CORPORATIONInventors: Yoji Inui, Hitoshi Kondo, Katsuhiro Shirai
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Patent number: 10945412Abstract: A method of protecting a teat opening with a teat opening protection patch, which is stuck to portions inclusive of the teat openings of livestock, and includes a laminate 1 of an elastic sheet 2 and an adhesive layer 3 laminated on one surface of the elastic sheet 2, the laminate 1 having a double-stretched tensile stress in a range of 0.1 to 5 N.Type: GrantFiled: October 8, 2019Date of Patent: March 16, 2021Assignee: TOKUYAMA CORPORATIONInventors: Yoji Inui, Hitoshi Kondo, Katsuhiro Shirai
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Publication number: 20200413545Abstract: A method of manufacturing a wiring board, includes forming an interconnect layer on a first insulating layer, roughening a surface of the interconnect layer, not in contact with the first insulating layer, to form concavo-convex portions, forming a bond enhancing film on the concavo-convex portions, partially removing the bond enhancing film, using an acid solution, and forming a second insulating layer on the first insulating layer, to cover the interconnect layer.Type: ApplicationFiled: June 18, 2020Publication date: December 31, 2020Inventors: Tomoyuki SHIMODAIRA, Hitoshi KONDO
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Publication number: 20200333486Abstract: A plurality of electrochemical corrosion protection systems (30) for underground buried structure installed geographically dispersed are utilized so as to predict an earthquake. Changes in amounts of current flowing through closed loop electric circuits (W) for electrochemical corrosion protection in the electrochemical corrosion protection systems (30) are detected and an earthquake is predicted based on the detected changes in the amounts of current.Type: ApplicationFiled: April 14, 2020Publication date: October 22, 2020Applicants: GENESIS RESEARCH INSTITUTE, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA, SHINSHU UNIVERSITYInventors: Hitoshi KONDO, Yuji ENOMOTO
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Publication number: 20200239693Abstract: It is an object of the present invention to provide a novel yellow pigment having excellent brightness and coloring power. The object is achieved by providing a quinophthalone compound represented by the following Formula (1): (in Formula (1), X1 to X16 are each independently a hydrogen atom or a halogen atom, Y is a hydrogen atom or a halogen atom, and Z is a lower alkylene group). Furthermore, a coloring agent containing a quinophthalone compound represented by Formula (1) and a coloring composition containing the coloring agent are provided.Type: ApplicationFiled: February 20, 2018Publication date: July 30, 2020Applicant: DIC CorporationInventors: Tatsuya Shigehiro, Hitoshi Kondo, Kengo Yasui
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Publication number: 20200107523Abstract: A teat opening protection Patch is stuck to portions inclusive of the teat openings of livestock, and includes a laminate 1 of an elastic sheet 2 and an adhesive layer 3 laminated on one surface of the elastic sheet 2, the laminate 1 having a double-stretched tensile stress in a range of 0.1 to 5 N.Type: ApplicationFiled: October 8, 2019Publication date: April 9, 2020Applicant: TOKUYAMA CORPORATIONInventors: Yoji INUI, Hitoshi KONDO, Katsuhiro SHIRAI
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Publication number: 20200029531Abstract: A teat opening protection patch is stuck to portions inclusive of the teat openings of livestock, and includes a laminate 1 of an elastic sheet 2 and an adhesive layer 3 laminated on one surface of the elastic sheet 2, the laminate 1 having a double-stretched tensile stress in a range of 0.1 to 5 N.Type: ApplicationFiled: October 8, 2019Publication date: January 30, 2020Applicant: TOKUYAMA CORPORATIONInventors: Yoji INUI, Hitoshi KONDO, Katsuhiro SHIRAI
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Patent number: 10531640Abstract: A teat opening protection patch is stuck to portions inclusive of the teat openings of livestock, and includes a laminate 1 of an elastic sheet 2 and an adhesive layer 3 laminated on one surface of the elastic sheet 2, the laminate 1 having a double-stretched tensile stress in a range of 0.1 to 5 N.Type: GrantFiled: February 16, 2017Date of Patent: January 14, 2020Assignee: TOKUYAMA CORPORATIONInventors: Yoji Inui, Hitoshi Kondo, Katsuhiro Shirai
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Patent number: 10510649Abstract: An interconnect substrate includes an insulating layer having a first resin layer and a second resin layer covering an upper surface of the first resin layer, a first conductive layer having an upper surface and side surfaces covered with the first resin layer, a lower surface of the first conductive layer being exposed from a lower surface of the first resin layer, and a second conductive layer including an interconnect pattern and a via interconnect, the interconnect pattern being disposed on an upper surface of the second resin layer, the via interconnect penetrating through both the second resin layer and the first resin layer to connect the interconnect pattern to the upper surface of the first conductive layer, wherein the first resin layer is made of a resin having a higher modulus of elasticity and a lower coefficient of elongation than the second resin layer.Type: GrantFiled: May 21, 2019Date of Patent: December 17, 2019Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yoshihiro Kita, Hitoshi Kondo