Patents by Inventor Hitoshi Tsuji
Hitoshi Tsuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100075576Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: ApplicationFiled: November 30, 2009Publication date: March 25, 2010Inventors: Yoichi KOBAYASHI, Shunsuke NAKAI, Hitoshi TSUJI, Yasuo TSUKUDA, Junki ISHIMOTO, Kazunari SHINYA
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Patent number: 7645181Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: GrantFiled: August 27, 2008Date of Patent: January 12, 2010Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Patent number: 7585204Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.Type: GrantFiled: February 17, 2009Date of Patent: September 8, 2009Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
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Publication number: 20090191790Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.Type: ApplicationFiled: February 17, 2009Publication date: July 30, 2009Inventors: Yoichi KOBAYASHI, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
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Patent number: 7510460Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.Type: GrantFiled: May 31, 2007Date of Patent: March 31, 2009Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
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Publication number: 20090011680Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: ApplicationFiled: August 27, 2008Publication date: January 8, 2009Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Patent number: 7438627Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: GrantFiled: June 27, 2007Date of Patent: October 21, 2008Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Publication number: 20070254557Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: ApplicationFiled: June 27, 2007Publication date: November 1, 2007Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Publication number: 20070254565Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.Type: ApplicationFiled: May 31, 2007Publication date: November 1, 2007Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
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Patent number: 7252575Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: GrantFiled: October 15, 2003Date of Patent: August 7, 2007Assignees: EBARA Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Patent number: 7241202Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.Type: GrantFiled: June 30, 2005Date of Patent: July 10, 2007Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
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Phosphor for low-voltage electron beam, method of producing the same, and vacuum fluorescent display
Publication number: 20060269750Abstract: Nano-particles of an electrically conductive oxide adhere to the surface of particles of a phosphor for low-voltage electron beams. The average diameter of nano-particles of the electrically conductive oxide is in the range of 5 to 100 nm. The weight percentage of the nano-particles of the electrically conductive oxide to the entire phosphor is 0.01 to 10. A vacuum fluorescent display uses the phosphor for low-voltage electron beams.Type: ApplicationFiled: April 24, 2006Publication date: November 30, 2006Inventors: Hitoshi Tsuji, Hitomi Kitamura -
Phosphor for low-voltage electron beam, method of producing the same, and vacuum fluorescent display
Publication number: 20060237690Abstract: Nano-particles of an electrically conductive oxide adhere to the surface of particles of a phosphor for low-voltage electron beams. The average diameter of nano-particles of the electrically conductive oxide is in the range of 5 to 100 nm. The weight percentage of the nano-particles of the electrically conductive oxide to the entire phosphor is 0.01 to 10. A vacuum fluorescent display uses the phosphor for low-voltage electron beams.Type: ApplicationFiled: April 18, 2006Publication date: October 26, 2006Inventors: Hitoshi Tsuji, Hitomi Kitamura -
Publication number: 20060166606Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: ApplicationFiled: October 15, 2003Publication date: July 27, 2006Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Patent number: 7071609Abstract: To provide a red phosphor red phosphor, for low-voltage electron beams, excellent in the life characteristic of its emission luminance and phosphors, for low-voltage electron beams, emitting light in various colors, the red phosphor containing SrTiO3:Pr, Al as a main component thereof is mixed an inorganic compound comprises sulfides. The inorganic compound is a sulfide or a sulfide-containing phosphor. The inorganic compound is a sulfide of alkaline earth metals.Type: GrantFiled: May 10, 2004Date of Patent: July 4, 2006Assignees: Noritake Itron Corporation, Noritake Co. Ltd.Inventors: Hitoshi Tsuji, Satoshi Okada, Hitomi Kitamura
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Patent number: 7042739Abstract: A switching electric source device includes a first synchronous rectifier control circuit, which detects the resonance state developed based on the exciting energy of the primary winding after the main switching element switches off, and causes a first synchronous rectifier to switch on earlier during the time period from the completion of the resonance state to the switching on of the main switching element. Thus, the first synchronous rectifier switches on during the time period, and thus, current is prevented from flowing through a body diode, so that a voltage caused by the voltage drop in the body diode is prevented from being induced in the secondary winding and the third winding. As a result, variations in the output voltage, which is caused by the induced voltage of the third winding, can be prevented. The output voltage can be stabilized.Type: GrantFiled: June 3, 2004Date of Patent: May 9, 2006Assignee: Murata Manufacturing Co., Ltd.Inventors: Jun Nagai, Hitoshi Tsuji
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Publication number: 20050239372Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.Type: ApplicationFiled: June 30, 2005Publication date: October 27, 2005Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
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Patent number: 6942543Abstract: The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.Type: GrantFiled: May 27, 2004Date of Patent: September 13, 2005Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
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Publication number: 20050041441Abstract: A switching electric source device includes a first synchronous rectifier control circuit, which detects the resonance state developed based on the exciting energy of the primary winding after the main switching element switches off, and causes a first synchronous rectifier to switch on earlier during the time period from the completion of the resonance state to the switching on of the main switching element. Thus, the first synchronous rectifier switches on during the time period, and thus, current is prevented from flowing through a body diode, so that a voltage caused by the voltage drop in the body diode is prevented from being induced in the secondary winding and the third winding. As a result, variations in the output voltage, which is caused by the induced voltage of the third winding, can be prevented. The output voltage can be stabilized.Type: ApplicationFiled: June 3, 2004Publication date: February 24, 2005Applicant: Murata Manfacturing Co., Ltd.Inventors: Jun Nagai, Hitoshi Tsuji
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Publication number: 20040227451Abstract: To provide a red phosphor red phosphor, for low-voltage electron beams, excellent in the life characteristic of its emission luminance and phosphors, for low-voltage electron beams, emitting light in various colors, the red phosphor containing SrTiO3:Pr, Al as a main component thereof is mixed an inorganic compound comprises sulfides. The inorganic compound is a sulfide or a sulfide-containing phosphor. The inorganic compound is a sulfide of alkaline earth metals.Type: ApplicationFiled: May 10, 2004Publication date: November 18, 2004Inventors: Hitoshi Tsuji, Satoshi Okada, Hitomi Kitamura