Abstract: A stack structure of semiconductor packages and a method for fabricating the stack structure are provided. A plurality of electrical connection pads and dummy pads are formed on a surface of a substrate of an upper semiconductor package and at positions corresponding to those around an encapsulant of a lower semiconductor package. Solder balls are implanted to the electrical connection pads and the dummy pads. The upper semiconductor package is mounted on the lower semiconductor package. The upper semiconductor package is electrically connected to the lower semiconductor package by the solder balls implanted to the electrical connection pads, and the encapsulant of the lower semiconductor package is surrounded and confined by the solder balls implanted to the dummy pads. Thereby, the upper semiconductor package is properly and securely positioned on the lower semiconductor package, without the occurrence of misalignment between the upper and lower semiconductor packages.

Abstract: A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant.

Abstract: An anti-bacterial oral care composition and method for producing the same are disclosed. The composition comprises chitosan, organic acid, bioflavonoids and xylitol that are mixed together and can effectively inhibit the growth of bacteria in oral cavity, such as 99.9% of staphylococcus aureus, 99.9% of streptococcus mutans, 99.9% of candida albicans, thus reducing the occurrence of decayed tooth. Furthermore, no chemical preservative and anti-bacterial agent are added in the composition, reducing the damage to the oral mucosa and the health of the user.

Abstract: A digital broadcast receiver and a one-touch channel setting method are disclosed. In order to set channels, the digital broadcast receiver tunes a tuner corresponding to an applied channel setting value chosen from available channel setting values that are made from combinations of channel setting value factors by referencing a transponder list corresponding to the applied channel setting value, and sets an antenna and a tuner to correspond with the applied channel setting value in accordance with the tuning result. Thus, the antenna and tuner may be set automatically for searching channels.

Abstract: Provided is a method for localization message process. The method includes allocating cluster resources for recognizing a location of a mobile node, setting operation of each node by deciding a cluster operation state for the mobile node, measuring distances between the mobile node to each of anchor nodes, and recognizing a location of the mobile node.

Abstract: A digital broadcasting receiver having multiple tuners and a method of selecting a tuner in the digital broadcasting receiver. An embodiment of the present invention attempts to tune each tuner with transponder data of a satellite being connected to a digital broadcasting receiver having multiple tuners and selects one tuner to search channels according to the result of tuning. The transponder input procedure and the following tuner selection procedure can be omitted such that the tuner selection procedure can be simplified.

Abstract: The present invention relates to a method for manufacturing an amorphous alloy by using liquid pig iron. The exemplary embodiment of the present invention provides a method for manufacturing an amorphous alloy, including providing liquid pig iron, adding an alloy material to the liquid pig iron, and solidifying the liquid pig iron.

Abstract: AC shield continuity for shielded twisted pair structured datacomm cable is determined by testing the cable, driven in a common mode, over a range of frequencies, to determine presence and location of shield breaks. DC ground path generated false results are thereby avoided.

Abstract: The present invention relates to an integrated high-voltage battery housing. More particularly, it relates to an integrated high-voltage battery housing adapted to secure safety against side impact collisions while reducing the weight of a vehicle by integrating a connecting structure between a battery housing and a side member of a chassis of the vehicle. In particular, the integrated high-voltage battery housing includes: a bottom housing configured to receive a battery; a battery fixing bracket configured to fix the battery to a top surface of the bottom housing; and a plurality of flanges extending from an upper end edge of a side wall of the bottom housing and each having a coupling aperture for coupling the flange to a chassis side member. A protruding reinforcing portion extends transversely between opposite sides of the bottom housing on a bottom surface of the bottom housing.

Abstract: A substrate depositing system and a method of using a substrate depositing system. A substrate depositing system includes a load-lock chamber for loading and unloading a substrate, at least one transfer chamber connected to the load-lock chamber and including a substrate transfer device configured to vertically transfer the substrate, and a pair of depositing chambers connected to opposite sides of the at least one transfer chamber and including a depositing source and a pair of substrate fixing devices, the substrate transfer device including a pair of substrate installing members.

Abstract: The present invention provides a ratchet tool, wherein a circular tooth row is arranged into the round groove of the main body's actuating end. A tool driving seat is assembled rotatably onto the round groove of the main body. A first braking slot, a second braking slot and an arched control slot are triangularly configured onto the internal surface of the tool driving seat. The first and second braking slots are separately fitted with the first and second braking swing blocks. A moveable control gear is placed into the control slot and can shift to the through-hole at both ends of the control slot such that it is mated simultaneously with inner tip edges of the first and second braking swing blocks. An elastic resetter is additionally provided to make the first and second braking swing blocks with inner tip edge swing inwards in a normal state.

Abstract: A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant.

Abstract: A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.

Abstract: Provided is a link synchronization method for a radio frequency repeater that can perform link route switching at an accurate time point by measuring reception signal power at a predetermined period for a predetermined time duration, accumulating and comparing them with a reference level, and detecting a link termination time point. The method includes: a) setting up an initial link route; b) measuring received signal power in the initial link route; c) accumulating the reception signal power received for a predetermined time at a predetermined period, when the reception signal power is detected; d) setting up a reference level for link switching based on the accumulated reception signal power; e) detecting a link termination time point by finding an edge in a waveform of the accumulated reception signal power based on the reference level; and f) switching the current link route based on the detected link termination time point.

Abstract: Disclosed is a tension delivery device for preventing urinary incontinence, which includes: Retzius space-insertion portions which are respectively to be inserted into the Retzius spaces positioned on the left side and right side of the urethra and move in response to the pressure or the Retzius spaces; and a urethral support portion which extends convergently from the Retzius space-insertion portions and serves to support the urethra upward, wherein the lateral cross section of the urethral support portion becomes thinner from Retzius space-insertion portions toward the distal end, and a mesh structure may be provided along the outer surface of the tension transfer device.

Abstract: A system and method operable for providing contextually triggered vocabulary information on at least one display screen of an E-book reader are disclosed. A character group comprising a target language character group is displayed on the at least one display screen. A local or a remote electronic pre-translated primary language resource is provided in response to a user selecting a word or sentence in the target language character group. The electronic pre-translated primary language electronic resource is searched to obtain a pre-translated primary language character group corresponding to the target language character group. A synchronized pre-translated primary language character group is obtained by synchronizing the pre-translated primary language words or sentences to words or sentences in the target language. The synchronized pre-translated primary language character group is displayed on the at least one display screen.

Abstract: The present invention relates to a connection state setting method of a dual tuner and an apparatus. In accordance with an embodiment of the present invention, the method of setting a tuner connection state of n satellites in a digital broadcast receiver having the plurality of tuners, n being a natural number, that are connected to one or more antennas includes setting the tuner connection state for each satellite by using a satellite signal inputted from each satellite, which has information on one antenna, and setting the tuner connection state between the satellites by using a connection state set for each satellite and the satellite signal inputted from each satellite. Accordingly, with the present invention, the digital broadcast receiver having two tuners can automatically set the connection state of satellite lines of each tuner.

Abstract: An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings for exposing the bond pads. A groove is formed between the paired bond pads and has a length larger than a width of an electronic component mounted on the paired bond pads. The groove is adjacent to one of the paired bond pads and communicates with a corresponding one of the openings where this bond pad is exposed. Accordingly, a clearance between the electronic component and the electronic carrier board can be effectively filled with an insulating resin for encapsulating the electronic component, thereby preventing voids and undesirable electrical bridging between the paired bond pads from occurrence.

Abstract: A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.

Abstract: An attachable/detachable covering lens for covering eyeglass lenses is disclosed. A transparent optical material is suitably shaped to cover at least a portion of an eyeglass lens. The transparent optical material is coupled to the eyeglass lens by adhering means. The adhering means may comprise a viscosity of the transparent optical material. Embodiments of the disclosure provide mechanisms to easily provide attachable/detachable temporary lenses such as a sun-shield, temporary eyesight correction to the prescription lenses for applications such as reading, watching TV, or 3-D movie viewing. Embodiments of the disclosure also provide mechanisms for providing an easily attachable/detachable temporary prescription lens over special purpose glasses.