Patents by Inventor Ho Yi

Ho Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130196076
    Abstract: A deposition source for depositing a deposition material on a substrate, the deposition source including: a nozzle disposed to face the substrate and discharge the deposition material toward the substrate; and a hardening portion disposed to at least one side of the nozzle for immediately hardening the deposition material discharged via the nozzle when the deposition material reaches the substrate. The deposition source being part of a deposition apparatus for manufacturing an organic light-emitting display having improved characteristics of a deposited film and encapsulation characteristics.
    Type: Application
    Filed: August 23, 2012
    Publication date: August 1, 2013
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventors: Tae-Wook Kang, Jeong-Ho Yi
  • Publication number: 20130189433
    Abstract: A vapor deposition apparatus includes a stage on which a substrate is mounted; a heater unit that is disposed at a side of the stage and includes a first heater and a second heater, wherein the first heater and the second heater are movable so that the first heater and the second heater are spaced apart from each other or are disposed adjacent to each other; and a nozzle unit that is disposed at a side opposite to the side at which the heater unit is disposed about the stage and includes one or more nozzles.
    Type: Application
    Filed: June 22, 2012
    Publication date: July 25, 2013
    Applicant: SAMSUNG MOBILE DISPLAY CO., LTD.
    Inventors: Choel-Min Jang, Myung-Soo Huh, Jeong-Ho Yi, Cheol-Rae Jo, Sang-Joon Seo, Seung-Hun Kim, Jin-Kwang Kim
  • Publication number: 20130171335
    Abstract: A thin film depositing apparatus and a thin film deposition method using the apparatus. The thin film depositing apparatus includes a chamber configured to have a substrate mounted therein, an ejection unit configured to move in the chamber and to eject a deposition vapor to the substrate, and a source supply unit configured to supply a source of the deposition vapor to the ejection unit.
    Type: Application
    Filed: June 27, 2012
    Publication date: July 4, 2013
    Inventors: Yong-Suk Lee, Myung-Soo Huh, Cheol-Rae Jo, Sang-Hyuk Hong, Jeong-Ho Yi, Suk-Won Jung, Sun-Ho Kim, Mi-Ra An
  • Patent number: 8420521
    Abstract: A stack structure of semiconductor packages and a method for fabricating the stack structure are provided. A plurality of electrical connection pads and dummy pads are formed on a surface of a substrate of an upper semiconductor package and at positions corresponding to those around an encapsulant of a lower semiconductor package. Solder balls are implanted to the electrical connection pads and the dummy pads. The upper semiconductor package is mounted on the lower semiconductor package. The upper semiconductor package is electrically connected to the lower semiconductor package by the solder balls implanted to the electrical connection pads, and the encapsulant of the lower semiconductor package is surrounded and confined by the solder balls implanted to the dummy pads. Thereby, the upper semiconductor package is properly and securely positioned on the lower semiconductor package, without the occurrence of misalignment between the upper and lower semiconductor packages.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: April 16, 2013
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Fang-Lin Tsai, Ho-Yi Tsai, Han-Ping Pu, Cheng-Hsu Hsiao
  • Patent number: 8361843
    Abstract: A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: January 29, 2013
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Min-Shun Hung, Ho-Yi Tsai, Chien-Ping Huang, Cheng-Hsu Hsiao
  • Publication number: 20120237457
    Abstract: An anti-bacterial oral care composition and method for producing the same are disclosed. The composition comprises chitosan, organic acid, bioflavonoids and xylitol that are mixed together and can effectively inhibit the growth of bacteria in oral cavity, such as 99.9% of staphylococcus aureus, 99.9% of streptococcus mutans, 99.9% of candida albicans, thus reducing the occurrence of decayed tooth. Furthermore, no chemical preservative and anti-bacterial agent are added in the composition, reducing the damage to the oral mucosa and the health of the user.
    Type: Application
    Filed: March 20, 2011
    Publication date: September 20, 2012
    Inventors: Shu-Cheng CHEN, Ho-Yi Tsai
  • Patent number: 8269901
    Abstract: A digital broadcast receiver and a one-touch channel setting method are disclosed. In order to set channels, the digital broadcast receiver tunes a tuner corresponding to an applied channel setting value chosen from available channel setting values that are made from combinations of channel setting value factors by referencing a transponder list corresponding to the applied channel setting value, and sets an antenna and a tuner to correspond with the applied channel setting value in accordance with the tuning result. Thus, the antenna and tuner may be set automatically for searching channels.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: September 18, 2012
    Assignee: Humax Co., Ltd.
    Inventors: Ho Yi, Seung-Kwan Ha, Jun-Hyung Kim
  • Patent number: 8248963
    Abstract: Provided is a method for localization message process. The method includes allocating cluster resources for recognizing a location of a mobile node, setting operation of each node by deciding a cluster operation state for the mobile node, measuring distances between the mobile node to each of anchor nodes, and recognizing a location of the mobile node.
    Type: Grant
    Filed: September 24, 2009
    Date of Patent: August 21, 2012
    Assignee: KT Corporation
    Inventors: Yeon-Soo Kim, Hak-Jin Chong, Kun-Ho Yi
  • Patent number: 8228442
    Abstract: A digital broadcasting receiver having multiple tuners and a method of selecting a tuner in the digital broadcasting receiver. An embodiment of the present invention attempts to tune each tuner with transponder data of a satellite being connected to a digital broadcasting receiver having multiple tuners and selects one tuner to search channels according to the result of tuning. The transponder input procedure and the following tuner selection procedure can be omitted such that the tuner selection procedure can be simplified.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: July 24, 2012
    Assignee: HUMAX Co., Ltd.
    Inventor: Ho Yi
  • Publication number: 20120167717
    Abstract: The present invention relates to a method for manufacturing an amorphous alloy by using liquid pig iron. The exemplary embodiment of the present invention provides a method for manufacturing an amorphous alloy, including providing liquid pig iron, adding an alloy material to the liquid pig iron, and solidifying the liquid pig iron.
    Type: Application
    Filed: December 28, 2009
    Publication date: July 5, 2012
    Applicant: POSCO
    Inventors: Sang-Ho Yi, Seung Dueg Choi, Seong Hoon Yi
  • Publication number: 20120146666
    Abstract: AC shield continuity for shielded twisted pair structured datacomm cable is determined by testing the cable, driven in a common mode, over a range of frequencies, to determine presence and location of shield breaks. DC ground path generated false results are thereby avoided.
    Type: Application
    Filed: December 9, 2010
    Publication date: June 14, 2012
    Applicant: FLUKE CORPORATION
    Inventors: Jeffrey Sandsmark Bottman, Jun Ho Yi
  • Publication number: 20120129029
    Abstract: The present invention relates to an integrated high-voltage battery housing. More particularly, it relates to an integrated high-voltage battery housing adapted to secure safety against side impact collisions while reducing the weight of a vehicle by integrating a connecting structure between a battery housing and a side member of a chassis of the vehicle. In particular, the integrated high-voltage battery housing includes: a bottom housing configured to receive a battery; a battery fixing bracket configured to fix the battery to a top surface of the bottom housing; and a plurality of flanges extending from an upper end edge of a side wall of the bottom housing and each having a coupling aperture for coupling the flange to a chassis side member. A protruding reinforcing portion extends transversely between opposite sides of the bottom housing on a bottom surface of the bottom housing.
    Type: Application
    Filed: June 20, 2011
    Publication date: May 24, 2012
    Applicants: KIA MOTORS CORPORATION, HYUNDAI MOTOR COMPANY
    Inventors: Gyu Ho Yi, Sun Hyung Cho
  • Publication number: 20120064728
    Abstract: A substrate depositing system and a method of using a substrate depositing system. A substrate depositing system includes a load-lock chamber for loading and unloading a substrate, at least one transfer chamber connected to the load-lock chamber and including a substrate transfer device configured to vertically transfer the substrate, and a pair of depositing chambers connected to opposite sides of the at least one transfer chamber and including a depositing source and a pair of substrate fixing devices, the substrate transfer device including a pair of substrate installing members.
    Type: Application
    Filed: July 8, 2011
    Publication date: March 15, 2012
    Inventors: Jeong-Ho Yi, Suk-Won Jung, Seung-Ho Choi
  • Patent number: 8109182
    Abstract: The present invention provides a ratchet tool, wherein a circular tooth row is arranged into the round groove of the main body's actuating end. A tool driving seat is assembled rotatably onto the round groove of the main body. A first braking slot, a second braking slot and an arched control slot are triangularly configured onto the internal surface of the tool driving seat. The first and second braking slots are separately fitted with the first and second braking swing blocks. A moveable control gear is placed into the control slot and can shift to the through-hole at both ends of the control slot such that it is mated simultaneously with inner tip edges of the first and second braking swing blocks. An elastic resetter is additionally provided to make the first and second braking swing blocks with inner tip edge swing inwards in a normal state.
    Type: Grant
    Filed: July 30, 2009
    Date of Patent: February 7, 2012
    Inventor: Ho-Yi Chen
  • Publication number: 20110287588
    Abstract: A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.
    Type: Application
    Filed: August 1, 2011
    Publication date: November 24, 2011
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wen-Tsung Tseng, Ho-Yi Tsai, Chien-Ping Huang, Cheng-Hsu Hsiao
  • Publication number: 20110287587
    Abstract: A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant.
    Type: Application
    Filed: August 1, 2011
    Publication date: November 24, 2011
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Min-Shun Hung, Ho-Yi Tsai, Chien-Ping Huang, Cheng-Hsu Hsiao
  • Patent number: 8064822
    Abstract: Provided is a link synchronization method for a radio frequency repeater that can perform link route switching at an accurate time point by measuring reception signal power at a predetermined period for a predetermined time duration, accumulating and comparing them with a reference level, and detecting a link termination time point. The method includes: a) setting up an initial link route; b) measuring received signal power in the initial link route; c) accumulating the reception signal power received for a predetermined time at a predetermined period, when the reception signal power is detected; d) setting up a reference level for link switching based on the accumulated reception signal power; e) detecting a link termination time point by finding an edge in a waveform of the accumulated reception signal power based on the reference level; and f) switching the current link route based on the detected link termination time point.
    Type: Grant
    Filed: December 26, 2005
    Date of Patent: November 22, 2011
    Assignees: KT Corporation, Solid Technologies, Inc.
    Inventors: Hee-jin Yang, Kyoo-tae Ryoo, Seong-choon Lee, Jeong-hwi Kim, Sang-ho Yi
  • Publication number: 20110257470
    Abstract: Disclosed is a tension delivery device for preventing urinary incontinence, which includes: Retzius space-insertion portions which are respectively to be inserted into the Retzius spaces positioned on the left side and right side of the urethra and move in response to the pressure or the Retzius spaces; and a urethral support portion which extends convergently from the Retzius space-insertion portions and serves to support the urethra upward, wherein the lateral cross section of the urethral support portion becomes thinner from Retzius space-insertion portions toward the distal end, and a mesh structure may be provided along the outer surface of the tension transfer device.
    Type: Application
    Filed: March 7, 2011
    Publication date: October 20, 2011
    Inventors: Jeong Yoon Yi, Hwa Jeong Yi, Su Ho Yi
  • Publication number: 20110246175
    Abstract: A system and method operable for providing contextually triggered vocabulary information on at least one display screen of an E-book reader are disclosed. A character group comprising a target language character group is displayed on the at least one display screen. A local or a remote electronic pre-translated primary language resource is provided in response to a user selecting a word or sentence in the target language character group. The electronic pre-translated primary language electronic resource is searched to obtain a pre-translated primary language character group corresponding to the target language character group. A synchronized pre-translated primary language character group is obtained by synchronizing the pre-translated primary language words or sentences to words or sentences in the target language. The synchronized pre-translated primary language character group is displayed on the at least one display screen.
    Type: Application
    Filed: March 30, 2010
    Publication date: October 6, 2011
    Inventors: Young Hee Yi, Jung Soo Yi, Jung Ho Yi
  • Patent number: 8032074
    Abstract: The present invention relates to a connection state setting method of a dual tuner and an apparatus. In accordance with an embodiment of the present invention, the method of setting a tuner connection state of n satellites in a digital broadcast receiver having the plurality of tuners, n being a natural number, that are connected to one or more antennas includes setting the tuner connection state for each satellite by using a satellite signal inputted from each satellite, which has information on one antenna, and setting the tuner connection state between the satellites by using a connection state set for each satellite and the satellite signal inputted from each satellite. Accordingly, with the present invention, the digital broadcast receiver having two tuners can automatically set the connection state of satellite lines of each tuner.
    Type: Grant
    Filed: November 28, 2006
    Date of Patent: October 4, 2011
    Assignee: Humax Co., Ltd.
    Inventors: Jun-Hyung Kim, Ho Yi, Min-Haeng Cho