Abstract: The invention relates to a method for depositing thick III-V semiconductor layers on a non-III-V substrate, particularly a silicon substrate, by introducing gaseous starting materials into the process chamber of a reactor. The aim of the invention is to carry out the crystalline deposition of thick III-V semiconductor layers on a silicon substrate without the occurrence of unfavorable lattice distortions. To this end, the invention provides that a thin intermediate layer is deposited at a reduced growth temperature between two III-V layers.

Abstract: The invention relates to a method and device for depositing several crystalline semiconductor layers on at least one semiconductor crystalline substrate. According to said method, gaseous parent substances are introduced into a process chamber of a reactor by means of a gas inlet organ, said substances accumulating, optionally after a chemical gas phase and/or surface reaction, on the surface of a semiconductor substrate that is placed on a substrate holder in the process chamber, thus forming the semiconductor layer. Said semiconductor layer and the semiconductor substrate form a crystal consisting of either one or several elements from main group V, elements from main groups III and V, or elements from main groups II and VI.

Abstract: The invention relates to a device for depositing especially, crystalline layers onto one or more substrates, especially substrates which are also crystalline, in a process chamber, using reaction gases which are guided into said process chamber, where they undergo pyrolytic reaction. The device comprises a reverse-heatable support plate which forms a wall of the process chamber and which can especially be heated with a high frequency, consisting of especially inertly coated graphite; a gas inlet mechanism which is located in the center of the process chamber, said process chamber having a circular cross-section, and which is allocated to a cover plate that is situated at a distance from the support plate; and a gas outlet ring which forms the outer limit of the process chamber and which has a plurality of radial gas outlets. According to the invention, the gas outlet ring consists of solid graphite in order to keep the isothermal profile inside the process chamber as flat as possible.

Abstract: The invention relates to a device and method for the deposition of in particular, crystalline layers on one or several, in particular, equally crystalline substrates in a process chamber, by means of reaction gases which are fed to the process chamber where they react pyrolytically. The process chamber has a first wall and a second wall, lying opposite the first. The first wall is provided with at least one heated substrate holder, to which at least one reaction gas is led by means of a gas inlet device. According to the invention, a premature decomposition of source gases and a local oversaturation of the gas flow with decomposition products may be avoided, whereby the gas inlet device is liquid cooled.

Abstract: The invention relates to a device for depositing especially, crystalline layers onto one or more, especially, also crystalline substrates in a process chamber using reaction gases which are guided into said process chamber, where they undergo pyrolytic reaction. The device has a heatable support plate wherein at least one substrate holder lies loosely, especially rotationally, with its surface flush with the surroundings. A compensation plate which adjoins the at least one substrate holder, following the contours of the same, is provided on the support plate in order to keep the isothermal profile on the support plate as flat as possible.

Abstract: The invention relates to a device for the deposition of in particular, crystalline layers on one or several, in particular, equally crystalline substrates, comprising a process chamber, arranged in a reactor housing, which may be charged with the substrates from above, by means of a reactor housing opening which may be sealed by a cover. The reactor housing opening opens out into a glove box, in particular flushed with highly pure gas and connects electricity, liquid or gas supply lines to the cover. According to the invention, the connection of supply lines for electricity, fluid or gas sources arranged outside the glove box to the cover of the reactor housing arranged within the glove box may be improved, whereby the electricity, fluid or gas supply lines run freely, from outside the glove box, through a flexible tube which is sealed atone end to a flange arrangement rigidly fixed to the cover and sealed at the other end to an opening in the glove box wall.

Abstract: The invention relates to a method and a device for depositing especially, organic layers. In a heated reactor, a non-gaseous starting material that is stored in a source in the form of a container is transported from said source to a substrate by a carrier gas in gaseous form and is deposited on said substrate. The rate of production of the gaseous starting material by the source is unpredictable due to a heat input that cannot be regulated in a reproducible manner and due to cooling resulting from the carrier gas. The invention therefore provides that the preheated carrier gas washes through the starting material from bottom to top, the starting material being kept essentially isothermal in relation to the carrier gas by the heated container walls.

Abstract: The invention relates to a reaction chamber especially for carrying out substrate coating methods, such as CVD methods, characterized in that at least one opening is provided in at least one outer wall in which an HF and especially an RF feedthrough is inserted in a pressure or vacuum tight manner.

Abstract: A method and device for the production of coated substrates, such as OLEDs is disclosed, whereby at least one layer is deposited on the at least one substrate, by means of a condensation method and a solid and/or fluid precursor and, in particular, at least one sublimate source is used for at least one part of the reaction gases. The invention is characterized in that, by means of a temperature control of the reaction gases between precursor source(s) and substrate, a condensation of the reaction gases before the substrate(s) is avoided.

Abstract: A reactor for coating flat substrates and particularly wafers is described which has a reaction vessel into which reaction gases can be introduced, and a substrate holder unit in which substrates are held in a holder such that the main surface of the substrates to be coated is oriented downward during the deposition operation and is aligned essentially in parallel to the flow direction of the reaction gases. The invention is characterized in that at least two spaces for substrates are provided on the substrate holder unit and in that the holder or holders is/are constructed in the manner of a template which has openings for the surfaces of the substrates to be coated.

Abstract: What is described here is a method and a temperature management and reaction chamber system for the production of nitrogenous semiconductor crystal materials of the form AXBYCZNVMW, wherein A, B, C represent elements of group II or III, N represents nitrogen, M represents an element of group V or VI, and X, Y, Z, V, W represent the mol fraction of each element in this compound, operating on the basis of gas phase compositions and gas phase successions. The invention excels itself by the provisions that for the production of the semiconductor crystal materials the production process is controlled by the precise temperature control of defined positions in the reaction chamber system under predetermined conditions.

Abstract: A CVD reactor comprising: a reactor casing with a casing cover, a heated susceptor for one wafer or several wafers, which is disposed in the reactor casing, a fluid inlet unit including a plurality of openings facing said wafer or wafers through which the CVD media, which is moderately heated, enter the reactor, and a fluid outlet disposed on the periphery of the reactor casing, through which the introduced media is discharged; wherein the fluid outlet has roughly the shape of a disk with a plurality of outlet openings for the discharge of CVD media, and is disposed between the susceptor and the reactor cover in such a way that the fluid outlet is heated by the susceptor by radiation and hence adjusts itself to a temperature between the temperature of the susceptor and the reactor cover through which the CVD media enter in a moderately heated state.

Abstract: A reactor for coating flat substrates and particularly wafers is described which has

Abstract: A reactor for coating flat substrates and particularly wafers is described which has a reaction vessel into which reaction gases can be introduced, and a substrate holder unit in which substrates are held in a holder such that the main surface of the substrates to be coated is oriented downward during the deposition operation and is aligned essentially in parallel to the flow direction of the reaction gases. The invention is characterized in that at least two spaces for substrates are provided on the substrate holder unit and in that the holder or holders is/are constructed in the manner of a template which has openings for the surfaces of the substrates to be coated.

Abstract: What is described here is a method of producing a wafer support having a protective layer, which, after the specifically mechanically prefabricated wafer support has been cleaned, is characterized by heating the cleaned wafer support to temperatures, by introducing coating components for conversion of the wafer support surface into the protective layer or for deposition of components supplied to a protective layer.

Abstract: A gas inlet for different reactant gases which flow into reaction vessels with high flow velocity. The cross sections of the gas inlet supply lines are substantially smaller than that of the reaction vessel.The gas inlet has a part with a conicoidal interior contour, the cross section of which is adapted to the cross section of the reaction vessel and which is arranged at one end of the reaction vessel through which flow occurs. The individual supply lines end at approximately the focal point of the part having the conicoidal interior contour. The gas exit openings of the supply lines are directed at the vertex of the part having the conicoidal interior contour.

Abstract: Disclosed is a process for fabricating mixed crystals and, in particular, III-V semiconductors, in which at least one component of the composition of the mixed crystal is transferred in a reactor from a source into a vapor phase containing hydrogen and chloride compounds as well as a carrier gas and mixed with said component or other components of said composition of said mixed crystal, transported to a substrate and precipitated on said substrate. The invented process is distinguished in that in order to vary the growth rate between approximately 1 <m/h and approximately 500 <m/h, the overall pressure is varied between approximately 80 mbar and approximately 1 mbar.

Abstract: A multiplicity of thin layers are applied on top of each other having alternately comparatively high concentrations of charge carriers and no doping. The thickness and the concentration of charge carriers of the individual layers being are proportioned in such a manner that the desired low concentration of charge carriers is yielded by averaging the multiplicity of layers.

Abstract: In a process for the production of thin films and epitaxial layers by gas-phase deposition, intramolecularly stabilized organometallic compounds are employed as a source of metal.

Abstract: In a process for the production of thin films and epitaxial layers by gas-phase deposition, intramolecularly stabilized organometallic compounds are employed as a source of metal.