Abstract: An Inlay element for a smart card, comprising an antenna layer, a first antenna coil being arranged on a top surface the antenna layer, a second antenna coil being arranged on the top surface of the antenna layer, a first compensation layer being arranged on the top surface of the antenna layer, an OLED module being arranged at least partially within the antenna layer and within the first compensation layer, a first overlay layer being arranged below a bottom surface of the antenna layer, and a transmissive second overlay layer being arranged above a top surface of the first compensation layer, wherein the first antenna coil is galvanically decoupled from the second antenna coil, and wherein the first antenna coil and the OLED module are connected in series with a rectifier assembly.

Abstract: Systems and methods are herein provided for a smart card. In one example, a smart card comprises a first coil having turns of wire defining a first interior space within the first surface area surrounded by turns of wire of the first coil; a second coil having turns of wire defining a second interior space within the second surface area surrounded by turns of wire of the second coil; a third coil having turns of wire defining a third interior space within the third surface area surrounded by the wire of the third coil; wherein the first, second, and third coils made from a single piece of wire, and wherein a winding direction of the first coil is the same as a winding direction of the third coil.

Abstract: The application relates to a smart card comprising a first, second and third coil. The second coil is part of an LC network and is preferably positioned within the third coil. The second coil improves the tuning of the third coil, which acts as an antenna coil, to match the third coil to an external reader. This arrangement allows improved interaction between the smart card and an external reader.

Abstract: An Inlay element for a smart card, comprising an antenna layer, a first antenna coil being arranged on a top surface the antenna layer, a second antenna coil being arranged on the top surface of the antenna layer, a first compensation layer being arranged on the top surface of the antenna layer, an OLED module being arranged at least partially within the antenna layer and within the first compensation layer, a first overlay layer being arranged below a bottom surface of the antenna layer, and a transmissive second overlay layer being arranged above a top surface of the first compensation layer, wherein the first antenna coil is galvanically decoupled from the second antenna coil, and wherein the first antenna coil and the OLED module are connected in series with a rectifier assembly.

Abstract: Systems and methods are herein provided for a smart card. In one example, a smart card comprises a first coil having turns of wire defining a first interior space within the first surface area surrounded by turns of wire of the first coil; a second coil having turns of wire defining a second interior space within the second surface area surrounded by turns of wire of the second coil; a third coil having turns of wire defining a third interior space within the third surface area surrounded by the wire of the third coil; and a non-metallic substrate of the smart card into which the first, second, and third coils are arranged, the non-metallic substrate being free from conductive and/or metallic foil and conductive and/or metallic layers.

Abstract: An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.

Abstract: An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.

Abstract: An inlay for a card can include a first overlay sheet, an antenna carrier sheet, a thickness compensation sheet, a second transparent overlay sheet, a module lead frame, a finger sensor lead frame, an antenna, and electrical wires. The module lead frame can be adapted for being milled and can include a plurality of first contact pads for contacting a contact module. The finger sensor lead frame can be adapted for being milled and can include a plurality of second contact pads for contacting a fingerprint sensor. The electrical wires can be connected to one of the first contact pads, the second contact pads, or the antenna.

Abstract: An inlay for a card includes a first transparent overlay sheet, an antenna carrier sheet, a thickness compensation sheet, a second transparent overlay sheet. The inlay also includes a microcontroller, a module lead frame, a finger sensor lead frame, an antenna, and electrical wires. The module lead frame is adapted for being milled and includes a plurality of first contact pads for contacting a contact module. The finger sensor lead frame is adapted for being milled and includes a plurality of second contact pads for contacting a fingerprint sensor. The electrical wires are connected to the microcontroller, to the first contact pads, to the second contact pads, and to the antenna.

Abstract: The application provides an enrolment card for a biometric card with a first card body. The enrolment card includes a battery for providing electrical power, a microcontroller unit that is electrically connected to the battery, and a plurality of contact pins that are electrically connected to the battery and to the microcontroller unit. The enrolment card further includes a second card body with a card engagement element. The second card body is sized to correspond to the first card body. The battery and the second microcontroller unit are embedded in the second card body. The enrolment card provides an enrolment mode, wherein the card engagement element engages with the first card body for allowing the contact pins to contact corresponding contact pads of the biometric card and the battery provides the electrical power to the biometric card.

Abstract: An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.

Abstract: An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.