Abstract: Systems and methods are herein provided for a smart card. In one example, a smart card comprises a first coil having turns of wire defining a first interior space within the first surface area surrounded by turns of wire of the first coil; a second coil having turns of wire defining a second interior space within the second surface area surrounded by turns of wire of the second coil; a third coil having turns of wire defining a third interior space within the third surface area surrounded by the wire of the third coil; and a non-metallic substrate of the smart card into which the first, second, and third coils are arranged, the non-metallic substrate being free from conductive and/or metallic foil and conductive and/or metallic layers.

Abstract: An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.

Abstract: An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.

Abstract: An inlay for a card can include a first overlay sheet, an antenna carrier sheet, a thickness compensation sheet, a second transparent overlay sheet, a module lead frame, a finger sensor lead frame, an antenna, and electrical wires. The module lead frame can be adapted for being milled and can include a plurality of first contact pads for contacting a contact module. The finger sensor lead frame can be adapted for being milled and can include a plurality of second contact pads for contacting a fingerprint sensor. The electrical wires can be connected to one of the first contact pads, the second contact pads, or the antenna.

Abstract: An inlay for a card includes a first transparent overlay sheet, an antenna carrier sheet, a thickness compensation sheet, a second transparent overlay sheet. The inlay also includes a microcontroller, a module lead frame, a finger sensor lead frame, an antenna, and electrical wires. The module lead frame is adapted for being milled and includes a plurality of first contact pads for contacting a contact module. The finger sensor lead frame is adapted for being milled and includes a plurality of second contact pads for contacting a fingerprint sensor. The electrical wires are connected to the microcontroller, to the first contact pads, to the second contact pads, and to the antenna.

Abstract: The application provides an enrolment card for a biometric card with a first card body. The enrolment card includes a battery for providing electrical power, a microcontroller unit that is electrically connected to the battery, and a plurality of contact pins that are electrically connected to the battery and to the microcontroller unit. The enrolment card further includes a second card body with a card engagement element. The second card body is sized to correspond to the first card body. The battery and the second microcontroller unit are embedded in the second card body. The enrolment card provides an enrolment mode, wherein the card engagement element engages with the first card body for allowing the contact pins to contact corresponding contact pads of the biometric card and the battery provides the electrical power to the biometric card.

Abstract: An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.

Abstract: An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.

Abstract: An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.

Abstract: The application provides an enrolment card for a biometric card with a first card body. The enrolment card includes a battery for providing electrical power, a microcontroller unit that is electrically connected to the battery, and a plurality of contact pins that are electrically connected to the battery and to the microcontroller unit. The enrolment card further includes a second card body with a card engagement element. The second card body is sized to correspond to the first card body. The battery and the second microcontroller unit are embedded in the second card body. The enrolment card provides an enrolment mode, wherein the card engagement element engages with the first card body for allowing the contact pins to contact corresponding contact pads of the biometric card and the battery provides the electrical power to the biometric card.

Abstract: An inlay for a card includes a first transparent overlay sheet, an antenna carrier sheet, a thickness compensation sheet, a second transparent overlay sheet. The inlay also includes a microcontroller, a module lead frame, a finger sensor lead frame, an antenna, and electrical wires. The module lead frame is adapted for being milled and includes a plurality of first contact pads for contacting a contact module. The finger sensor lead frame is adapted for being milled and includes a plurality of second contact pads for contacting a fingerprint sensor. The electrical wires are connected to the microcontroller, to the first contact pads, to the second contact pads, and to the antenna.

Abstract: An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.