RFID inlay
Latest AdvanIDe Holdings Pte. Ltd. Patents:
Description
The broken line showing in the Figures shows environment and forms no part of the claimed design.
Claims
The ornamental design for an RFID inlay, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D1002596
Type: Grant
Filed: Dec 14, 2021
Date of Patent: Oct 24, 2023
Assignee: AdvanIDe Holdings Pte. Ltd. (Singapore)
Inventors: Holger Roessner (Singapore), Joe Lo (Singapore), Alejandro Placitelli (Montevideo)
Primary Examiner: Daniel J Domino
Assistant Examiner: Samina Vieth
Application Number: 29/819,298
Type: Grant
Filed: Dec 14, 2021
Date of Patent: Oct 24, 2023
Assignee: AdvanIDe Holdings Pte. Ltd. (Singapore)
Inventors: Holger Roessner (Singapore), Joe Lo (Singapore), Alejandro Placitelli (Montevideo)
Primary Examiner: Daniel J Domino
Assistant Examiner: Samina Vieth
Application Number: 29/819,298
Classifications
Current U.S. Class:
Antenna Or Component Thereof (27) (D14/230)