RFID inlay

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Description

FIG. 1 is a top view of an RFID inlay, showing our design;

FIG. 2 is a bottom view thereof; and,

FIG. 3 is an isometric view thereof.

The broken line showing in the Figures forms no part of the claimed design.

Claims

The ornamental design for an RFID inlay, as shown and described.

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Patent History
Patent number: D1031701
Type: Grant
Filed: Sep 11, 2023
Date of Patent: Jun 18, 2024
Assignee: AdvanIDe Holdings Pte. Ltd. (Singapore)
Inventors: Holger Roessner (Singapore), Joe Lo (Singapore), Alejandro Placitelli (Montevideo)
Primary Examiner: Daniel J Domino
Assistant Examiner: Samina Vieth
Application Number: 29/911,880
Classifications