RFID inlay
Description
The broken line showing in the Figures forms no part of the claimed design.
Claims
The ornamental design for an RFID inlay, as shown and described.
Referenced Cited
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Patent History
Patent number: D1031701
Type: Grant
Filed: Sep 11, 2023
Date of Patent: Jun 18, 2024
Assignee: AdvanIDe Holdings Pte. Ltd. (Singapore)
Inventors: Holger Roessner (Singapore), Joe Lo (Singapore), Alejandro Placitelli (Montevideo)
Primary Examiner: Daniel J Domino
Assistant Examiner: Samina Vieth
Application Number: 29/911,880
Type: Grant
Filed: Sep 11, 2023
Date of Patent: Jun 18, 2024
Assignee: AdvanIDe Holdings Pte. Ltd. (Singapore)
Inventors: Holger Roessner (Singapore), Joe Lo (Singapore), Alejandro Placitelli (Montevideo)
Primary Examiner: Daniel J Domino
Assistant Examiner: Samina Vieth
Application Number: 29/911,880
Classifications
Current U.S. Class:
Antenna Or Component Thereof (27) (D14/230)