Abstract: The present disclosure provides a safe puncture needle, and relates to the technical field of medical devices, which comprises a needle holder, a base and a needle tubing, wherein the needle tubing comprises a needle tubing body and a needle tubing tip having a bent structure, the base comprises a base body and a guide block, the base body is provided with a second inner space, the base body is provided with a first through-hole and a second through-hole communicating with the second inner space, the guide block is provided with a third through-hole, the needle tubing body passes through the first through-hole and the third through-hole and is slidably connected to the guide block, and the needle tubing tip retracts from the second through-hole.

Abstract: A susceptor assembly for supporting a crucible during a crystal growth process includes a susceptor base, a tubular sidewall connected to the susceptor base, and a removable sacrifice ring interposed between the susceptor base and the sidewall. Each of the susceptor base and the sidewall is formed of a carbon-containing material. The susceptor base has an annular wall and a shoulder extending radially outward from an outer surface of the annular wall. The sidewall has a first end that receives the annular wall to connect the sidewall to the susceptor base. The sacrifice ring has a first surface that faces the outer surface of the annular wall, a second surface that faces an interior surface of the sidewall, and a ledge extending outward from the second surface that engages the first end of the sidewall.

Abstract: Disclosed are various examples of providing AI accelerator access as a service at the edge. In some embodiments an artificial intelligence (AI) accelerator device identifier is transmitted to register an AI accelerator with the AI broker service. An AI processing request for the AI accelerator is received from a networked computing device. A bus redirect of the AI accelerator to the networked device is enabled. An AI workload is performed controlled by the networked device through the bus redirect.

Abstract: Provided herein are antibodies that bind to the alpha subunit of an IL-7 receptor (IL-7R?). Also provided are uses of these antibodies in therapeutic applications, such as treatment of inflammatory diseases. Further provided are cells that produce the antibodies, polynucleotides encoding the heavy and/or light chain regions of the antibodies, and vectors comprising the polynucleotides.

Abstract: A micro light emitting diode structure including an epitaxial structure, a first insulating layer and a second insulating layer is provided. The epitaxial structure includes a first type semiconductor layer, a light emitting layer and a second type semiconductor layer. The first type semiconductor layer, the light emitting layer and a first portion of the second type semiconductor layer form a mesa. A second portion of the second type semiconductor layer is recessed relative the mesa to form a mesa surface. The first insulating layer covers from a top surface of the mesa to the mesa surface along a first side surface of the mesa, and exposes the second side surface. The second insulating layer directly covers a second side surface of the second portion, wherein a thickness ratio of the first insulating layer to the second insulating layer is between 10 and 50.

Abstract: The present application relates to a method for manufacturing a solar cell. In the method, a wafer including a substrate and a doped conducting layer is provided. A doped conducting layer is disposed at least on the first surface and the portion of the first side surface, thereby covering the textured structure. A passivating contact layer is formed on the second surface of the substrate. A first passivation layer is formed on the doped conducting layer. The first passivation layer covers the first surface and at least the portion of the first side surface, thereby covering at least the doped conducting layer. A second passivation layer is formed on the passivating contact layer. The second passivation layer covers the second surface, thereby covering the passivating contact layer.

Abstract: Methods and devices for video decoding are provided. The method includes: receiving a control variable associated with the video block at a coding level, where the control variable enables adaptive switch between a plurality of motion vector refinement (MVR) offset sets, and the video block comprises first and second geometric partitions; receiving one or more syntax elements to determine a first MVR offset for the first geometric partition and a second MVR offset for the second geometric partition from a selected MVR offset set; obtaining a first motion vector (MV) and a second MV from a candidate list for the first and second geometric partitions; calculating a first refined MV and a second refined MV based on the first and second MVs and the first and second MVR offsets; and obtaining prediction samples for the video block based on the first and second refined MVs.

Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.

Abstract: The present invention provides a chip-on-film (COF) packaging structure and a COF packaging method. The COF packaging structure includes a flexible substrate and a chip. The flexible substrate includes a first groove provided on a first surface of the flexible substrate, a protrusion provided in the first groove, and a substrate bonding pad disposed in the first groove. The chip includes a second groove provided on a second surface of the chip, and a chip bonding pad disposed on the second surface and corresponding to the substrate bonding pad. The first groove of the flexible substrate is matched with a peripheral shape of the chip, and the second groove is matched with the protrusion of the first groove to embed the chip in the flexible substrate. The chip bonding pad is electrically connected to the substrate bonding pad.

Abstract: An environment-friendly fire-retardant coating comprises a coating substrate and fire-extinguishing agent microcapsules which can be ruptured and vaporized to a release fire-extinguishing material to achieve the purposes of cooling and/or fire prevention and/or fire extinguishing upon being exposed to a temperature of not less than 75° C. and/or an open flame environment. In order to break the current situation that the traditional fire-prevention, fire-extinguishing and flame-retardant coatings can only prevent the spread of the fire area, but it is difficult to extinguish the fire sensitively and actively in a short time, there are provided a variety of coatings and/or films which can actively cool down, prevent fire and extinguish the fire, have short response time, have stable fire-extinguishing components in the coatings and/or films, with the films being able to trigger the fire extinguishment repeatedly.

Abstract: The present application relates to a method for manufacturing a solar cell. In the method, a wafer including a substrate and a doped conducting material layer is provided. A first surface and a portion of a first side surface of the substrate include a textured structure. The doped conducting material layer covers the textured structure. A passivating contact material layer is formed on each surface of the wafer. The wafer formed with the passivating contact material layer is cut along the thickness direction of the substrate to form a sub-wafer, so as to form a doped conducting layer. The passivating contact material layer is etched to form a passivating contact layer. A first passivation layer is formed on the doped conducting layer, and further covers at least a portion of a cut edge side surface which is a side surface of the sub-wafer formed by cutting the wafer.

Abstract: An electronic device and a method for diagnosing heart state based on electrocardiogram (ECG) are provided. An ECG file is obtained, and the ECG file is in a first file format and includes a plurality of potential traces of a plurality of leads. The ECG file is converted to a second file format to obtain electrocardiogram data corresponding to multiple leads. Each potential trace relative to time in the ECG file is converted to the ECG data of each lead. Integrated ECG data associated with the leads is generated based on the ECG data of the plurality of leads through the zero-padding operation and the stacking operation. A diagnostic result of heart status is generated based on the integrated ECG data and a deep learning model.

Abstract: The present application relates to a solar cell and a method for manufacturing same, a photovoltaic module, and a photovoltaic system. The solar cell includes a substrate, a doped conducting layer, a first passivation layer, a passivating contact layer, and a second passivation layer. At least a first surface and a portion of a first side surface of the substrate include a textured structure. The doped conducting layer is disposed at least on the first surface and the first side surface to cover the textured structure. The first passivation layer is stacked on the doped conducting layer and covers the first surface and the first side surface to cover the doped conducting layer. The passivating contact layer is disposed on a second surface of the substrate. The second passivation layer is stacked on the passivating contact layer and covers the second surface to cover the passivating contact layer.

Abstract: Methods and systems are provided for increasing a quality of computed tomography (CT) images reconstructed from high helical pitch scans. In one embodiment, the current disclosure provides for a method comprising generating a first computed tomography (CT) image from projection data acquired at a high helical pitch; using a trained multidimensional statistical regression model to generate a second CT image from the first CT image, the multidimensional statistical regression model trained with a plurality of target CT images reconstructed from projection data acquired at a lower helical pitch; and performing an iterative correction of the second CT image to generate a final CT image.

Abstract: A touch circuit includes: a touch IC; a first pull-up sub-circuit; a second pull-up sub-circuit; a first switching sub-circuit configured to transmit a signal from a data signal input terminal to a data signal port under control of a signal from a first signal input terminal; and a second switching sub-circuit configured to transmit a signal from a clock signal input terminal to a clock signal port under control of the signal from the first signal input terminal. The signal from the data signal input terminal is transmitted to the first switching sub-circuit earlier than the signal from the first signal input terminal, and the signal from the clock signal input terminal is transmitted to the second switching sub-circuit earlier than the signal from the first signal input terminal.

Abstract: A method for retrieving a program data and a circuit system thereof are provided. The method that uses a dynamic packet identifier (PID) filter to retrieve the program data can be applied to a digital TV system. In the method, a master guide table is retrieved from a transport stream of digital TV signals, and a parsing method is executed to obtain a series of the PIDs. A polling method is used to obtain the program data corresponding to each of the PIDs. A filter window is applied to scan the PIDs for polling the program data corresponding to each of a group of the PIDs at once. After that, the filter window is shifted to a next group of the PIDs for polling the program data with respect to each of the PIDs, and an electronic program guide is accordingly formed.

Abstract: The present application relates to a passivating contact structure and a preparation method thereof, and a solar cell and a preparation method thereof. In the method for preparing the passivating contact structure, a tunnel layer is formed on a side of a substrate; an initial stack structure is formed on a side of the tunnel layer away from the substrate. The initial stack structure includes polysilicon layers and a doped layer alternately stacked. In the initial stack structure, an innermost layer is most adjacent to the tunnel layer, an outermost layer is most away from the tunnel layer, the innermost layer and the outermost layer are both polysilicon layers. The doped layer is a polysilicon material layer doped with a dopant. The dopant is activated, such that the dopant diffuses into the polysilicon layers, thereby transforming the initial stack structure into a doped stack structure with uniform distribution of dopant.

Abstract: An electronic device including a metal back cover, a metal frame, a first radiator and a second radiator is provided. The metal frame includes a disconnected part and two connecting parts, the two connecting parts are located at two sides of the disconnected part, separated from the disconnected part and connected to the metal back cover. A U-shaped slot is formed between the disconnected part and the metal back cover, and between the disconnected part and the two connecting parts. The first radiator is located beside the disconnected part and includes a feeding end and a first connecting end away from the feeding end, and the first connecting end is connected to the disconnected part. The second radiator is located beside the disconnected part, and includes a ground end and a second connecting end opposite to each other. The ground end is connected to the metal back cover.

Abstract: The application provides a solar cell, a manufacturing method, a photovoltaic device and a photovoltaic system. The solar cell includes a substrate, a doped conducting layer, a first passivation layer, an anti-reflection layer, a passivation contact layer, and a second passivation layer. The substrate includes opposite first and second surfaces, and side surfaces between the first and second surfaces. The doped conducting layer and the first passivation layer are sequentially stacked on the first surface. The anti-reflection layer is stacked on the first passivation layer and covers the first surface to cover the first passivation layer. The passivation contact layer is stacked on the second surface. The second passivation layer is stacked on the passivation contact layer and covers the second surface to cover the passivation contact layer. The anti-reflection layer or the second passivation layer covers at least part of at least one side surface of the substrate.

Abstract: A lens module includes: a lens barrel including a annular structure, an inner annular surface surrounding the central axis and an outer annular surface opposite to and surrounding the inner annular surface, wherein the inner annular surface forms an accommodating space; an optical lens assembly and an optical filter sequentially disposed in the accommodating space from the object side to the image side; wherein the annular structure is disposed on the inner annular surface and surrounds the central axis, the annular structure includes at least two step portions and at least two bevel portions, all the step portions and the bevel portions are close to the image side, and the optical filter is disposed on the step portions; and the step portions and the bevel portions are alternately disposed along a annular path of the inner annular surface.