Abstract: A multi-layer stacked chip package is provided. A first substrate, a first circuit layer, a first chip, and a first insulation layer form a lower layer chip package while a second substrate, a second circuit layer, a second chip, and a second insulation layer form an upper layer chip package. The upper layer chip package is stacked over the lower layer chip package so that the multi-layer stacked chip package is formed by such stacking mode. One of the at least two chips is used to operate the rest chips or computing functions of the respective chips are combined to increase overall computing performance.

Abstract: A chip package which includes a chip, at least one first dielectric layer, at least one second dielectric layer, at least one conductive circuit, and at least one third dielectric layer is provide. The conductive circuit is formed by highly concentrated silver paste or copper paste filled in at least one first groove of the first dielectric layer and at least one second groove of the second dielectric layer while at least one die pad of the chip is electrically connected with the conductive circuit for improving electrical conduction efficiency of the conductive circuit. Moreover, at least one die-pad bump is formed in the first groove, arranged at and electrically connected with a surface of the die pad for protecting of the die pad.

Abstract: A chip package with higher bearing capacity in wire bonding is provided. The chip package includes at least one conductive circuit which is a structure with a thickness ranging from 4.5 ?m to 20 ?m. Thereby a structural strength of the conductive circuit is improved and able to stand a positive pressure generated in wire bonding or formation of a first bonding point. Thus at least one internal circuit of a chip will not be damaged by the positive pressure and allowed to pass through an area under the first bonding point or arrange under the first bonding point. A problem of increased cost at manufacturing end caused by the internal circuit redesign of the chip can be solved effectively. This is beneficial to cost reduction at manufacturing end.

Abstract: A chip package and a method of manufacturing the same are provided. The chip package includes at least one insulating protective layer disposed on a periphery of a surface of a seed layer correspondingly. A plurality of insulating protective layers is arranged at the seed layer of a plurality of rectangular chips of a wafer and located corresponding to a plurality of dicing streets. Thereby cutting tools only cut the insulating protective layer, without cutting a thick metal layer during cutting process. The insulating protective layer is formed on a periphery of the thick metal layer of the chip package after the cutting process.

Abstract: A bump of a chip package with higher bearing capacity in wire bonding is provided. The at least one bump of the chip package is a metal stacked member with a certain thickness. An overall thickness of the bump is 4.5-20 ?m. Thereby a structural strength of the bump is improved and thus able to bear positive pressure generated in wire bonding or formation of a first bonding point. Thus at least one internal circuit of a chip will not be damaged by the positive pressure and allowed to pass through an area under at least one die pad or arrange under the die pad of the chip. Thereby increased cost problem caused by internal circuit redesign of the chip can be solved and this helps to reduce cost at manufacturing end.

Abstract: A dynamic prediction model establishment method, an electric device and a user interface are provided. The dynamic prediction model establishment method includes the following steps. An integration model is established by a processing device according to at least one auxiliary data set. The integration model is modified as a dynamic prediction model by the processing device according to a target data set. A sampling point recommendation information is provided by the processing device according to an error degree or an uncertainty degree between the at least one auxiliary data set and the target data set.

Abstract: A connector includes a housing, an adapter plate, a flexible transmitter, a conductive tab and a conductive connection tab. The housing is provided with an accommodation cavity. One end of the adapter plate is mounted on an inner wall of the housing, and the other end of the adapter plate extends out of one end of the accommodation cavity. The flexible transmitter is accommodated in the accommodation cavity. One end of the flexible transmitter is connected to the adapter plate. The conductive tab is accommodated in the accommodation cavity. One end of the conductive tab is connected to the other end of the flexible transmitter. The conductive connection tab is accommodated in the accommodation cavity. One end of the conductive connection tab is connected to the adapter plate, the other end of the conductive connection tab is connected to the conductive tab, and the conductive connection tab is deformable.

Abstract: An optimum sampling search system and method with risk assessment, and a graphical user interface are provided. The optimum sampling search system includes a data acquisition unit, an objective satisfaction score calculation unit, a constraint satisfaction probability calculation unit, a sampling risk evaluation unit, and an adjusting unit. If the constraint satisfaction probability of a recommended sampling parameter is between a first predetermined value and a second predetermined value, the recommended sampling parameter is adjusted, by the adjusting unit, to optimize a constraint satisfaction probability model.

Abstract: The present disclosure provides an electrical connector and a connector assembly. The electrical connector comprises a first sleeve, a first cover, and a sealing member. The first sleeve comprises a first mating opening and a first connecting end surface. The first connecting end surface is disposed at the periphery of the first mating opening. The first cover is disposed in the first sleeve. The first cover comprises a first mating surface exposed from the first mating opening. The sealing member is disposed on a side surface of the first cover and surrounds the first cover. The sealing member is disposed between the first sleeve and the first cover. The sealing member comprises a sealing sheet extending from the first mating surface in a direction close to the first connecting end surface of the first sleeve.

Abstract: A system and a method for parameter optimization with adaptive search space and a user interface using the same are provided. The system includes a data acquisition unit, an adaptive adjustment unit and an optimization search unit. The data acquisition unit obtains a set of executed values of several operating parameters and a target parameter. The adaptive adjustment unit includes a parameter space transformer and a search range definer. The parameter space transformer performs a space transformation on a parameter space of the operating parameters according to the executed values. The search range definer defines a parameter search range in a transformed parameter space based on the sets of the executed values. The optimization search unit takes the parameter search range as a limiting condition and takes optimizing the target parameter as a target to search for a set of recommended values of the operating parameters.

Abstract: The present disclosure provides an electrical connector and a connector assembly. The electrical connector comprises a first sleeve, a first cover, and a sealing member. The first sleeve comprises a first mating opening and a first connecting end surface. The first connecting end surface is disposed at the periphery of the first mating opening. The first cover is disposed in the first sleeve. The first cover comprises a first mating surface exposed from the first mating opening. The sealing member is disposed on a side surface of the first cover and surrounds the first cover. The sealing member is disposed between the first sleeve and the first cover. The sealing member comprises a sealing sheet extending from the first mating surface in a direction close to the first connecting end surface of the first sleeve.

Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body having a topmost surface; a first light-emitting device disposed on the carrier body and having a light-emitting surface; and a light-receiving device comprising a group III-V semiconductor material disposed on the carrier body and having a light-receiving surface. The light-emitting surface is separated from the topmost surface by first distant H1, the light-receiving surface is separated from the topmost surface by a second distance H2, and H1 is different from H2.

Abstract: The present disclosure relates to a device authentication method as a procedure designed for authenticity of an apparatus. A connecting apparatus to be authenticated and an authentication box are connected to a trusted network through which authentication information is received by the connecting apparatus. The connecting apparatus is electrically connected to a non-trusted network through which the connecting apparatus and an intermediary server are electrically connected with each other; a virtual hub network is created by the intermediary server and electrically connected to both the authentication box and the connecting apparatus such that the connecting apparatus is authenticated by authentication box based on the authentication information.

Abstract: An electronic cigarette structure includes a casing having an e-liquid chamber and an opening in communication therewith, a cotton body, an airflow duct, an atomizer, and a cover on the opening and sealing the components above in the chamber. The cotton body is disposed in the e-liquid chamber for absorbing the e-liquid. The airflow duct is hollow and combined into the cotton body in the e-liquid chamber. The atomizer is disposed in the through hole of the airflow duct, so as to thermally atomize the e-liquid for producing smoke. The cover has a via hole in communication with the through hole, so that the smoke generated in the through hole is sucked out from the via hole. Thus, the tar separation is avoided, and the e-liquid is prevented from leaking.

Abstract: The embodiments of the present disclosure provide an electromagnetic shielding fiber, a cable and a cable manufacturing method. The electromagnetic shielding fiber comprises 100 parts by weight of polyester fiber, 40 to 60 parts by weight of copper, 2 to 10 parts by weight of curing agent, 20 to 30 parts by weight of nickel, 5 to 15 parts by weight of microwave absorber, and 2 to 5 parts by weight of dye. The electromagnetic shielding fiber of this disclosure performs excellent electromagnetic shielding and heat dissipation. The cable having the electromagnetic shielding layer made of the electromagnetic shielding layer of the present disclosure performs great electromagnetic shielding and data and signal transmission, and also reduces the costs of products.

Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.

Abstract: The present disclosure relates to a data retention method which ensures security of classified information in design. The data retention method comprises steps as follows: a data plug of a dedicated storage module is inserted into a data socket of an encryption module and a locking element of a lock fastener module is fixed at a locking hole on the dedicated storage module; the encryption module and the dedicated storage module are electrically connected to each other through the data socket; an external component of the encryption module is electrically connected to an external device such that classified information (saved or to be saved) is encrypted or decrypted between the external device and a storage element of the dedicated storage module by an encryption component of the encryption module during data exchanges.

Abstract: An optimum sampling search system and method with risk assessment, and a graphical user interface are provided. The optimum sampling search system includes a data acquisition unit, an objective satisfaction score calculation unit, a constraint satisfaction probability calculation unit, a sampling risk evaluation unit, and an adjusting unit. If the constraint satisfaction probability of a recommended sampling parameter is between a first predetermined value and a second predetermined value, the recommended sampling parameter is adjusted, by the adjusting unit, to optimize a constraint satisfaction probability model.

Abstract: The present application relates to a storage device with a message projection function such that image light from an image generation unit of an information outlet, which has been electrically connected with an dedicated storage module, passes through and is diffused by a diffusion unit for projection of a created virtual image on a surface.