Patents by Inventor Hong-Da Chang

Hong-Da Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080210963
    Abstract: A light emitting diode package structure has a silicon substrate, a plurality of cup-structures on the silicon substrate, a plurality of conductive patterns disposed on the silicon substrate, one of a plurality of light emitting diodes respectively disposed on each cup-structure and a plurality of wires electrically connected to the light emitting diodes and the conductive patterns. The light emitting diodes are electrically connected in series through the conductive wires and the conductive patterns.
    Type: Application
    Filed: August 20, 2007
    Publication date: September 4, 2008
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Publication number: 20080197370
    Abstract: A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.
    Type: Application
    Filed: April 18, 2007
    Publication date: August 21, 2008
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Publication number: 20080191605
    Abstract: A white light emitting diode package structure having a silicon substrate is disclosed. The white light emitting diode package structure comprises a silicon substrate having a plurality of cup-structures thereon, one of a plurality of blue light emitting diodes is respectively disposed in each cup-structure, and a phosphor structure covering the silicon substrate and the cup-structures. The blue light emitting diodes have various wavelengths and the phosphor structure has a plurality of kinds of phosphor powders and a sealing material. Each kind of phosphor powder is able to convert blue light within a certain wavelength into yellow light.
    Type: Application
    Filed: April 18, 2007
    Publication date: August 14, 2008
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Publication number: 20080194054
    Abstract: An LED array package structure having a silicon substrate is disclosed. The LED array package structure comprises a silicon substrate having a plurality of cup-structures thereon, a reflective layer disposed on the silicon substrate, a transparent insulation layer disposed on the reflective layer, a conductive layer disposed on the transparent insulation layer and a plurality of LEDs disposed respectively on the conductive layer in each cup-structures.
    Type: Application
    Filed: April 16, 2007
    Publication date: August 14, 2008
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Publication number: 20080096137
    Abstract: A method for fabricating flow channel capable of balancing air pressure. A device wafer is provided, and a plurality of chambers not conducting to each other are formed on the front surface of the device wafer. Subsequently, a plurality of flow channels are formed on the front surface of the device wafer, and the chambers are conducting to each other by virtue of the flow channels. The front surface of the device wafer is then adhered to a carrier wafer. The pressure inside the chambers and that outside the chambers is therefore balanced.
    Type: Application
    Filed: June 13, 2007
    Publication date: April 24, 2008
    Inventor: Hong-Da Chang
  • Publication number: 20060276006
    Abstract: A method of segmenting a wafer. A device wafer is provided, and a medium layer is formed on the upper surface of the device wafer. Then, a carrier wafer is provided, and the medium layer is mounted on the surface of the carrier wafer. Subsequently, a segment process is performed to form a plurality of dies, and meanwhile these dies are mounted on the medium layer. Thereafter, the carrier wafer is departed from the medium layer, the dies are bonded to an extendable film, and the medium layer is removed.
    Type: Application
    Filed: October 20, 2005
    Publication date: December 7, 2006
    Inventors: Chen-Hsiung Yang, Shih-Feng Shao, Hong-Da Chang