Patents by Inventor Hong Dai

Hong Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240093608
    Abstract: A tunnel automatic monitoring and measuring equipment and method based on fixed-point tour measurement are provided. The equipment includes a monitoring trolley that can move freely in the longitudinal direction of the tunnel, multiple automatic tracking and identification devices are set on the monitoring trolley, the automatic tracking and identification device is connected to the background processing system telecommunication; a monitoring points with reflective markings are arranged on the surface of the tunnel support structure, under the cooperation of the monitoring trolley and the automatic tracking and identification device, the reflective markings set on the tunnel support structure can be automatically measured at the fixed point to obtain the coordinate information of the relevant monitoring points; then, the deformation data of the support structure required in the construction process are extracted by coordinate information calculation.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 21, 2024
    Applicant: Guizhou Transportation Planning Survey & Design Academe Co.LTD
    Inventors: Qiang HU, Bin DU, Yicheng WANG, Xiaoyong LIU, Deming GOU, Hong YANG, Junwei CHUN, Mingfang WU, Mingjiang DAI
  • Patent number: 11934219
    Abstract: An aspect of the disclosure relates to an integrated circuit (IC). The IC includes a first set of test clock controllers (TCCs) including a first set of clock outputs, respectively; and a first set of functional cores including a first set of clock inputs coupled to the first set of clock outputs of the first set of TCCs, respectively.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: March 19, 2024
    Assignee: QUALCOMM INCORPORATED
    Inventors: Arvind Jain, Divya Gangadharan, Muhammad Nasir, Hong Dai, Madan Krishnappa
  • Publication number: 20240087662
    Abstract: A system for repairing a random access memory may include serial test interface logic, fuse-sense logic, a repair data register chain, and multiplexing logic. The repair data register chain may include serially interconnected data registers configured to shift data through the repair data register chain. Each data register of the repair data register chain may have a data output configured to be coupled to a repair information input of the random access memory. The multiplexing logic may be configured to provide a soft-repair mode and a hard-repair mode. When the soft-repair mode is selected, the multiplexing logic may be configured to receive soft-repair data provided by the serial test interface logic into the data registers. When the hard-repair mode is selected, the multiplexing logic may be configured to receive the data provided by the fuse-sense logic into the data registers.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Inventors: HONG DAI, Amir BOROVIETZKY, Arvind JAIN, Massine BITAM, Madan KRISHNAPPA
  • Publication number: 20230380571
    Abstract: A makeup applicator head, adapted for applying cosmetic material on skin surface of user, includes an applicator body having at least an exterior surface portion forming a makeup surface which is a continuous surface made of rigid material and configured for attaching the cosmetic material thereon. The makeup surface has at least an end portion and at least one side portion extended from the end portion towards the connection end.
    Type: Application
    Filed: August 11, 2023
    Publication date: November 30, 2023
    Inventor: Hong Dai
  • Patent number: 11814465
    Abstract: An organic-inorganic hybrid material is disclosure. The organic-inorganic hybrid material contains 5˜50 wt % of inorganic compounds and has a characteristic peak at 1050±50 cm?1 in FTIR spectrum. Furthermore, the invention also provides a fabricating process of the organic-inorganic hybrid material as well as its starting material “isocyanates”. In particular, the isocyanates are prepared from carbonate containing compounds and amines.
    Type: Grant
    Filed: August 23, 2022
    Date of Patent: November 14, 2023
    Assignee: CHANDA CHEMICAL CORP.
    Inventors: Sheng-hong A. Dai, Chien-Hsin Wu, Ying-Chi Huang, Yu-Hsiang Huang, Shih-Chieh Yeh, Ru-Jong Jeng, Jau-Hsiang Yang
  • Publication number: 20230357226
    Abstract: The disclosure relates to a preparation method and use of a pyrazole compound containing 1-(3,4-dimethoxyphenyl)-?-carboline unit. The pyrazole compound is prepared by reacting pyrazole aldehyde and 1-(3,4-dimethoxyphenyl)-?-carboline acylhydrazine. The pyrazole compound containing 1-(3,4-dimethoxyphenyl)-?-carboline unit has good inhibitory activity against tumor cell HGC-27. The pyrazole compound could be used in the preparation of anti-tumor drugs.
    Type: Application
    Filed: August 25, 2021
    Publication date: November 9, 2023
    Inventors: Hong DAI, Heyi MIAO, Meiling HUANG, Cheng QIAN, Dandan ZHENG, Yan ZHANG, Yong WANG, Yang WANG, Beibei ZHOU, Haijun ZHANG
  • Publication number: 20230348448
    Abstract: The present disclosure provides a preparation method and use of pyrazole acylhydrazone containing a trifluoromethylthiadiazole unit, which relates to the technical field of chemical pesticides. The pyrazole acylhydrazone containing a trifluoromethylthiadiazole unit provided by the present disclosure is obtained by the condensation of trifluoromethylthiadiazole hydrazide and pyrazole aldehyde. The pyrazole acylhydrazone containing a trifluoromethylthiadiazole unit has an excellent control effect on plant pathogens, and the compound can be used to prepare bactericides in the fields of agriculture, horticulture, etc.
    Type: Application
    Filed: July 1, 2021
    Publication date: November 2, 2023
    Inventors: Hong DAI, Dandan ZHENG, Heyi MIAO
  • Publication number: 20230315141
    Abstract: An aspect of the disclosure relates to an integrated circuit (IC). The IC includes a first set of test clock controllers (TCCs) including a first set of clock outputs, respectively; and a first set of functional cores including a first set of clock inputs coupled to the first set of clock outputs of the first set of TCCs, respectively.
    Type: Application
    Filed: March 29, 2022
    Publication date: October 5, 2023
    Inventors: Arvind JAIN, Divya GANGADHARAN, Muhammad NASIR, Hong DAI, Madan KRISHNAPPA
  • Patent number: 11673991
    Abstract: A thermal plastic polyurethane with a stress more than 2.5 MPa, its preparing formulation and making process are disclosed. In particular, the thermal plastic polyurethane with a stress more than 2.5 MPa is prepared from a formulation comprises a polycarbonate derivative and a chain extender.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: June 13, 2023
    Assignee: CHANDA CHEMICAL CORP.
    Inventors: Chien-Hsin Wu, Ying-Chi Huang, Sheng-hong A. Dai, Ru-Jong Jeng
  • Patent number: 11650489
    Abstract: The invention provides an optical engine module and a projector including the optical engine module. The optical engine module includes a casing, a light valve, a prism assembly and a fan assembly. The casing has an assembly port. The light valve is disposed at the assembly port and defines an accommodating space with the casing. The prism assembly is disposed in the accommodating space, and the light valve is configured to convert an illumination beam from the prism assembly into an image beam. The prism assembly includes a first region and a second region. The first region includes a light incident surface of the prism assembly, and a temperature of the second region is higher than a temperature of the first region. The fan assembly is disposed in the accommodating space. Airflow provided by the fan assembly circulates in the accommodating space.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: May 16, 2023
    Assignee: Coretronic Corporation
    Inventors: Jhih-Tong Chen, Jia-Hong Dai
  • Publication number: 20230057909
    Abstract: A projection device includes a heat source and a heat dissipation module, including a heat dissipation base, a heat dissipation fin set, at least one heat conductor, a first fan and a second fan. The heat dissipation fin set has first and second regions adjacent to each other. The first region is located between the heat dissipation base and the second region. The first region has two opposite first ventilation surfaces. The second region has two opposite second ventilation surfaces. There is an angle between a normal direction of the first ventilation surface and a normal direction of the second ventilation surface. The heat conductor is connected between the heat dissipation base and the heat dissipation fin set. The first fan generates a first airflow flowing through the first ventilation surfaces. The second fan generates a second airflow flowing through the second ventilation surfaces.
    Type: Application
    Filed: August 18, 2022
    Publication date: February 23, 2023
    Inventors: JIA-HONG DAI, WEI-CHI LIU
  • Publication number: 20230002537
    Abstract: An organic-inorganic hybrid material is disclosure. The organic-inorganic hybrid material contains 5˜50 wt % of inorganic compounds and has a characteristic peak at 1050±50 cm?1 in FTIR spectrum. Furthermore, the invention also provides a fabricating process of the organic-inorganic hybrid material as well as its starting material “isocyanates”. In particular, the isocyanates are prepared from carbonate containing compounds and amines.
    Type: Application
    Filed: August 23, 2022
    Publication date: January 5, 2023
    Inventors: Sheng-hong A. Dai, Chien-Hsin Wu, Ying-Chi Huang, Yu-Hsiang Huang, Shih-Chieh Yeh, Ru-Jong Jeng, Jau-Hsiang Yang
  • Patent number: 11520219
    Abstract: The invention provides a heat dissipating module configured to dissipate heat of at least one heating element of a projection device. The heat dissipating module includes a first radiator, a second radiator, a pipe, and at least one fan. The second radiator is disposed opposite to the first radiator. The heating element, the first radiator, and the second radiator are connected to each other through the pipe to form a loop. A working fluid is configured to be filled in the pipe, and the working fluid flows through the first radiator after flowing through the second radiator for heat exchange, and the working fluid flowing into the first radiator flows to the heating element for cyclic heat dissipation after heat exchange again through the first radiator. The fan is configured between the first radiator and the second radiator.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: December 6, 2022
    Assignee: Coretronic Corporation
    Inventors: Jia-Hong Dai, Jing-Wei Chen, Jhih-Tong Chen, Kai-Lun Hou, Te-Ying Tsai
  • Publication number: 20220382136
    Abstract: A heat dissipation module is for a wheel module with a motor. The heat dissipation module includes a supporting member and a fan. The supporting member has a supporting portion, a fixing portion and connecting portions. The fixing portion is located in a ventilation hole of the supporting portion and connected to the supporting portion by the connecting portions. The fixing portion has opposite first and second side surfaces. The first side surface is connected to the motor. The fan is disposed on the second side surface. The fan has an air outlet facing the ventilation hole. On a plane parallel to the first side surface, the air outlet and the ventilation hole partially overlap, a cross-sectional area of the ventilation hole is greater than that of the fixing portion, and the cross-sectional area of the fixing portion is greater than or equal to that of the motor.
    Type: Application
    Filed: May 30, 2022
    Publication date: December 1, 2022
    Inventors: TE-YING TSAI, JIA-HONG DAI
  • Publication number: 20220325029
    Abstract: A thermal plastic polyurethane with a stress more than 2.5 MPa, its preparing formulation and making process are disclosed. In particular, the thermal plastic polyurethane with a stress more than 2.5 MPa is prepared from a formulation comprises a polycarbonate derivative and a chain extender.
    Type: Application
    Filed: June 29, 2022
    Publication date: October 13, 2022
    Inventors: Chien-Hsin Wu, Ying-Chi Huang, Sheng-hong A. Dai, Ru-Jong Jeng
  • Patent number: 11453743
    Abstract: A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: September 27, 2022
    Assignee: CHANDA CHEMICAL CORP.
    Inventors: Chien-Hsin Wu, Ying-Chi Huang, Kuan-Ting Chen, Chia-Hsuan Lin, Sheng-Hong A. Dai, Ru-Jong Jeng
  • Patent number: 11453738
    Abstract: An organic-inorganic hybrid material is disclosure. The organic inorganic hybrid material contains 5˜50 wt % of inorganic compounds and has a characteristic peak at 1050±50 cm?1 in FTIR spectrum. Furthermore, the invention also provides a fabricating process of the organic-inorganic hybrid material as well as its starting material “isocyanates”. In particular, the isocyanates are prepared from carbonate containing compounds and amines.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: September 27, 2022
    Assignee: CHANDA CHEMICAL CORP.
    Inventors: Sheng-hong A. Dai, Chien-Hsin Wu, Ying-Chi Huang, Yu-Hsiang Huang, Shih-Chieh Yeh, Ru-Jong Jeng, Jau-Hsiang Yang
  • Publication number: 20220267297
    Abstract: The present disclosure relates to a 2-substituted imidazolidine derivative containing an aryl bipyridyloxy structure, and a preparation method and use thereof, which is obtained by the reaction of 2-substituted imidazolidine and aryl bipyridyloxy compound. The 2-substituted imidazolidine derivative containing an aryl bipyridyloxy structure has a good insecticidal effect on harmful insects, and the compound can be used to prepare insecticides in the fields of agriculture, horticulture, etc.
    Type: Application
    Filed: August 25, 2021
    Publication date: August 25, 2022
    Inventors: Hong Dai, Ruijian Yan, Heyi Miao, Zhipeng Wang, Dandan Zheng, Yan Zhang, Zichan Zhang, Lei Shi, Jianhua Li, Haijun Zhang
  • Patent number: 11199764
    Abstract: A light wavelength conversion element is configured to receive an excitation beam from a light incident side, comprising a substrate and a light wavelength conversion substance. The substrate has a surface facing the light incident side. The surface has at least one microstructure protruded toward the light incident side. The light wavelength conversion substance is disposed on the surface and covers the at least one microstructure. The light wavelength conversion substance is excited by the excitation beam and emits a conversion beam. The excitation beam forms an exciting light spot on the light wavelength conversion substance. The energy density distribution of the exciting light spot has at least one peak value. A position corresponding to the at least one peak value on the light wavelength conversion substance corresponds to a position of the at least one microstructure. Additionally, a projection apparatus is provided.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: December 14, 2021
    Assignee: Coretronic Corporation
    Inventors: Jia-Hong Dai, Te-Ying Tsai, Chia-Lun Tsai, Chuan-Hui Liu
  • Publication number: 20210380756
    Abstract: A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).
    Type: Application
    Filed: June 5, 2020
    Publication date: December 9, 2021
    Inventors: Chien-Hsin Wu, Ying-Chi Huang, Kuan-Ting Chen, Chia-Hsuan Lin, Sheng-hong A. Dai, Ru-Jong Jeng