Patents by Inventor Hong Jiang

Hong Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250145697
    Abstract: The present disclosure encompasses compositions and methods for effectively treating at least one symptom or sign of A? plaque or cerebral amyloid angiopathy (CAA) associated symptoms, or for decreasing amyloid plaque load or CAA load. The method comprises administering an effective amount of an anti-ApoE antibody to a mammalian subject, such as to a human.
    Type: Application
    Filed: November 8, 2024
    Publication date: May 8, 2025
    Inventors: David Holtzman, Hong Jiang, Thu Nga Bien-Ly, Mark S. Dennis, Jing Guo, Adam P. Silverman, Ryan J. Watts, Yin Zhang
  • Publication number: 20250132258
    Abstract: A device structure may include an interconnect-level dielectric material layer located over a substrate, a first metal interconnect structure embedded in the interconnect-level dielectric material layer and including a first metallic barrier liner and a first metallic fill material portion, and an overlying dielectric material layer. An opening in the overlying dielectric material layer may be formed entirely within an area of the first metallic barrier layer and outside the area of the first metallic fill material portion to reduce plasma damage. A second metal interconnect structure contacting a top surface of the first metallic barrier liner may be formed in the opening. An entirety of a top surface the first metallic fill material portion contacts a bottom surface of the overlying dielectric material layer.
    Type: Application
    Filed: December 16, 2024
    Publication date: April 24, 2025
    Inventors: Jheng-Hong Jiang, Chia-Wei Liu, Shing-Huang Wu
  • Patent number: 12278854
    Abstract: A communication server and accompanying communication devices allow near instantaneous communication between users of the communication devices. A communication device may be configured with multiple channels, where each channel is assigned a corresponding communication device. As the communication devices are registered with the communication server, each communication device has knowledge of other registered communication devices. Thus, communication devices may communicate nearly instantaneously with each other. Furthermore, as the communication device is equipped with multiple channels, a single communication device may host a conference call with other communication devices. In addition, communication device may include multiple buttons to control the communication device, and indicator lights to indicate the status of calls with other communication devices.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: April 15, 2025
    Inventor: Hong Jiang
  • Publication number: 20250110741
    Abstract: An apparatus to facilitate supporting 8-bit floating point format for parallel computing and stochastic rounding operations in a graphics architecture is disclosed. The apparatus includes a processor comprising: a decoder to decode an instruction fetched for execution into a decoded instruction, wherein the decoded instruction is a matrix instruction that is to operate on 8-bit floating point operands to perform a parallel dot product operation; a scheduler to schedule the decoded instruction and provide input data for the 8-bit floating point operands in accordance with an 8-bit floating data format indicated by the decoded instruction; and circuitry to execute the decoded instruction to perform 32-way dot-product using 8-bit wide dot-product layers, each 8-bit wide dot-product layer comprises one or more sets of interconnected multipliers, shifters, and adders, wherein each set of multipliers, shifters, and adders is to generate a dot product of the 8-bit floating point operands.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Applicant: Intel Corporation
    Inventors: Jorge Eduardo Parra Osorio, Fangwen Fu, Guei-Yuan Lueh, Hong Jiang, Jiasheng Chen, Naveen K. Mellempudi, Kevin Hurd, Chunhui Mei, Alexandre Hadj-Chaib, Elliot Taylor, Shuai Mu
  • Patent number: 12261199
    Abstract: An integrated circuit (IC) device includes a chip having a semiconductor substrate and a thermoelectric module embedded in the semiconductor substrate, where the thermoelectric module includes a first semiconductor structure electrically connected to a second semiconductor structure, where a bottom portion of thermoelectric module extends through a thickness of the semiconductor substrate, and where the first semiconductor structure and the second semiconductor structure include dopants of different conductivity types.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: March 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jen-Yuan Chang, Jheng-Hong Jiang, Chin-Chou Liu, Long Song Lin
  • Patent number: 12261129
    Abstract: A damping device is provided. The damping device includes a damper including a mechanical deflector. The damping device includes a post coupled to the mechanical deflector. The damping device includes a case in which the damper is disposed.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: March 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Jheng-Hong Jiang, Shing-Huang Wu, Chia-Wei Liu
  • Publication number: 20250090653
    Abstract: The present disclosure relates to vaccines and related polynucleotides useful in eliciting an immune response to the SARS-CoV-2 virus and related methods of use. The vaccine formulations further comprise DNA vectors encoding SARS-Cov-2 spike protein variants comprising single amino acid substitutions and polynucleotides which encode an adjuvant, further wherein the vaccine is formulated with a proteolipid vesicle or fusogenic membrane protein.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 20, 2025
    Applicant: ENTOS PHARMACEUTICALS, INC.
    Inventors: Hong JIANG, John LEWIS, Arun RATURI, Thornton THOMPSON
  • Patent number: 12239034
    Abstract: A RRAM device is provided. The RRAM device includes: a bottom electrode in a first dielectric layer; a switching layer in a second dielectric layer over the first dielectric layer, wherein a conductive path is formed in the switching layer when a forming voltage is applied; and a needle-like-shaped top electrode region in a third dielectric layer over the second dielectric layer. The needle-like-shaped top electrode region includes: an oxygen-rich dielectric layer, wherein a lower end of the oxygen-rich dielectric layer is a tip; and a top electrode over the oxygen-rich dielectric layer.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jheng-Hong Jiang, Shing-Huang Wu, Chia-Wei Liu
  • Patent number: 12237280
    Abstract: Devices and methods of manufacture for a graduated, “step-like,” semiconductor structure having two or more resonator trenches. A semiconductor structure may comprise a first resonator and a second resonator. The first resonator comprising a first metallic resonance layer and a capping plate having a bottom surface that is a first distance from a distal end of the first metallic resonance layer 128. The second resonator comprising a second metallic resonance layer and the capping plate, in which the bottom surface is a second distance from a from a distal end of the second metallic resonance layer 128b, and in which first distance is different from the second distance.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Jheng-Hong Jiang, Shing-Huang Wu, Chia-Wei Liu
  • Publication number: 20250060555
    Abstract: A lens assembly is provided, comprising a first lens, a first polarizing film, a second lens and a second polarizing film. The first lens provides a first surface, the first surface providing a plurality of first positioning parts. The first polarizing film is arranged on the first surface, a plurality of first position holes is defined on the first polarizing film. The second lens is arranged on one side of the first polarizing film away from the first lens, the second lens provides a second surface and a third surface, the second surface defines a plurality of first position grooves, the plurality of first position grooves matches with the plurality of first positioning parts, and the third surface provides a plurality of second positioning parts. The second polarizing film is arranged on the third surface, the second polarizing film defines a plurality of second position holes.
    Type: Application
    Filed: July 19, 2024
    Publication date: February 20, 2025
    Inventors: CHUNG-CHIAO HO, Yu-Pi Kuo, Chung-Wu Liu, Cheng-Hong Jiang
  • Publication number: 20250053613
    Abstract: Matrix multiply units can take advantage of input sparsity by zero gating ALUs, which saves power consumption, but compute throughput does not increase. To improve compute throughput from sparsity, processing resources in a matrix accelerator can skip computation with zero involved in input or output. If zeros in input can be skipped, the processing units can focus calculations on generating meaningful non-zero output.
    Type: Application
    Filed: August 22, 2024
    Publication date: February 13, 2025
    Applicant: Intel Corporation
    Inventors: Chunhui Mei, Hong Jiang, Jiasheng Chen, Yongsheng Liu, Yan Li
  • Patent number: 12205901
    Abstract: A device structure may include an interconnect-level dielectric material layer located over a substrate, a first metal interconnect structure embedded in the interconnect-level dielectric material layer and including a first metallic barrier liner and a first metallic fill material portion, and an overlying dielectric material layer. An opening in the overlying dielectric material layer may be formed entirely within an area of the first metallic barrier layer and outside the area of the first metallic fill material portion to reduce plasma damage. A second metal interconnect structure contacting a top surface of the first metallic barrier liner may be formed in the opening. An entirety of a top surface the first metallic fill material portion contacts a bottom surface of the overlying dielectric material layer.
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: January 21, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Jheng-Hong Jiang, Chia-Wei Liu, Shing-Huang Wu
  • Publication number: 20250017972
    Abstract: The present invention provides a composition comprising dendritic cells loaded with hHsp60sp, which dendritic cells are from a subject and have been fixed with paraformaldehyde (PFA). The subject may suffer from an autoimmune disease. Also provided are a method for preparing the composition; recombinant human cells comprising a heterologous gene encoding a fusion protein of HLA-E and hHsp60sp or B7sp, and expressing the fusion protein on the surface of the cells; a method for determining a percentage of maximum inhibition of testing the function of the HLA-E restricted CD8+ Treg cells from a subject, determining whether HLA-E restricted CD8+ Treg cells freshly isolated from a subject are defective, or determining whether defective HLA-E restricted CD8+ Treg cells from a subject are correctable; and a method for correcting defective HLA-E restricted CD8+ Treg cells, treating type 1 diabetes (T1D), or treating multiple sclerosis (MS).
    Type: Application
    Filed: October 1, 2024
    Publication date: January 16, 2025
    Applicant: Avotres, Inc.
    Inventor: Hong Jiang
  • Publication number: 20250020669
    Abstract: The present disclosure provides methods to detect and optionally quantify Nfl present in cerebrospinal fluid and blood and use of the methods to detect and optionally measure levels of Nfl biomarkers indicative of neuronal damage. Also disclosed are anti-Nfl antibodies.
    Type: Application
    Filed: February 10, 2022
    Publication date: January 16, 2025
    Inventors: Randall Bateman, Melissa Budelier, David Holtzman, Hong Jiang
  • Patent number: 12191247
    Abstract: Devices and methods of manufacture for a graduated, “step-like,” capacitance structure having two or more capacitors. A semiconductor structure comprising a capacitor structure, the capacitor structure comprising a first capacitor and a second capacitor. The first capacitor comprising a first bottom electrode and a top electrode having a bottom surface that is a first distance from a top surface of the first bottom electrode. The second capacitor comprising a second bottom electrode and the top electrode, in which the bottom surface is a second distance from a top surface of the second bottom electrode, and in which the first distance is different from the second distance.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: January 7, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Jheng-Hong Jiang, Shing-Huang Wu, Chia-Wei Liu
  • Publication number: 20250007384
    Abstract: The application discloses an anti-driving interference power module which comprises at least one half-bridge power module. The half-bridge power module comprises a first switch device, a second switch device, a DC positive terminal and a DC negative terminal. The DC positive terminal, the first switch device, the second switch device and the DC negative terminal form a filtering loop which is the same as the second driving loop of the second switch device. According to the application, through the coupling design of the detour direction of the circuit, the driving crosstalk generated by the gate is inhibited for the device which does not need to be turned on, and mistaken opening of driving is avoided; and for the device needing to be opened, the turn-on level driven by the gate is enhanced, so that the reliability of the power module is higher.
    Type: Application
    Filed: June 27, 2024
    Publication date: January 2, 2025
    Applicant: SHANGHAI METAPWR ELECTRONICS CO., LTD
    Inventors: Shouyu Hong, Xiaoni Xin, Dong Xu, Hong Jiang
  • Publication number: 20250007385
    Abstract: The application discloses an ANPC power module. at least one power module, wherein the power module comprises six switch assemblies, a DC end, a GND end and an SW end, the six switch assemblies comprise two outer switches, two inner switches and two clamping switches, wherein an additional capacitor lead-out terminal is arranged at an electrical connection of each of the two inner switches and the two switch bridge arms, the capacitor lead-out terminal is used for setting a high-frequency filter capacitor, and two ends of the high-frequency filter capacitor are electrically connected with the capacitor lead-out terminals corresponding to the two switch bridge arms respectively. The application can effectively improve the instantaneous dynamic voltage spike of the high-frequency switching action, improve the oscillation frequency, increase the working voltage range of the device, and prevent the EMI noise from interference the devices outside of the ANPC power module.
    Type: Application
    Filed: June 27, 2024
    Publication date: January 2, 2025
    Applicant: SHANGHAI METAPWR ELECTRONICS CO., LTD
    Inventors: Shouyu Hong, Xiaoni Xin, Jiaoping Huang, Dong Xu, Hong Jiang
  • Publication number: 20240425727
    Abstract: Disclosed by the present invention is an underwater viscoelastic anti-corrosion adhesive and a preparation method thereof, and an underwater viscoelastic anti-corrosion tape, which belongs to the technical field of underwater anti-corrosion. Total weight component of the underwater viscoelastic anti-corrosion adhesive comprises: 20 to 35 parts of medium molecular weight polyisobutylene, 8 to 15 parts of hydrocarbon compounds, 20 to 35 parts of bentonite, 10 to 20 parts of silicate, 10 to 20 parts of inorganic filler and 0 to 2 parts of anti-aging agent. Due to the good shear and peel strength and waterproof properties, the underwater viscoelastic anti-corrosion adhesive of the present invention can realize water operation when the surface of the base material is wet and immersed in water, and forms a formation with the surface of the base material so as to completely isolate air and moisture, therefor achieving anti-corrosion.
    Type: Application
    Filed: September 30, 2022
    Publication date: December 26, 2024
    Inventors: Yu ZHANG, Jian LEI, Hong JIANG, Yayong WANG, Xiaolong SONG
  • Patent number: D1062847
    Type: Grant
    Filed: September 9, 2024
    Date of Patent: February 18, 2025
    Inventor: Hong Jiang
  • Patent number: D1069200
    Type: Grant
    Filed: April 3, 2024
    Date of Patent: April 1, 2025
    Inventor: Hong Jiang