Patents by Inventor Hong Shen

Hong Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12252484
    Abstract: The present invention relates to compounds of formula (I), wherein R1, R2, R3 and R4 are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: March 18, 2025
    Assignee: Hoffmann-La Roche Inc.
    Inventors: Fabian Dey, Taishan Hu, Haixia Liu, Hong Shen, Zhiwei Zhang, Wei Zhu
  • Patent number: 12247036
    Abstract: The present invention relates to compounds of formula (Ib), wherein R1 to R3, M and L are as described herein, and their pharmaceutically acceptable salt, enantiomers and diastereomers thereof, and compositions including the compounds and methods of using the compounds.
    Type: Grant
    Filed: August 22, 2024
    Date of Patent: March 11, 2025
    Assignee: Hoffmann-La Roche Inc.
    Inventors: Jianguo Chen, Lei Guo, Haixia Liu, Hong Shen, Junwei Xi, Weixing Zhang, Dan Zhao, Wei Zhu
  • Patent number: 12235327
    Abstract: A method for calculating state of health of battery, performed by a processing control circuit, includes: charging a battery under test to an upper voltage with a first constant current through a charging circuit and an electrical measuring circuit, discharging the battery under test to a lower voltage with a second constant current through the charging circuit and the electrical measuring circuit, obtaining an accumulated discharge capacity from the upper voltage to the lower voltage through the electrical measuring circuit, and calculating a state of health of the battery under test at least according to the accumulated discharge capacity and a design capacity.
    Type: Grant
    Filed: January 26, 2023
    Date of Patent: February 25, 2025
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Hong Shen, Po-Wei Chen, Tsan-Huang Chen
  • Publication number: 20240417410
    Abstract: The present invention relates to compounds of formula (Ib), wherein R1 to R3, M and L are as described herein, and their pharmaceutically acceptable salt, enantiomers and diastereomers thereof, and compositions including the compounds and methods of using the compounds.
    Type: Application
    Filed: August 22, 2024
    Publication date: December 19, 2024
    Applicant: Hoffmann-La Roche Inc.
    Inventors: Jianguo CHEN, Lei GUO, Haixia LIU, Hong SHEN, Junwei XI, Weixing ZHANG, Dan ZHAO, Wei ZHU
  • Publication number: 20240417478
    Abstract: Provided herein are antibodies that bind to the alpha subunit of an IL-7 receptor (IL-7R?). Also provided are uses of these antibodies in therapeutic applications, such as treatment of inflammatory diseases. Further provided are cells that produce the antibodies, polynucleotides encoding the heavy and/or light chain regions of the antibodies, and vectors comprising the polynucleotides.
    Type: Application
    Filed: January 26, 2024
    Publication date: December 19, 2024
    Inventors: Aaron Paul Yamniuk, Scott Ronald Brodeur, Ekaterina Deyanova, Richard Yu-Cheng Huang, Yun Wang, Alfred Robert Langish, Guodong Chen, Stephen Michael Carl, Hong Shen, Achal Mukundrao Pashine, Lin Hui Su
  • Patent number: 12157746
    Abstract: The present invention relates to compounds of formula (I), wherein R1 to R6, m and n are I a described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: December 3, 2024
    Assignee: Hoffmann-La Roche Inc.
    Inventors: Fabian Dey, Hong Shen, Hongtao Xu, Hongying Yun, Ge Zou, Wei Zhu
  • Publication number: 20240381724
    Abstract: A display may have a stretchable portion with hermetically sealed rigid pixel islands. A flexible interconnect region may be interposed between the hermetically sealed rigid pixel islands. The hermetically sealed rigid pixel islands may include organic light-emitting diode (OLED) pixels. A conductive cutting structure may have an undercut that causes a discontinuity in a conductive OLED layer to mitigate lateral leakage. The conductive cutting structure may also be electrically connected to a cathode for the OLED pixels and provide a cathode voltage to the cathode. First and second inorganic passivation layers may be formed over the OLED pixels. Multiple discrete portions of an organic inkjet printed layer may be interposed between the first and second inorganic passivation layers.
    Type: Application
    Filed: July 25, 2024
    Publication date: November 14, 2024
    Inventors: Prashant Mandlik, Bhadrinarayana Lalgudi Visweswaran, Xuesong Lu, Weixin Li, Wenbing Hu, Yuchi Che, Tsung-Ting Tsai, Gihoon Choo, Shyuan Yang, Kuan-Yi Lee, An-Di Sheu, Chi-Wei Chou, Chin-Fu Lee, An-Hong Shen, Ko-Wei Chen, Kyounghwan Kim, Jae Won Choi, Warren S. Rieutort-Louis, Sungki Lee
  • Patent number: 12143077
    Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier, a semiconductor resistor, a tantalum nitride terminated through wafer via, and a conductive layer electrically connected to the power amplifier. The semiconductor resistor can include a resistive layer that includes a same material as a layer of a bipolar transistor of the power amplifier. A portion of the conductive layer can be in the tantalum nitride terminated through wafer via. The conductive layer and the power amplifier can be on opposing sides of a semiconductor substrate. Other embodiments of the module are provided along with related methods and components thereof.
    Type: Grant
    Filed: August 17, 2022
    Date of Patent: November 12, 2024
    Assignee: Skyworks Solutions, Inc.
    Inventors: Peter J. Zampardi, Jr., Hongxiao Shao, Tin Myint Ko, Matthew Thomas Ozalas, Hong Shen, Mehran Janani, Jens Albrecht Riege, Hsiang-Chih Sun, David Steven Ripley, Philip John Lehtola
  • Publication number: 20240339418
    Abstract: A method of manufacturing a microelectronic package with an integrally formed electromagnetic interference (“EMI”) shield and/or antenna is disclosed. The method comprises patterning a conductive structure to comprise a base, a plurality of interconnection elements, and a die attach area sized to receive a microelectronic element; bonding ends of the plurality of interconnection elements to a carrier; encapsulating the plurality of interconnection elements, and the microelectronic element with an encapsulant; removing the carrier to expose free ends of the plurality of interconnection elements; patterning the exposed outer surface of the conductive structure overlying the microelectronic element to form a portion of the EMI shield structure and/or an antenna. The portion of the EMI shield structure and/or antenna can be patterned to extend continuously from one or more of the plurality of interconnection elements.
    Type: Application
    Filed: June 18, 2024
    Publication date: October 10, 2024
    Inventors: Patrick Variot, Hong Shen
  • Publication number: 20240312928
    Abstract: A microelectronic device may include a substrate, a first chip on the substrate, and a second chip on the substrate. A plurality of pillars may be located between the first chip and the second chip, wherein a first end of each pillar of the plurality of pillars is adjacent to the substrate. A spacing among the plurality of pillars is at least equal to a distance sufficient to block electromagnetic interference (EMI) and/or radio frequency interference (RFI) between the first chip and the second chip. The microelectronic device may also include a cover over at least the first chip, the second chip, and the plurality of pillars, wherein a second end of each pillar of the plurality of pillars is at least adjacent to a trench defined within the cover. The trench may include a conductive material therein.
    Type: Application
    Filed: May 23, 2024
    Publication date: September 19, 2024
    Inventors: Patrick Variot, Hong Shen
  • Publication number: 20240297572
    Abstract: A control circuit for controlling a power module is provided. The power module drives a processing circuit. The control circuit includes a first resistor, a second resistor, a trigger circuit, and a switch circuit. The first resistor is coupled between a first reference voltage and a setting input terminal. The second resistor is coupled between a second reference voltage and the setting input terminal. The trigger circuit provides a switching signal in response to an operating signal. The switch circuit transmits a control signal to the setting input terminal in response to a first voltage level, and stops transmitting the control signal in response to a second voltage level. The power module executes one of a first power supply mode and a second power supply mode in response to a voltage value. When the control signal is not received, the power module executes a third power supply mode.
    Type: Application
    Filed: November 20, 2023
    Publication date: September 5, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Min-Hou Kuo, Hsiang-Jui Hung, Sheng-Chieh Su, Hong-Shen Liu, Jia-Ching Huang, Bo-Siang Cheng, Yen-Yong Wu
  • Publication number: 20240250720
    Abstract: An electronic device comprises a processing circuit, which is configured to determine a base-station-side first beam transmitting direction of a base station for a direct link of a user equipment and a base-station-side second beam transmitting direction of the base station for a reflection link of a large intelligent surface (LIS). On the basis of the base-station-side first beam transmitting direction and the base-station-side second beam transmitting direction, the processing circuit determines a first scanning range of the LIS for a reflected beam of a reflection link of the user equipment and a second scanning range of the LIS for a received beam of the user equipment. Additionally, the processing circuit executes control to perform beam training on the reflection link between the LIS and the user equipment on the basis of the first scanning range and the second scanning range.
    Type: Application
    Filed: May 27, 2022
    Publication date: July 25, 2024
    Applicant: Sony Group Corporation
    Inventors: Hong SHEN, Zhikun WU, Chen SUN
  • Patent number: 12040284
    Abstract: A method of manufacturing a microelectronic package with an integrally formed electromagnetic interference (“EMI”) shield and/or antenna is disclosed. The method comprises patterning a conductive structure to comprise a base, a plurality of interconnection elements, and a die attach area sized to receive a microelectronic element; bonding ends of the plurality of interconnection elements to a carrier; encapsulating the plurality of interconnection elements, and the microelectronic element with an encapsulant; removing the carrier to expose free ends of the plurality of interconnection elements; patterning the exposed outer surface of the conductive structure overlying the microelectronic element to form a portion of the EMI shield structure and/or an antenna. The portion of the EMI shield structure and/or antenna can be patterned to extend continuously from one or more of the plurality of interconnection elements.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: July 16, 2024
    Assignee: Invensas LLC
    Inventors: Patrick Variot, Hong Shen
  • Patent number: 12021041
    Abstract: A microelectronic device may include a substrate, a first chip on the substrate, and a second chip on the substrate. A plurality of pillars may be located between the first chip and the second chip, wherein a first end of each pillar of the plurality of pillars is adjacent to the substrate. A spacing among the plurality of pillars is at least equal to a distance sufficient to block electromagnetic interference (EMI) and/or radio frequency interference (RFI) between the first chip and the second chip. The microelectronic device may also include a cover over at least the first chip, the second chip, and the plurality of pillars, wherein a second end of each pillar of the plurality of pillars is at least adjacent to a trench defined within the cover. The trench may include a conductive material therein.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: June 25, 2024
    Assignee: Invensas LLC
    Inventors: Patrick Variot, Hong Shen
  • Patent number: 12012390
    Abstract: The present invention provides flavone derivatives having the general formula (I) which are useful for the treatment of Hepatitis B Virus infection (HBV). The compounds act as cccDNA (covalently closed circular DMA) inhibitors.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: June 18, 2024
    Assignee: Hoffmann-La Roche Inc.
    Inventors: Song Feng, Chungen Liang, Yongfu Liu, Hong Shen, Xuefei Tan, Jun Wu, Dongdong Chen, Chao Li, Li Wang
  • Patent number: 12012466
    Abstract: The present invention provides compounds of formula (I) wherein X1 to X8 and R1 to R8 are as described herein, as well as pharmaceutically acceptable salts thereof. Further the present invention is concerned with the manufacture of the compounds of formula (I), pharmaceutical compositions comprising them and their use as medicaments for the treatment of diseases and infections caused by Acinetobacter baumannii.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: June 18, 2024
    Assignee: Hoffmann-La Roche Inc.
    Inventors: Alexander Alanine, Julien Beignet, Konrad Bleicher, Bernhard Fasching, Hans Hilpert, Taishan Hu, Dwight MacDonald, Stephen Jackson, Sabine Kolczewski, Carsten Kroll, Adrian Schaeublin, Hong Shen, Theodor Stoll, Helmut Thomas, Amal Wahhab, Claudia Zampaloni
  • Patent number: 11999888
    Abstract: The present disclosure relates to the field of preparation of compound semiconductor nanomaterials, and in particular to a method for in-situ modification of mercury quantum dots in a traditional thermal injection process. It is characterized in that, in the traditional thermal injection process for synthesis of HgTe quantum dots, after a certain reaction time, a low boiling point polar solvent that is incompatible with a reaction solvent is rapidly injected, so that an interfacial separation of two liquid phases occurs in a mixed reaction, and then a selective crystal oriented surface modification is conducted on surfaces of mercury quantum dots.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: June 4, 2024
    Assignee: Shanghai Institute of Technical Physics Chinese Academy of Sciences
    Inventors: Jingjing Liu, Jianlu Wang, Tianle Guo, Xinning Huang, Xiangjian Meng, Hong Shen, Tie Lin, Junhao Chu
  • Patent number: 11998239
    Abstract: A puncture instrument kit includes a puncture rod, mesh, and sheath. The puncture rod consists of a puncture head, puncture rod body, and handle. One end of the puncture rod body is connected to the handle and the other end is integrated with the puncture head. The puncture head is arc-shaped with an end gradually tapering to form a tip. The tip of the puncture head is circumferentially designed with a groove for fixing a thread during surgery. The puncture head is smoothly connected with the puncture rod body, and the line between the tip of the puncture head and puncture rod body is at an obtuse angle of 130-140° relative to the puncture rod body. The sheath is sleeved on the puncture rod with the rod tip exposed. The mesh and sheath are designed as separate or integrated, and the tip of the puncture rod is provided with a shape-matching detachable silicone protective sleeve.
    Type: Grant
    Filed: March 10, 2023
    Date of Patent: June 4, 2024
    Assignee: West China Hospital of Sichuan University
    Inventors: Deyi Luo, Hong Shen, Chi Zhang, Xiao Zeng
  • Publication number: 20240151779
    Abstract: A method for calculating state of health of battery, performed by a processing control circuit, includes: charging a battery under test to an upper voltage with a first constant current through a charging circuit and an electrical measuring circuit, discharging the battery under test to a lower voltage with a second constant current through the charging circuit and the electrical measuring circuit, obtaining an accumulated discharge capacity from the upper voltage to the lower voltage through the electrical measuring circuit, and calculating a state of health of the battery under test at least according to the accumulated discharge capacity and a design capacity.
    Type: Application
    Filed: January 26, 2023
    Publication date: May 9, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Hong SHEN, Po-Wei CHEN, Tsan-Huang CHEN
  • Patent number: 11919962
    Abstract: Provided herein are antibodies that bind to the alpha subunit of an IL-7 receptor (IL-7R?). Also provided are uses of these antibodies in therapeutic applications, such as treatment of inflammatory diseases. Further provided are cells that produce the antibodies, polynucleotides encoding the heavy and/or light chain regions of the antibodies, and vectors comprising the polynucleotides.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: March 5, 2024
    Assignee: Bristol Myers-Squibb Company
    Inventors: Aaron Paul Yamniuk, Scott Ronald Brodeur, Ekaterina Deyanova, Richard Yu-Cheng Huang, Yun Wang, Alfred Robert Langish, Guodong Chen, Stephen Michael Carl, Hong Shen, Achal Mukundrao Pashine, Lin Hui Su