Abstract: In some aspects, the disclosed technology provides microelectronic devices which can effectively dissipate heat and methods of forming the disclosed microelectronic devices. In some embodiments, a disclosed device may include a first integrated device die. The disclosed device may further include a thermoelectric element bonded to the first integrated device die. The disclosed device may further include a heat sink disposed over at least the thermoelectric element. The thermoelectric element may be configured to transfer heat from the first integrated device die to the heat sink. The thermoelectric element directly may be bonded to the first integrated device die without an adhesive.

Abstract: The present disclosure relates to the field of preparation of compound semiconductor nanomaterials, and in particular to a method for in-situ modification of mercury quantum dots in a traditional thermal injection process. It is characterized in that, in the traditional thermal injection process for synthesis of HgTe quantum dots, after a certain reaction time, a low boiling point polar solvent that is incompatible with a reaction solvent is rapidly injected, so that an interfacial separation of two liquid phases occurs in a mixed reaction, and then a selective crystal oriented surface modification is conducted on surfaces of mercury quantum dots.

Abstract: A method of manufacturing a microelectronic package with an integrally formed electromagnetic interference (“EMI”) shield and/or antenna is disclosed. The method comprises patterning a conductive structure to comprise a base, a plurality of interconnection elements, and a die attach area sized to receive a microelectronic element; bonding ends of the plurality of interconnection elements to a carrier; encapsulating the plurality of interconnection elements, and the microelectronic element with an encapsulant; removing the carrier to expose free ends of the plurality of interconnection elements; patterning the exposed outer surface of the conductive structure overlying the microelectronic element to form a portion of the EMI shield structure and/or an antenna. The portion of the EMI shield structure and/or antenna can be patterned to extend continuously from one or more of the plurality of interconnection elements.

Abstract: A cosmetics container, includes a housing, a bottom, an inner bottom, a lower elastic element, a button, and a middle sleeve thereof. The pressing area is provided on the housing. The bottom sleeve is provided inside of the housing, and the inner bottom is provided inside of the bottom sleeve. The lower elastic element is provided inside of the bottom sleeve and is located at a lower surface of the inner bottom. The middle sleeve is provided inside of the housing and is located at an upper surface of the inner bottom. The middle sleeve is provided with an upper elastic element, which abuts against the button. The button includes an upper rim, a pressing piece, and a lower rim thereof. The pressing piece is located in the middle between the upper rim and the lower rim and is provided at the pressing area.

Abstract: An integrated device package is disclosed. The integrated device package can include an antenna structure and an integrated device die electrically coupled to the antenna structure. The antenna structure can be formed with a system board or separated from the system board. When the antenna structure is formed with the system board, the integrated device package can include a redistribution layer having conductive routing traces such that the integrated device die is disposed between the system board and the redistribution layer, and the integrated device die is electrically coupled to the antenna structure at least partially through one or more of the conductive routing traces of the redistribution layer.

Abstract: Systems and methods are disclosed that include providing a filter assembly having a filter body with an inlet and an outlet, a filter membrane support disposed within the filter body between the inlet and outlet, a filter membrane coupled to the filter membrane support, and at least one component that passes through the inlet, the filter membrane support, and the outlet to carry an electrical current, a fluid, or combinations thereof through the filter.

Abstract: The present invention relates to compounds of formula (I), wherein R1 to R3, m and n are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: The present invention relates to compounds of formula (I), wherein R1 to R3 and n are as described herein, and their pharmaceutically acceptable salt thereof, and compositions including the compounds and methods of using the compounds.

Abstract: The present invention relates to compounds of formula (I), wherein R1, R2 and R3 are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds as antagonist of TLR7 and/or TLR8 and/or TLR9 in the treatment of autoimmune diseases as well as auto-inflammation diseases.

Abstract: The present invention provides compounds of formula (I) wherein X1 to X8 and R1 to R8 are as described herein, as well as pharmaceutically acceptable salts thereof. Further the present invention is concerned with the manufacture of the compounds of formula (I), pharmaceutical compositions comprising them and their use as medicaments for the treatment of diseases and infections caused by Acinetobacter baumannii.

Abstract: The present invention provides novel compounds having the general formula: wherein R1 to R4, L1, L2 and X are as described herein, compositions including the compounds and methods of using the compounds.

Abstract: The present invention relates to compounds of formula (I), wherein R1, R2, R3, R4 and R5 are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: One aspect of this disclosure is a power amplifier module that includes a power amplifier, a semiconductor resistor, a tantalum nitride terminated through wafer via, and a conductive layer electrically connected to the power amplifier. The semiconductor resistor can include a resistive layer that includes a same material as a layer of a bipolar transistor of the power amplifier. A portion of the conductive layer can be in the tantalum nitride terminated through wafer via. The conductive layer and the power amplifier can be on opposing sides of a semiconductor substrate. Other embodiments of the module are provided along with related methods and components thereof.

Abstract: The present invention relates to compounds of formula (I), (I), wherein R1, R2 and R3 are as described herein, and their pharmaceutically acceptable salt, enantiomer or diastereomer thereof, and compositions including the compounds and methods of using the compounds.

Abstract: The present invention provides flavone derivatives having the general formula (I) which are useful for the treatment of Hepatitis B Virus infection (HBV). The compounds act as cccDNA (covalently closed circular DMA) inhibitors.

Abstract: The present invention relates to compounds of formula (I), wherein R1 to R3, n and A are as described herein, and their pharmaceutically acceptable salt thereof, and compositions including the compounds and methods of using the compounds.

Abstract: Disclosed are a mercury cadmium telluride-black phosphorus van der Waals heterojunction infrared polarization detector and a preparation method thereof. The structure of the detector from bottom to top comprises a substrate, a mercury cadmium telluride material, an insulating layer, a two-dimensional semiconductor black phosphorus, and metal electrodes.

Abstract: The present invention provides novel compounds having the general formula: (I) wherein R1 to R10, Gi, G2 and m are as described herein, compositions including the impounds and methods of using the compounds for the treatment of hepatitis B.

Abstract: The present invention provides the compounds having the general formula: (I) wherein R1 to R8, and X are as described herein, compositions including the compounds and methods of using the compounds.

Abstract: A method of fabricating an electronics package includes forming a cavity in a first surface of a semiconductor substrate, forming one or more passive devices on the semiconductor substrate, forming a microelectromechanical device on a piezoelectric substrate, and bonding the semiconductor substrate to the piezoelectric substrate with the microelectromechanical device disposed within the cavity.