Patents by Inventor Hong Tsai

Hong Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250081904
    Abstract: The present invention generally relates to a hydroponic culture medium and a hydroponic planting system, more particularly to a Houttuynia cordata hydroponic culture medium, a Houttuynia cordata hydroponic planting system, Houttuynia cordata extracts, a method, and applications thereof. The Houttuynia cordata hydroponic culture medium includes a plant fertilizer and a Houttuynia cordata growth-promoting additive. The Houttuynia cordata growth-promoting additive is selected from the group consisting of: vitamin B complex, seaweed essence, amino acid, microorganism, and a combination thereof. An electronic conductivity of the Houttuynia cordata hydroponic culture medium is between 0.4 ms/cm and 2.0 ms/cm.
    Type: Application
    Filed: November 22, 2024
    Publication date: March 13, 2025
    Inventors: FANG-RONG CHANG, WEI-HUNG WU, YI-HONG TSAI, CHUNG-HSIEN CHEN, YEN-CHI LOO, HSUEH-ER CHEN, YEN-CHANG CHEN, HUI-PING HSIEH, CHEN HSIEH
  • Patent number: 12110498
    Abstract: Provided herein are compositions and methods of integrating one or more exogenous donor nucleic acids into one or more exogenous landing pads engineered into a host cell's genome. In certain embodiments, the exogenous landing pads and exogenous donor nucleic acids comprise standardized, compatible homology regions so that exogenous donor nucleic acids can integrate into any of the landing pads, independent of the genomic sequences surrounding the landing pads. In certain embodiments, the methods comprise contacting the host cell comprising landing pads with one or more exogenous donor nucleic acids, and a nuclease capable of causing a double-strand break within the landing pads, and recovering a host cell comprising one or more exogenous donor nucleic acids integrated in any of the landing pads.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: October 8, 2024
    Assignee: AMYRIS, INC.
    Inventors: Kevin George, Andrew Main, Chia-Hong Tsai
  • Patent number: 11946087
    Abstract: Provided herein are compositions and methods for co-production and recovery of two or more isoprenoids from a single recombinant cell.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: April 2, 2024
    Assignee: AMYRIS BIO PRODUCTS PORTUGAL, UNIPESSOAL, LDA
    Inventors: Christopher J. Paddon, Victor Holmes, Chia-Hong Tsai, Yoseph Tsegaye, Phoebe Yeh
  • Publication number: 20230389492
    Abstract: The present invention generally relates to a hydroponic culture medium and a hydroponic planting system, more particularly to a Houttuynia cordata hydroponic culture medium, a Houttuynia cordata hydroponic planting system, Houttuynia cordata extracts, a method, and applications thereof.
    Type: Application
    Filed: March 14, 2023
    Publication date: December 7, 2023
    Inventors: FANG-RONG CHANG, WEI-HUNG WU, YI-HONG TSAI, CHUNG-HSIEN CHEN, YEN-CHI LOO, HSUEH-ER CHEN, YEN-CHANG CHEN, HUI-PING HSIEH, CHEN HSIEH
  • Publication number: 20230342529
    Abstract: Disclosed are a chip power consumption analyzer and an analyzation method thereof. The analyzation method includes the following. Design information of a circuit is received. A plurality of clock arriving times of a plurality of circuit cells in the circuit are calculated based on the design information, and a base cell type is set among a plurality of cell types according to the clock arriving times. Base demand current information of the base cell type is established, and a plurality of demand current information of the circuit cells is obtained. A plurality of demand peak currents of a plurality of bump current sources are predicted according to the demand current information and a plurality of position information of the circuit cells.
    Type: Application
    Filed: June 1, 2022
    Publication date: October 26, 2023
    Applicants: Global Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sin-Huei Li, Cheng-Hong Tsai, Chien-Cheng Wu, Yen-Chih Chiu, Hu-Cheng Jiang
  • Patent number: 11771729
    Abstract: The present invention relates to a maca extract and uses thereof. The part of the maca extract extracted with polar solvent has anti-thrombotic activity, the part of the maca extract extracted with medium and low polarity solvents has anti-neutrophilic inflammatory and anti-allergic activities, the part of the maca extract extracted with low polarity solvent has anti-neutrophilic inflammatory activity and has pro-angiogenic activity.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: October 3, 2023
    Assignee: KAOHSIUNG MEDICAL UNIVERSITY
    Inventors: Fang-Rong Chang, Chin-Chung Wu, Bing-Hung Chen, Tsong-Long Hwang, Shih-Wei Wang, Kartiko Arif Purnomo, Yi-Hong Tsai
  • Patent number: 11742276
    Abstract: A package manufacturing process and semiconductor packages are provided. An interposer having a crystal structure is provided. A first die and a second die are bonded on the interposer. The second die is positioned to be spaced apart from the first die with a gap extending direction that is perpendicular to a shortest distance of the gap, and the gap extending direction is not parallel with a crystallographic orientation of the crystal structure of the interposer. A molding compound is formed over the interposer covering the first and second dies. The molding compound and the interposer are cut into packages.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: August 29, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Huan Chu, Hsu-Hsien Chen, Liang-Chen Lin, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai
  • Publication number: 20230131367
    Abstract: A use of extracts of roselle seeds for preparing a composition of antioxidant, anti-inflammation, anti-UVB, anti-allergy, whitening, moisturizing, and anti-wrinkle, wherein the extracts of the roselle seeds comprise lauric, palmitic, linoleic, oleic, or stearic acids; and a method for preparing the extracts of the roselle seeds comprises steps of: steeping of: extracting a weight ratio of the 12:1 to 20:1 roselle seeds and an ethanol solution with a concentration of 75 to 95%; and steeping the roselle seeds in the ethanol solution to obtain a suspension; and extraction of: the suspension being engaged in an extraction of a continuous and rapid oscillation with an ultrasonic energy with a total energy of 200 to 500W, wherein 1 to 3 hours of the oscillation is one cycle, and a total number of 3 to 5 cycles is lasted, in order to obtain roselle seed crude extracts.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 27, 2023
    Inventors: Hui-Ping HSIEH, Chen HSIEH, Fang-Rong CHANG, Chia-Hua LIANG, Yen-Chang CHEN, Yi-Hong TSAI
  • Publication number: 20220387536
    Abstract: The present invention relates to a maca extract and uses thereof. The part of the maca extract extracted with polar solvent has anti-thrombotic activity, the part of the maca extract extracted with medium and low polarity solvents has anti-neutrophilic inflammatory and anti-allergic activities, the part of the maca extract extracted with low polarity solvent has anti-neutrophilic inflammatory activity and has pro-angiogenic activity.
    Type: Application
    Filed: May 31, 2022
    Publication date: December 8, 2022
    Inventors: FANG-RONG CHANG, CHIN-CHUNG WU, BING-HUNG CHEN, TSONG-LONG HWANG, SHIH-WEI WANG, KARTIKO ARIF PURNOMO, YI-HONG TSAI
  • Publication number: 20220251606
    Abstract: Provided herein are compositions and methods of integrating one or more exogenous donor nucleic acids into one or more exogenous landing pads engineered into a host cell's genome. In certain embodiments, the exogenous landing pads and exogenous donor nucleic acids comprise standardized, compatible homology regions so that exogenous donor nucleic acids can integrate into any of the landing pads, independent of the genomic sequences surrounding the landing pads. In certain embodiments, the methods comprise contacting the host cell comprising landing pads with one or more exogenous donor nucleic acids, and a nuclease capable of causing a double-strand break within the landing pads, and recovering a host cell comprising one or more exogenous donor nucleic acids integrated in any of the landing pads.
    Type: Application
    Filed: March 9, 2022
    Publication date: August 11, 2022
    Inventors: Kevin GEORGE, Andrew MAIN, Chia-Hong TSAI
  • Publication number: 20220246511
    Abstract: A package manufacturing process and semiconductor packages are provided. An interposer having a crystal structure is provided. A first die and a second die are bonded on the interposer. The second die is positioned to be spaced apart from the first die with a gap extending direction that is perpendicular to a shortest distance of the gap, and the gap extending direction is not parallel with a crystallographic orientation of the crystal structure of the interposer. A molding compound is formed over the interposer covering the first and second dies. The molding compound and the interposer are cut into packages.
    Type: Application
    Filed: April 20, 2022
    Publication date: August 4, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Huan Chu, Hsu-Hsien Chen, Liang-Chen Lin, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai
  • Patent number: 11315860
    Abstract: A package manufacturing process and semiconductor packages are provided. An interposer having a crystal structure is provided. A first die and a second die are bonded on the interposer. The second die is positioned to be spaced apart from the first die with a gap extending direction that is perpendicular to a shortest distance of the gap, and the gap extending direction is not parallel with a crystallographic orientation of the crystal structure of the interposer. A molding compound is formed over the interposer covering the first and second dies. The molding compound and the interposer are cut into packages.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: April 26, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Huan Chu, Hsu-Hsien Chen, Liang-Chen Lin, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai
  • Patent number: 11293033
    Abstract: Provided herein are compositions and methods of integrating one or more exogenous donor nucleic acids into one or more exogenous landing pads engineered into a host cell's genome. In certain embodiments, the exogenous landing pads and exogenous donor nucleic acids comprise standardized, compatible homology regions so that exogenous donor nucleic acids can integrate into any of the landing pads, independent of the genomic sequences surrounding the landing pads. In certain embodiments, the methods comprise contacting the host cell comprising landing pads with one or more exogenous donor nucleic acids, and a nuclease capable of causing a double-strand break within the landing pads, and recovering a host cell comprising one or more exogenous donor nucleic acids integrated in any of the landing pads.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: April 5, 2022
    Assignee: AMYRIS, INC.
    Inventors: Kevin George, Andrew Main, Chia-Hong Tsai
  • Patent number: 11080281
    Abstract: A method, system, and computer program product for graph-based searching for one or more data streams is disclosed. A computer-implemented method comprises extracting a plurality of tuples from one or more data streams. The method further comprises generating a graph for the plurality of tuples in which a node represents a tuple of the plurality of tuples and an edge represents a correlation between the node and another node, and the edge is generated based at least partly on one or more predetermined queries for the one or more data streams. The method further comprises traversing the graph based on the one or more predetermined queries. Accordingly, embodiments of the present disclosure can improve the search speed by use of the graph-based searching for one or more data streams.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: August 3, 2021
    Assignee: International Business Machines Corporation
    Inventors: Xiao Xing Liang, Cheng Luo, Wayne B. Riley, Shaw-Ben Shi, Meng Hong Tsai, Qingyan Wang, Yu Ling Zheng, Yu Chen Zhou
  • Patent number: 11063815
    Abstract: Provided are techniques for building and fixing a dynamic application topology. Log files are received from multiple sources comprising any of services and nodes. Information is extracted from the log files. An application topology is created for a particular point in time for an application that provides hierarchical relationships of components for executing the application using the extracted information. One or more problems in the application topology are identified. A solution is applied to each of the one or more problems.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: July 13, 2021
    Assignee: International Business Machines Corporation
    Inventors: Shaw-Ben S. Shi, Geetha Adinarayan, Gandhi Sivakumar, Meng Hong Tsai
  • Publication number: 20210189376
    Abstract: Cells and methods for screening inhibitors against a heterologous target protein are disclosed.
    Type: Application
    Filed: August 28, 2019
    Publication date: June 24, 2021
    Inventors: Andrew HORWITZ, Jessica Mai WALTER, Chia-Hong TSAI
  • Publication number: 20210118789
    Abstract: A package manufacturing process and semiconductor packages are provided. An interposer having a crystal structure is provided. A first die and a second die are bonded on the interposer. The second die is positioned to be spaced apart from the first die with a gap extending direction that is perpendicular to a shortest distance of the gap, and the gap extending direction is not parallel with a crystallographic orientation of the crystal structure of the interposer. A molding compound is formed over the interposer covering the first and second dies. The molding compound and the interposer are cut into packages.
    Type: Application
    Filed: October 17, 2019
    Publication date: April 22, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Li-Huan Chu, Hsu-Hsien Chen, Liang-Chen Lin, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong TSAI
  • Patent number: D953957
    Type: Grant
    Filed: December 25, 2020
    Date of Patent: June 7, 2022
    Inventor: Yaw Hong Tsai
  • Patent number: D988947
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: June 13, 2023
    Inventor: Yaw Hong Tsai
  • Patent number: D1012000
    Type: Grant
    Filed: November 3, 2022
    Date of Patent: January 23, 2024
    Inventor: Yaw Hong Tsai