Patents by Inventor Hong Tsai

Hong Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170140001
    Abstract: A computer-implemented method includes receiving a data stream and dividing the data stream into one or more data artefacts for one or more time intervals. The computer-implemented method further includes generating one or more contexts. Each of the one or more contexts are for at least one of the one or more time intervals. The computer-implemented method further includes storing each of the one or more data artefacts in shared storage. The shared storage is accessible for each of the one or more contexts. The computer-implemented method further includes, for each context of the one or more contexts: determining a dependency for the context; monitoring the context for a completion of said dependency; and responsive to the completion, releasing the dependency. The computer-implemented further includes removing those of the one or more data artefacts that do not belong to the dependency for any of the one or more contexts.
    Type: Application
    Filed: November 13, 2015
    Publication date: May 18, 2017
    Inventors: Lei He, Yang Liu, Cheng Luo, Shaw-Ben Shi, Meng Hong Tsai, Xi Ning Wang, Shun Xiang Yang
  • Patent number: 9631799
    Abstract: A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: April 25, 2017
    Assignee: LONGWIDE TECHNOLOGY INC.
    Inventors: Huan-Jan Chien, Tsung-Hong Tsai
  • Publication number: 20170091823
    Abstract: One embodiment for determining a marketing incentive for a user of an electronic device. In one embodiment, a computer processor detects a first electronic device within a retail environment utilizing a second electronic device that also identifies information associated with the first electronic device. In one embodiment, a computer processor determines a behavior associated with the first electronic device based, at least in part, on movement of the first electronic device within the retail environment. In one embodiment, a computer processor identifies data associated with the retail environment that includes information associated with a retailer associated with the retail environment and information associated with the first electronic device. In one embodiment, a computer processor determines a first marketing incentive based, at least in part, on the determined behavior associated with the first electronic device and the identified data associated with the retail environment.
    Type: Application
    Filed: September 30, 2015
    Publication date: March 30, 2017
    Inventors: Geetha Adinarayan, Shaw-Ben S. Shi, Gandhi Sivakumar, Meng Hong Tsai
  • Patent number: 9557041
    Abstract: This invention relates to separately produce the complicated 3D curved structure and LED 3D curved lead frame to meet the demand of the complicated curved surface illumination of illumination device.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: January 31, 2017
    Assignee: LONGWIDE TECHNOLOGY INC.
    Inventors: Huan-Jan Chien, Tsung-Hong Tsai
  • Publication number: 20170011161
    Abstract: A timing analysis method for a digital circuit design, a system and a computer readable storage media thereof are provided. The timing analysis method includes following steps. An integrated circuit (IC) design is obtained, wherein the IC is operated in a plurality of operating modes. A plurality of extracted timing models (ETMs) are respectively generated according to the operating modes of the IC design, wherein each of the ETMs includes a none on-chip variation (NOCV) part and an on-chip variation (OCV) part. The ETMs corresponding to the operating modes are integrated into a NOCV ETM and an OCV ETM, wherein the OCV part of the operating modes is not considered when the NOCV ETM is generated. And, a timing checking of the IC design is analyzed according to the NOCV ETM and the OCV ETM.
    Type: Application
    Filed: July 6, 2015
    Publication date: January 12, 2017
    Inventors: Teng-Nan Liao, Te-Hsun Fu, Hsin-Hsiung Liao, Cheng-Hong Tsai, Min-Hsiu Tsai
  • Publication number: 20160264947
    Abstract: The present invention relates to a new zinc binding fusion protein that is a fusion protein of glutathione S-transferase (GST) and metallothionein (MT), to which zinc bind, providing an efficacy in preventing or treating a ROS-related disease and heavy metal poisoning.
    Type: Application
    Filed: March 14, 2016
    Publication date: September 15, 2016
    Applicant: Acro Biotech Co., Ltd.
    Inventors: Jer-Li LIN, Sheng-Hong TSAI
  • Patent number: 9418254
    Abstract: An integrated circuit film comprising a circuit board and a control circuit is provided. The circuit board has an IC-installation part and a contact part and having a first surface and a second surface opposite to the first surface. The contact part comprises a first set of pads and a second set of pads. The first set of pads are located on the first surface for communicating with an electrical communication device. The second set of pads are located on the second surface for communicating with a smart card. The control circuit is mounted on the IC-installation part for communicating with the electrical communication device through one of the first set of pads configured in accordance with a single wire protocol (SWP), a communication protocol.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: August 16, 2016
    Assignee: MXTRAN INC.
    Inventors: Huan-Chin Luo, Wan-Sheng Ni, Chih-Hong Tsai, Chin-Sheng Lin
  • Patent number: 9400096
    Abstract: An integrated illumination part is produced by installing annular lead frame with luminous LED chip on main part body of the umbrella, then packaged into one unity with transparent material such as plastic or silica gel, slip ring, installation seat, handle and other parts can be used to produce the part. The structure of annular lead frame made of sheet metal whereby to increase the mass production of integrated illumination part and diversity of light source. It thus fully utilizes high heat dissipation capacity of umbrella parts. It includes single-layer and multilayer structure according to the functional demand of LED chip; the manufacturing method of annular lead frame firstly produces LED chip and lead frame into LED lead frame, then bend it into annular with jig according to the appearance of main part body and fix power pin into annular structure with fastener.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: July 26, 2016
    Assignee: LONGWIDE TECHNOLOGY INC.
    Inventors: Huan-Jan Chien, Tsung-Hong Tsai
  • Publication number: 20160201075
    Abstract: Provided herein is a mutant algae that produces increased oil, especially when exposed to nutrient deprivation. The mutation is at a CHT7 locus, which is wild type cells encodes a protein that affects turnover of oils and the transition of algal cells from quiescence to normal growth.
    Type: Application
    Filed: October 2, 2015
    Publication date: July 14, 2016
    Inventors: Christoph Benning, Chia-Hong Tsai
  • Publication number: 20160069546
    Abstract: A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.
    Type: Application
    Filed: November 17, 2015
    Publication date: March 10, 2016
    Inventors: Huan-Jan CHIEN, Tsung-Hong TSAI
  • Publication number: 20160069544
    Abstract: A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.
    Type: Application
    Filed: November 17, 2015
    Publication date: March 10, 2016
    Inventors: Huan-Jan CHIEN, Tsung-Hong TSAI
  • Publication number: 20160069545
    Abstract: A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.
    Type: Application
    Filed: November 17, 2015
    Publication date: March 10, 2016
    Inventors: Huan-Jan CHIEN, Tsung-Hong TSAI
  • Publication number: 20160036186
    Abstract: A crimping unit and a crimping tool including the crimping unit are disclosed in the present invention. The crimping unit includes a plurality of headers. Each header includes at least one die. The plurality of headers are respectively pivotally connected to the crimping tool such that the headers can be rotated to switch the die.
    Type: Application
    Filed: July 29, 2014
    Publication date: February 4, 2016
    Inventors: Chien-Chou Liao, Yi-Hong Tsai
  • Publication number: 20150233559
    Abstract: The manufacturing method of the integrated illumination part used in the present invention is to install annular lead frame with luminous LED chip on main part body of the umbrella, then package into one unity with transparent material such as plastic or silica gel, for example, slip ring, installation seat, handle and other parts can be used to produce the part. The purpose of the present aims at innovating the structure of annular lead frame made of sheet metal whereby to increase the mass production of integrated illumination part and diversity of light source, and fully to utilize high heat dissipation capacity of umbrella parts. It includes single-layer and multilayer structure according to the functional demand of LED chip; the manufacturing method of annular lead frame is first to produce LED chip and lead frame into LED lead frame, then bend it into annular with jig according to the appearance of main part body and fix power pin into annular structure with fastener.
    Type: Application
    Filed: April 30, 2015
    Publication date: August 20, 2015
    Inventors: Huan-Jan CHIEN, Tsung-Hong TSAI
  • Patent number: 9085520
    Abstract: Disclosed is a chalcone composition for treating diabetes and metabolic syndromes. In particular, the chalcone compound bound with 2-halogen in ring A significantly decreases the blood glucose level in the in vitro anti-diabetic effect experiment. In the in vivo animal model, the leading chalcone compound can prevent the progression of diabetes and control the blood glucose level, and there is no significant difference in the gains in body weight. Throughout the seven-week administration, there are no hepatic or renal toxicity observed.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: July 21, 2015
    Assignee: KAOHSIUNG MEDICAL UNIVERSITY
    Inventors: Yang-Chang Wu, Fang-Rong Chang, Tusty-Jiuan Hsieh, Ying-Chi Du, Yi-Hong Tsai, Chi-Ting Hsieh
  • Patent number: 9060575
    Abstract: The manufacturing method of the integrated illumination part used in the present invention is to install annular lead frame with luminous LED chip on main part body of the umbrella, then package into one unity with transparent material such as plastic or silica gel, for example, slip ring, installation seat, handle and other parts can be used to produce the part. The purpose of the present aims at innovating the structure of annular lead frame made of sheet metal whereby to increase the mass production of integrated illumination part and diversity of light source, and fully to utilize high heat dissipation capacity of umbrella parts. It includes single-layer and multilayer structure according to the functional demand of LED chip; the manufacturing method of annular lead frame is first to produce LED chip and lead frame into LED lead frame, then bend it into annular with jig according to the appearance of main part body and fix power pin into annular structure with fastener.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: June 23, 2015
    Assignee: LONGWIDE TECHNOLOGY INC.
    Inventors: Huan-Jan Chien, Tsung-Hong Tsai
  • Publication number: 20140350304
    Abstract: Disclosed is a chalcone composition for treating diabetes and metabolic syndromes. In particular, the chalcone compound bound with 2-halogen in ring A significantly decreases the blood glucose level in the in vitro anti-diabetic effect experiment. In the in vivo animal model, the leading chalcone compound can prevent the progression of diabetes and control the blood glucose level, and there is no significant difference in the gains in body weight. Throughout the seven-week administration, there are no hepatic or renal toxicity observed.
    Type: Application
    Filed: August 8, 2012
    Publication date: November 27, 2014
    Applicant: KAOHSIUNG MEDICAL UNIVERSITY
    Inventors: Yang-Chang Wu, Fang-Rong Chang, Tusty-Jiuan Hsieh, Ying-chi Du, Yi-Hong Tsai, Chi-Ting Hsieh
  • Publication number: 20140274777
    Abstract: The application relates to apparatuses, methods and kits for detecting and quantifying oil content in algal samples.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: Board of Trustees of Michigan State University
    Inventors: Christoph Benning, Eric R. Moellering, Chia-Hong Tsai
  • Publication number: 20140218171
    Abstract: An integrated circuit film comprising a circuit board and a control circuit is provided. The circuit board has an IC-installation part and a contact part and having a first surface and a second surface opposite to the first surface. The contact part comprises a first set of pads and a second set of pads. The first set of pads are located on the first surface for communicating with an electrical communication device. The second set of pads are located on the second surface for communicating with a smart card. The control circuit is mounted on the IC-installation part for communicating with the electrical communication device through one of the first set of pads configured in accordance with a single wire protocol (SWP), a communication protocol.
    Type: Application
    Filed: August 8, 2013
    Publication date: August 7, 2014
    Applicant: Mixtran Inc.
    Inventors: Huan-Chin Luo, Wan-Sheng Ni, Chih-Hong Tsai, Chin-Sheng Lin
  • Patent number: 8777113
    Abstract: An integrated circuit film for a smart card, such as a Micro SIM card or a Mini UICC card, is provided. The integrated circuit film includes a flexible print circuit board (FPC) and an integrated circuit chip, and the integrated circuit chip has an ATR (Answer to Reset) signal generating device. When a terminal issues a Reset signal, this Reset signal is sent to the smart card and the ATR signal generating device, respectively via circuits of the FPC, whereby the ATR signal generating device generates ATR signal and send back to the terminal.
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: July 15, 2014
    Assignee: MXTRAN Inc.
    Inventors: Shaw Wen Huang, Kuan Hung Lu, Chih Hong Tsai, Chi-Wang Pang