Abstract: In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.

Abstract: A semiconductor device with an integrated optical transmitter and optical receiver is disclosed that can be used in an optical subassembly. The device may include a substrate, a first component, an optical filter, and a second component, wherein the first component comprises an optical transmitter and the second component comprises an optical receiver, or vice versa. The first component can be configured to emit (or be sensitive to) a first optical signal having a first wavelength while the second component can be configured to be sensitive to (or emit) a second optical signal having a second wavelength. The optical filter can be configured to allow transmission therethrough of optical signals having the first wavelength while blocking optical signals having the second wavelength.

Abstract: A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface that cooperates with a cap to define a hermetic enclosure. First and second signal leads of the subassembly include ends that extend into the hermetic enclosure. A submount is disposed on the base mounting surface. A low inductance structure is integrally formed with the submount and includes a dielectric body interposed between the first and second leads. The body includes shaped edges and conductive pad structures in electrical communication with conductive traces disposed on the submount. Each pad structure is also in electrical communication with a respective one of the first and second signal leads via a plurality of wirebonds.

Abstract: In one example embodiment, an electronic module comprises a plurality of components and flex circuit connectors each electrically connected to respective components of the electronic module. The electronic module may be an optical subassembly of an optical transceiver. Moreover, one of the flex circuit connectors may be physically connected to another of the flex circuit connectors.

Abstract: An electro-absorption modulator integrated with a vertical cavity surface emitting laser (VCSEL). An electro-absorption modulator (EAM) is integrated or grown on a VCSEL. The electro-absorption modulator may be separated from the VCSEL by a semi-insulating or nonconducting layer. Contacts on the EAM can bias the EAM such that light emitted by the VCSEL is selectively absorbed. Thus, the VCSEL can emit a constant wave light that is modulated by the integrated EAM.

Abstract: In one example, a header assembly for use in a communication device has a base that includes a plurality of single ports through which a corresponding plurality of leads extends. The leads are retained in their respective single ports by a retainer material. Additionally, the base includes one or more plural ports through which two or more leads extend.

Abstract: A low-cost, high-speed micro-connector replacement for current electrical inter-connects and intra-connects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. The micro-connector is mounted on a PCB in alignment with the transmitting or receiving modules and provides appropriate alignment and stop positioning of an optical fiber used for optical transmitting between transmitting/receiving modules.

Abstract: A low-cost, high-speed optical interconnect replacement for current electrical interconnects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. A bare optical fiber is then used to transmit the signal from an optical encoding source to an optical receiver, providing a high-speed method of replacement for traditional electrical interconnects.

Abstract: In one example, a header assembly for use in a communication device has a base that includes a plurality of single ports through which a corresponding plurality of leads extends. The leads are retained in their respective single ports by a retainer material. Additionally, the base includes one or more plural ports through which two or more leads extend.

Abstract: A low-cost, high-speed micro-connector replacement for current electrical inter-connects and intra-connects on printed circuit boards is provided. The invention permits fast and reliable information transmission over a single fiber through the utilization of an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. The micro-connector is mounted on a PCB in alignment with the transmitting or receiving modules and provides appropriate alignment and stop positioning of an optical fiber used for optical transmitting between transmitting/receiving modules.

Abstract: An integrated optical source includes a Directly Modulated Laser (DML) and a filter which is positioned with the DML on a common substrate. The filter is configured to receive an input signal in the form of a modulated chirped optical signal. The filter is further configured to provide an output optical signal in the form of an amplitude and/or phase modulated optical signal, optimized for long-distance transmission in optical fiber.

Abstract: An integrated optical source includes a Directly Modulated Laser (DML) and a filter which is positioned with the DML on a common substrate. The filter is configured to receive an input signal in the form of a modulated chirped optical signal. The filter is further configured to provide an output optical signal in the form of an amplitude and/or phase modulated optical signal, optimized for long-distance transmission in optical fiber.

Abstract: An example of an optical source includes a VCSEL and a filter. The filter is positioned on the VCSEL and is configured and arranged such that an input to the filter from the VCSEL comprises a directly modulated optical data signal, and a corresponding output of the filter comprises an amplitude and/or phase modulated optical data signal, optimized for long-distance transmission in the optical fiber.

Abstract: Vertical cavity surface emitting lasers are disclosed, one example of which includes a substrate upon which a lower mirror layer is formed. An active region and upper mirror layer are disposed, in that order, on the lower mirror layer. In particular, the upper mirror layer includes a plurality of DBR layers formed on the active region. The upper mirror layer additionally includes a photonic crystal formed on the plurality of DBR layers and having a periodic structure that contributes to the definition of a central defect. As a consequence of this structure, the photonic crystal has a reflectivity that is wavelength dependent, and the central defect enables the VCSEL to propagate a single mode.

Abstract: The present invention provides a low-cost, high-bandwidth optical laser array where subsequent streams of data are injected in a serial fashion. The invention permits the creation of multiple channels of data on a single optical substrate without the use of costly multiplexer arrays to consolidate various optical signals. Further, the serial array eliminates the need for the parallel alignment of optical data sources, such as lasers, and instead allows for the serial alignment of the optical data sources, resulting in decreased footprint applications.

Abstract: The present invention provides a low-cost, high-bandwidth optical laser array where subsequent streams of data are injected in a serial fashion. The invention permits the creation of multiple channels of data on a single optical substrate without the use of costly multiplexer arrays to consolidate various optical signals. Further, the serial array eliminates the need for the parallel alignment of optical data sources, such as lasers, and instead allows for the serial alignment of the optical data sources, resulting in decreased footprint applications.

Abstract: A low-cost, high-speed optical interconnect replacement for current electrical interconnects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. A bare optical fiber is then used to transmit the signal from an optical encoding source to an optical receiver, providing a high-speed method of replacement for traditional electrical interconnects.

Abstract: Vertical cavity surface emitting lasers are disclosed, one example of which includes a substrate upon which a lower mirror layer is formed. An active region and upper mirror layer are disposed, in that order, on the lower mirror layer. In particular, the upper mirror layer includes a plurality of DBR layers formed on the active region. The upper mirror layer additionally includes a photonic crystal formed on the plurality of DBR layers and having a periodic structure that contributes to the definition of a central defect. As a consequence of this structure, the photonic crystal has a reflectivity that is wavelength dependent, and the central defect enables the VCSEL to propagate a single mode.

Abstract: A low-cost, high-speed micro-connector replacement for current electrical inter-connects and intra-connects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. The micro-connector is mounted on a PCB in alignment with the transmitting or receiving modules and provides appropriate alignment and stop positioning of an optical fiber used for optical transmitting between transmitting/receiving modules.

Abstract: A low-cost, high-speed micro-connector replacement for current electrical inter-connects and intra-connects on printed circuit boards is provided. The invention permits fast and reliable information transmission over a single fiber through the utilization of an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. The micro-connector is mounted on a PCB in alignment with the transmitting or receiving modules and provides appropriate alignment and stop positioning of an optical fiber used for optical transmitting between transmitting/receiving modules.