Abstract: An optoelectronic package having passive optical components that are configured to reduce the amount of optical back reflection that reaches an optoelectronic device housed within the optoelectronic package. In one example, the optoelectronic package includes an optoelectronic device, a wave plate, and a linear polarizer. The optoelectronic device is configured to emit an optical signal along an optical path. The wave plate is positioned in the optical path of the optoelectronic device. The linear polarizer is positioned in the optical path of the optoelectronic device between the optoelectronic device and the wave plate.

Abstract: In one example configuration, an optical package includes a substrate that supports a laser. The laser is configured for electrical communication with circuitry disposed on the substrate, and the laser is arranged to emit an optical signal along a first path. The optical package also includes a beam steering device supported by the substrate and arranged so as to receive the optical signal from the laser along the first path. The beam steering device is configured such that the optical signal is output from the beam steering device along a second path. A group of electronic leads is provided that electronically communicates with the circuitry on the substrate. In this example, the group includes a set of modulation leads in electrical communication with the laser, and a set of bias leads in electrical communication with the laser. The set of bias leads is electrically isolated from the set of modulation leads.

Abstract: A semiconductor device with an integrated optical transmitter and optical receiver is disclosed that can be used in an optical subassembly. The device may include a substrate, a first component, an optical filter, and a second component, wherein the first component comprises an optical transmitter and the second component comprises an optical receiver, or vice versa. The first component can be configured to emit (or be sensitive to) a first optical signal having a first wavelength while the second component can be configured to be sensitive to (or emit) a second optical signal having a second wavelength. The optical filter can be configured to allow transmission therethrough of optical signals having the first wavelength while blocking optical signals having the second wavelength.

Abstract: A fiber optic communications link is disclosed that can include first and second nodes operably connected by a multi-mode optical fiber and that utilizes two distinct optical wavelengths for enabling the bidirectional transfer of data via the optical fiber between the first and second nodes. Each node can include an integrated transmitter/receiver chip that includes a substrate, an optical receiver or transmitter, a filter, and an optical transmitter or receiver. The transmitter of the chip at the first node can be configured to transmit, via the optical fiber, optical data on one wavelength for conversion to an electrical signal by the receiver of the chip at the second node. Simultaneously, the transmitter of the chip at the second node can be configured to transmit, via the optical fiber, optical data on another wavelength for conversion to an electrical signal by the receiver of the chip at the first node.

Abstract: Heating resistor used to control laser operation. A laser package, such as a Transmitter Optical Subassembly (TOSA) includes a substrate. A laser is disposed on the substrate. A resistive heating element is disposed on the substrate with the laser. Control circuitry is connected to the resistive heating element. The control circuitry is configured to cause current flow through the resistive heating element based on temperature conditions. Current flow through the resistive heating element causes an increase in the operating temperature of the laser. This can be used to increase the effective operating temperature range of a laser.

Abstract: Vertical Cavity Surface Emitting Laser (VCSEL) on silicon substrate. One embodiment described herein includes an apparatus with functionality for communicating optical signals on a silicon integrated circuit chip. The apparatus includes a silicon based integrated circuit chip die. An optical waveguide is formed at the silicon based integrated circuit chip die. A vertical cavity surface emitting laser (VCSEL) is mechanically coupled to the silicon base integrated circuit chip die and optically coupled to the optical waveguide.

Abstract: Vertical Cavity Surface Emitting Laser (VCSEL) on silicon substrate. One embodiment described herein includes an apparatus with functionality for communicating optical signals on a silicon integrated circuit chip. The apparatus includes a silicon based integrated circuit chip die. An optical waveguide is formed at the silicon based integrated circuit chip die. A vertical cavity surface emitting laser (VCSEL) is mechanically coupled to the silicon base integrated circuit chip die and optically coupled to the optical waveguide.

Abstract: A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface that cooperates with a cap to define a hermetic enclosure. First and second signal leads of the subassembly include ends that extend into the hermetic enclosure. A submount is disposed on the base mounting surface. A low inductance structure is integrally formed with the submount and includes a dielectric body interposed between the first and second leads. The body includes shaped edges and conductive pad structures in electrical communication with conductive traces disposed on the submount. Each pad structure is also in electrical communication with a respective one of the first and second signal leads via a plurality of wirebonds.

Abstract: Fiber stub interface for reducing cladding mode light. The fiber stub can be implemented in an optical transmission device. The optical transmission device can be a transceiver that also includes an optical signal receiver. The fiber stub includes an optical fiber and a ferrule. The optical fiber includes both a core and a cladding. The ferrule includes a glass material with a refractive index that is greater than the refractive index of at least a portion of the optical fiber. As a result, the cladding modes are refracted into the ferrule and away from the core, thereby reducing the chance that they are transmitted to an external optical fiber. An absorptive layer can be applied to an outer surface of the ferrule to absorb the refracted cladding modes.

Abstract: An example of an optical source includes a VCSEL and a filter. The filter is positioned on the VCSEL and is configured and arranged such that an input to the filter from the VCSEL comprises a directly modulated optical data signal, and a corresponding output of the filter comprises an amplitude and/or phase modulated optical data signal, optimized for long-distance transmission in the optical fiber.

Abstract: A single mode high power vertical cavity surface emitting laser (VCSEL) using photonic crystals. A photonic crystal is included in at least one mirror layer of a VCSEL. The reflectivity of the photonic crystal is dependent on the wavelength and incident angle of the photons. The photonic crystal can be formed such that the VCSEL lases at a single mode. Because a single mode is generated, the aperture of the VCSEL can be enlarged to increase the power that is generated by the VCSEL for that mode. The photonic crystal can be used with or without DBR layers. The photonic crystal, in one example, forms an external cavity.

Abstract: In one example configuration, an optical package includes a substrate that supports a laser. The laser is configured for electrical communication with circuitry disposed on the substrate, and the laser is arranged to emit an optical signal along a first path. The optical package also includes a beam steering device supported by the substrate and arranged so as to receive the optical signal from the laser along the first path. The beam steering device is configured such that the optical signal is output from the beam steering device along a second path. A group of electronic leads is provided that electronically communicates with the circuitry on the substrate. In this example, the group includes a set of modulation leads in electrical communication with the laser, and a set of bias leads in electrical communication with the laser. The set of bias leads is electrically isolated from the set of modulation leads.

Abstract: An optoelectronic package having passive optical components that are configured to reduce the amount of optical back reflection that reaches an optoelectronic device housed within the optoelectronic package. In one example, the optoelectronic package includes an optoelectronic device, a wave plate, and a linear polarizer. The optoelectronic device is configured to emit an optical signal along an optical path. The wave plate is positioned in the optical path of the optoelectronic device. The linear polarizer is positioned in the optical path of the optoelectronic device between the optoelectronic device and the wave plate.

Abstract: An optical device including a polarization control photonic crystal. The optical device includes a vertical cavity surface emitting laser. The optical device further includes a lower mirror formed on a substrate. The optical device also includes an upper mirror. An active region is between the lower mirror and the upper mirror. Photons generated in the active region are reflected between the upper mirror and the lower mirror through the active region. An asymmetrical photonic crystal including cavities is optically coupled in the optical device such that one polarization of light is better reflected by the asymmetrical photonic crystal than a competing polarization of light.

Abstract: An electro-absorption modulator integrated with a vertical cavity surface emitting laser (VCSEL). An electro-absorption modulator (EAM) is integrated or grown on a VCSEL. The electro-absorption modulator may be separated from the VCSEL by a semi-insulating or nonconducting layer. Contacts on the EAM can bias the EAM such that light emitted by the VCSEL is selectively absorbed. Thus, the VCSEL can emit a constant wave light that is modulated by the integrated EAM.

Abstract: Fiber stub interface for reducing cladding mode light. The fiber stub can be implemented in an optical transmission device. The optical transmission device can be a transceiver that also includes an optical signal receiver. The fiber stub includes an optical fiber and a ferrule. The optical fiber includes both a core and a cladding. The ferrule includes a glass material with a refractive index that is greater than the refractive index of at least a portion of the optical fiber. As a result, the cladding modes are refracted into the ferrule and away from the core, thereby reducing the chance that they are transmitted to an external optical fiber. An absorptive layer can be applied to an outer surface of the ferrule to absorb the refracted cladding modes.

Abstract: Vertical cavity surface emitting lasers are disclosed, one example of which includes a substrate upon which a lower mirror layer is formed. An active region and upper mirror layer are disposed, in that order, on the lower mirror layer. In particular, the upper mirror layer includes a plurality of DBR layers formed on the active region. The upper mirror layer additionally includes a photonic crystal formed on the plurality of DBR layers and having a periodic structure that contributes to the definition of a central defect. As a consequence of this structure, the photonic crystal has a reflectivity that is wavelength dependent, and the central defect enables the VCSEL to propagate a single mode.

Abstract: A die having at least one opto-electronic device disposed on a front-side of the die has its backside mounted to a submount with the backside positioned to align the front-side opto-electronic devices with respect to the submount. A first set of alignment features are formed on the backside of the die which are aligned to the front-side. The first set of a alignment features is then aligned to a second set of alignment features disposed on the submount and the backside is bounded into place.

Abstract: A vertical cavity surface emitting laser (VCSEL) using photonic crystals. Photonic crystals are formed such that the active region of the VCSEL is bounded by the photonic crystals. The photonic crystals have a periodic cavity structure that reflects light of certain wavelengths through the active region of the VCSEL such that laser light at the wavelengths is generated. Additional photonic crystals can be formed to increase the bandwidth of the VCSEL. The photonic crystals can also be combined with distributed bragg reflector layers to form the mirrors of a VCSEL.

Abstract: A vertical cavity surface emitting laser (VCSEL) using photonic crystals with a central defect. At least one of the mirror layers of a VCSEL includes a photonic crystal with a central defect. The central defect, which is surrounded by a periodic structure of holes or cavities, permits laser light to propagate and exit the VCSEL. Semi-insulating regions are formed in the active region such that when cavities are drilled in the photonic crystal and penetrate the active region, the cavities pass through the semi-insulating regions. This reduces the surface recombination that would otherwise occur in the active region and prevents the threshold current from increasing. The photonic crystal with a central defect has a reflectivity that is wavelength dependent. The VCSEL thus emits a single mode.