Patents by Inventor Ho Seon Shin

Ho Seon Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11074910
    Abstract: An electronic device includes a microphone obtaining an audio signal, a memory in which a speaker model is stored, and at least one processor. The at least one processor is configured to obtain a voice signal from the audio signal, to compare the voice signal with the speaker model to verify a user, and, if a verification result indicates that the user corresponds to a pre-enrolled speaker, to perform an operation corresponding to the obtained voice signal.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: July 27, 2021
    Inventors: Young Woo Lee, Ho Seon Shin, Sang Hoon Lee
  • Patent number: 11048293
    Abstract: An electronic device includes a speaker, a microphone, a communication circuit, a processor operatively connected to the speaker, the microphone, and the communication circuit, and a memory operatively connected to the processor. The memory stores instructions that, when executed, cause the processor to receive a user input to activate an intelligent system, to determine at least part of a duration to receive a user utterance via the microphone, based at least partly on a state of the electronic device, to receive a first user utterance via the microphone after receiving the user input, to transmit first data associated with the first user utterance to an external server via the communication circuit, and to receive a first response from the external server via the communication circuit. The first response is generated based at least partly on the first data.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: June 29, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ho Seon Shin, Chui Min Lee, Seung Yeol Lee, Seong Min Je
  • Publication number: 20190025878
    Abstract: An electronic device includes a speaker, a microphone, a communication circuit, a processor operatively connected to the speaker, the microphone, and the communication circuit, and a memory operatively connected to the processor. The memory stores instructions that, when executed, cause the processor to receive a user input to activate an intelligent system, to determine at least part of a duration to receive a user utterance via the microphone, based at least partly on a state of the electronic device, to receive a first user utterance via the microphone after receiving the user input, to transmit first data associated with the first user utterance to an external server via the communication circuit, and to receive a first response from the external server via the communication circuit. The first response is generated based at least partly on the first data.
    Type: Application
    Filed: July 19, 2018
    Publication date: January 24, 2019
    Inventors: Ho Seon SHIN, Chul Min LEE, Seung Yeol LEE, Seong Min JE
  • Publication number: 20180197540
    Abstract: An electronic device includes a microphone obtaining an audio signal, a memory in which a speaker model is stored, and at least one processor. The at least one processor is configured to obtain a voice signal from the audio signal, to compare the voice signal with the speaker model to verify a user, and, if a verification result indicates that the user corresponds to a pre-enrolled speaker, to perform an operation corresponding to the obtained voice signal.
    Type: Application
    Filed: January 9, 2018
    Publication date: July 12, 2018
    Inventors: Young Woo LEE, Ho Seon Shin, Sang Hoon Lee
  • Patent number: 8635784
    Abstract: In a first aspect, a method of drying at least a portion of a substrate located within a fluid is provided. The method includes contacting an edge of the substrate that is located within the fluid with a pusher pin. The pusher pin has (a) a shaft portion; and (b) a tip portion having a knife edge of a width of 0.42 inches or less, the tip portion adapted to contact and support the substrate with the knife edge. The method further includes lifting the substrate from the fluid with the pusher pin; and exposing the substrate to a drying vapor as the substrate is lifted from the fluid. Numerous other aspects are provided.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: January 28, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Gary C. Ettinger, Michael E. Khau, Ho Seon Shin
  • Patent number: 8543391
    Abstract: Disclosed is a method of improving a sound quality, including: receiving a transmission signal of a first user equipment; removing noise in the transmission signal using noise information of the first user equipment side; performing speech reinforcement with respect to the noise removed transmission signal using noise information of a second user equipment side; and transmitting the speech reinforced transmission signal to the second user equipment.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: September 24, 2013
    Assignee: Industry-Academic Cooperation Foundation, Yonsei University
    Inventors: Hong Goo Kang, Min Seok Choi, Ho Seon Shin
  • Publication number: 20120123770
    Abstract: Disclosed is a method of improving a sound quality, including: receiving a transmission signal of a first user equipment; removing noise in the transmission signal using noise information of the first user equipment side; performing speech reinforcement with respect to the noise removed transmission signal using noise information of a second user equipment side; and transmitting the speech reinforced transmission signal to the second user equipment.
    Type: Application
    Filed: September 12, 2011
    Publication date: May 17, 2012
    Applicant: Industry-Academic Cooperation Foundation, Yonsei University
    Inventors: Hong Goo Kang, Min Seok Choi, Ho Seon Shin
  • Patent number: 7993485
    Abstract: Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
    Type: Grant
    Filed: December 9, 2005
    Date of Patent: August 9, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Erik C. Wasinger, Gary C. Ettinger, Sen-Hou Ko, Wei-Yung Hsu, Liang-Yuh Chen, Ho Seon Shin, Donald Olgado
  • Patent number: 7497932
    Abstract: The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: March 3, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Yezdi Dordi, Donald J. Olgado, Ratson Morad, Peter Hey, Mark Denome, Michael Sugarman, Anna Marie Lloyd, legal representative, Joseph Stevens, Dan Marohl, Ho Seon Shin, Eugene Ravinovich, Robin Cheung, Ashok K. Sinha, Avi Tepman, Dan Carl, George Birkmaier, Mark Lloyd
  • Publication number: 20090038642
    Abstract: In one aspect, a method for cleaning an edge of a substrate is provided. The method comprises employing one or more rollers of a first diameter to rotate a substrate; contacting an edge of the substrate with one or more rollers of a second diameter that is larger than the first diameter; and cleaning the edge of the substrate using the one or more rollers of the second diameter. Numerous other aspects are provided.
    Type: Application
    Filed: October 11, 2008
    Publication date: February 12, 2009
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Wei-Yung Hsu, Donald J.K. Olgado, Ho Seon Shin, Liang-Yuh Chen
  • Publication number: 20090036033
    Abstract: A method of cleaning an edge of a substrate is provided. The method comprises tensioning a first polishing film in a frame; contacting the first polishing film against an edge of a substrate; conforming the first polishing film to the edge of the substrate, the edge including an outer edge and at least one bevel; and rotating the substrate while the first polishing film remains in contact with the substrate. Numerous other aspects are provided.
    Type: Application
    Filed: October 5, 2008
    Publication date: February 5, 2009
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Erik C. Wasinger, Gary C. Ettinger, Sen-Hou Ko, Wei-Yung Hsu, Liang-Yuh Chen, Ho Seon Shin, Donald Olgado
  • Publication number: 20090036042
    Abstract: Methods, systems and apparatus are provided for polishing an edge of a substrate. The invention includes an apparatus adapted to apply a preset pressure to a polishing film in contact with an edge of a substrate. The apparatus includes an actuator adapted to apply a preset pressure to the polishing film; and a controller coupled to the actuator and adapted to receive a signal indicative of a condition of the edge of the substrate, and to adjust a pressure applied by the actuator to the polishing film so as to maintain the preset pressure based on the received signal. Numerous other aspects are provided.
    Type: Application
    Filed: September 26, 2008
    Publication date: February 5, 2009
    Inventors: Ho Seon Shin, Gary C. Ettinger, Donald J. K. Olgado, Erik C. Wasinger, Sen-Hou Ko, Charles I. Dodds, Yufei Chen, Wei-Yung Hsu
  • Publication number: 20090036039
    Abstract: Methods of and systems for polishing an edge of a substrate are provided. The invention includes a substrate rotation driver adapted to rotate the edge of a substrate against a polishing film; and a first sensor coupled to the rotation driver adapted to detect one of an energy and torque exerted by the substrate rotation driver as it rotates the substrate against the polishing film. Numerous other aspects are provided.
    Type: Application
    Filed: September 26, 2008
    Publication date: February 5, 2009
    Inventors: Ho Seon Shin, Gary C. Ettinger, Donald J. K. Olgado, Erik C. Wasinger, Sen-Hour Ko, Yufei Chen, Charles I. Dodds, Wei-Yung Hsu
  • Publication number: 20090029629
    Abstract: Methods for polishing an edge of a substrate are provided. The invention includes rotating a substrate against a polishing film so as to remove material from the edge of the substrate; and detecting an amount of force exerted in pressing the polishing film against the substrate. Numerous other aspects are provided.
    Type: Application
    Filed: September 26, 2008
    Publication date: January 29, 2009
    Inventors: Ho Seon Shin, Gary C. Ettinger, Donald J.K. Olgado, Erik C. Wasinger, Sen-Hou Ko, Charles I. Dodds, Yufei Chen, Wei-Yung Hsu
  • Publication number: 20090017731
    Abstract: Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided.
    Type: Application
    Filed: September 26, 2008
    Publication date: January 15, 2009
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Gary C. Ettinger, Erik C. Wasinger, Sen-Hou Ko, Wei-Yung Hsu, Liang-Yuh Chen, Ho Seon Shin, Donald Olgado
  • Publication number: 20080216867
    Abstract: In one aspect, an apparatus for cleaning an edge of a substrate is provided. The apparatus includes (1) one or more rollers of a first diameter adapted to contact an edge of a substrate and rotate the substrate; and (2) one or more rollers of a second diameter that is larger than the first diameter adapted to contact an edge of the substrate and to clean the edge of the substrate. The one or more rollers of the first diameter and the one or more rollers of the second diameter may be adapted to rotate at substantially the same speed. Numerous other aspects are provided.
    Type: Application
    Filed: April 24, 2006
    Publication date: September 11, 2008
    Inventors: Wei-Yung Hsu, Donald J. K. Olgado, Ho Seon Shin, Liang-Yuh Chen
  • Patent number: 7418978
    Abstract: In a first aspect, a valve assembly is provided that includes a valve assembly output adapted to output at least one of DI water and a chemical. A first valve of the valve assembly includes (1) a first input adapted to receive the chemical; (2) a first output adapted to circulate the chemical to a chemical return; and (3) a second output adapted to output the chemical to the valve assembly output. The valve assembly also includes a second valve positioned downstream from the first valve. The second valve includes (1) an input adapted to receive deionized (DI) water; and (2) an output adapted to output DI water to the valve assembly output. A check valve is coupled between the second output of the first valve and the output of the second valve, and the first valve, second valve and check valve are included in a single manifold.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: September 2, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Sandy Shih-Hsun Chao, Songjae Lee, Ho Seon Shin
  • Publication number: 20080155852
    Abstract: Embodiments of the present invention generally relate to an apparatus and methods for rinsing and drying substrates that include multiple rinsing and drying modules. Methods for arranging drying modules to enable high-throughput rinsing and drying of multiple substrates are also provided. In one embodiment a system for drying semiconductor substrates is provided. The system comprises a housing, a first drying module positioned within the housing, and a second drying module positioned adjacent the first drying module within the housing, wherein the first and second drying modules are oriented approximately vertically within the housing.
    Type: Application
    Filed: December 31, 2007
    Publication date: July 3, 2008
    Inventors: DONALD J.K. OLGADO, Simon Yavelberg, Edwin Velaquez, Hui Chen, Sheshraj L. Tulshibagwale, Ho Seon Shin
  • Publication number: 20080156359
    Abstract: Embodiments of the invention generally relate to a modular, configurable system in which distinct cleaning and drying modules can be arranged in different combinations selectable by a user of the system. In one embodiment a configurable system for substrate cleaning is provided. The configurable system provides a frame including first and second bays, the first and second bays each adapted to hold one or more cleaning or drying modules, and a transfer area positioned between the first and second bays including a robot adapted to move substrates to and from the one or more modules positioned within the first and second bays, wherein the frame is adapted to hold a user selectable set of one or more cleaning or drying modules in the first and second bays.
    Type: Application
    Filed: December 21, 2007
    Publication date: July 3, 2008
    Inventors: DONALD J.K. OLGADO, Ho Seon Shin, Sheshraj L. Tulshibagwale, Roy C. Nangoy, Hui Chen, Allen L. D'Ambra
  • Publication number: 20080156360
    Abstract: Embodiments of the present invention relate to semiconductor device manufacturing, and more particularly to a horizontal megasonic module for cleaning substrates. In one embodiment an apparatus for cleaning a substrate is provided. The apparatus comprises a tank adapted to contain a cleaning fluid, a movable housing having a first side adapted to be placed in the cleaning fluid, a plurality of rotatable rollers coupled to the first side of the housing, the rollers positioned and including grooves to securely hold the substrate in a horizontal orientation, and one or more transducers adapted to direct vibrational energy through the cleaning fluid in the tank toward the substrate, wherein at least one of the transducers directs vibrational energy toward the substrate and substantially parallel to a major surface of the substrate.
    Type: Application
    Filed: December 20, 2007
    Publication date: July 3, 2008
    Inventors: Donald J.K. Olgado, Sheshraj L. Tulshibagwale, Thomas B. Brezoczky, John S. Lewis, Ho Seon Shin, Hui Chen, Roy C. Nangoy