Abstract: A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.

Abstract: A light source device for a display includes light emitting diode packages. Each light emitting diode package includes a substrate, a first light emitting diode chip emitting a first beam of light, a second light emitting diode chip emitting a second beam of light, and a package layer including a wavelength converting material. Frequency bands of the first and second light beams both have a full width at half maximum of 30 nm to 40 nm. The wavelength converting material is excited by the first and second beams to generate a third beam of light, the frequency band of the third beam of light having a full width at half maximum of 10 nm to 50 nm. A display using the light source device is also disclosed.

Abstract: A packaging structure of an LED comprises a substrate with first surface, a first electrode arranged on the first surface, at least one light emitting chip on the first electrode, and a packaging body arranged on the first surface to cover the light emitting chip. The first surface defines at least one groove, part of the package body is in the groove. By increasing the contact area between the substrate and the packaging body or mounting an embedded structure on the substrate, the firmness of the bond between the packaging body and the substrate is improved.

Abstract: A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.

Abstract: A narrower LED package structure with sideways output of light suitable for a light guide plate includes two first electrodes, a package body, a cover layer, and two second electrodes. The LED chip is mounted on the first electrodes. The package body encapsulates the first electrodes, and surrounds the LED chip to define a light emitting region. The cover layer infills the light emitting region and covers the LED chip. The second electrodes are positioned outside the package body. Along a plane parallel to the first electrodes, a surface area of the two second electrodes is greater than a surface area of the portion of the two first electrodes positioned in the light emitting region.

Abstract: A narrower LED package structure with sideways output of light suitable for a light guide plate includes two first electrodes, a package body, a cover layer, and two second electrodes. The LED chip is mounted on the first electrodes. The package body encapsulates the first electrodes, and surrounds the LED chip to define a light emitting region. The cover layer infills the light emitting region and covers the LED chip. The second electrodes are positioned outside the package body. Along a plane parallel to the first electrodes, a surface area of the two second electrodes is greater than a surface area of the portion of the two first electrodes positioned in the light emitting region.

Abstract: A method for manufacturing a light emitting diode (LED) die includes providing an LED die including a substrate, an N type semiconductor layer, an active layer, and a P type semiconductor layer grown on the substrate in sequence. The N type semiconductor layer, the active layer, and the P type semiconductor layer are etched to define a plurality of recesses and a groove. An insulating layer to cover side surfaces of the recesses and the P type semiconductor layer is formed and a portion of the insulating layer is etched to define an opening to expose a top portion of the P type semiconductor layer. A pair of electrodes is formed and the LED die is cut along the groove to obtain an individual LED die.

Abstract: A method for manufacturing a light emitting diode (LED) die includes providing an LED die including a substrate, an N type semiconductor layer, an active layer, and a P type semiconductor layer grown on the substrate in sequence. The N type semiconductor layer, the active layer, and the P type semiconductor layer are etched to define a plurality of recesses and a groove. An insulating layer to cover side surfaces of the recesses and the P type semiconductor layer is formed and a portion of the insulating layer is etched to define an opening to expose a top portion of the P type semiconductor layer. A pair of electrodes is formed and the LED die is cut along the groove to obtain an individual LED die.

Abstract: A miniaturized LED package substrate allowing for the better installation of an electrostatic protection device includes an upper substrate, a lower substrate, and a circuit layer. The circuit layer is positioned between the upper substrate and the lower substrate and electrically connected to the upper substrate and the lower substrate. At least one cavity is defined at the lower substrate, and each of the at least one cavity passes through the lower substrate to expose a portion of the circuit layer.

Abstract: A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener diode and the reflective cup are arranged on the electrode structure. The LED element and the zener diode are electrically connected in anti-parallel with each other. The reflective cup comprises an inner surface defined thereof and a nick defined in an outside of the reflective cup. The LED element is surrounded by the inner surface of the reflective cup and the zener diode is arranged in the nick.

Abstract: The present disclosure provides a light emitting diode die which includes a substrate; an N type semiconductor layer, an active layer, and a P type semiconductor layer formed on the substrate in sequence; at least one recess, and a pair of electrodes. The recess extends to the N type semiconductor layer. The insulating layer covers the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covers top of the P type semiconductor layer except an opening on the P semiconductor layer. One of the electrodes is filled in the recess and electrically connected to the N type semiconductor layer, and the other one of the electrodes is connected to the P type semiconductor layer in the opening. The present disclosure further provides an LED package having the LED die and a method for manufacturing the same.

Abstract: The present disclosure provides an LED package which includes electrodes, an LED die electrically connected with the electrodes, an encapsulation covering the LED die; and a casing surrounding the encapsulation and the LED die. The casing includes a base, a reflecting cup and a supporting portion. The reflecting cup extends from the base upwards, the reflecting cup surrounds the LED die, and the supporting portion is located inside the reflecting cup and across the electrodes.

Abstract: The present invention is related to a light emitting diode (LED) package. The LED package includes a blue LED chip, a first electrode, a second electrode and a phosphor layer. The phosphor layer covers an outer periphery of the blue LED chip, except a bottom surface of the blue LED chip. The phosphor layer is mixed by yellow fluorescent powder and glue. The phosphor layer includes a main portion corresponding to a central portion of an emitting angle of the blue LED chip and an extending portion corresponding to a periphery of the emitting angle. An average thickness of the main portion is larger than the thickness of the extending portion.

Abstract: An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein.

Abstract: The present disclosure provides a light emitting diode package which includes a plurality of electrodes, an LED die, a reflecting cup, a reflecting layer, and a phosphor layer. The LED die are electrically connected with the electrodes. The reflecting cup is formed on the electrodes and surrounds the LED die. The reflecting cup includes an inner surface. The reflecting layer is formed between the inner surface and LED die, and the reflecting layer has a higher pyrogenation temperature than the reflecting cup. The phosphor layer covers the LED die.

Abstract: A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener diode and the reflective cup are arranged on the electrode structure. The LED element and the zener diode are electrically connected in anti-parallel with each other. The reflective cup comprises an inner surface defined thereof and a nick defined in an outside of the reflective cup. The LED element is surrounded by the inner surface of the reflective cup and the zener diode is arranged in the nick.

Abstract: An LED packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an LED mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein.

Abstract: A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener diode and the reflective cup are arranged on the electrode structure. The LED element and the zener diode are electrically connected in anti-parallel with each other. The reflective cup comprises an inner surface defined thereof and a nick defined in an outside of the reflective cup. The LED element is surrounded by the inner surface of the reflective cup and the zener diode is arranged in the nick.

Abstract: The present disclosure provides a light emitting diode package which includes a plurality of electrodes, an LED die, a reflecting cup, and a phosphor layer. The LED die are electrically connected with the electrodes. The LED die includes a top light emitting surface and a plurality of lateral sides extending downward from the top light emitting surface. The reflecting cup is formed on the electrodes and surrounds the LED die. The reflecting cup includes an inner surface. The inner surface contacts with bottom portion of the LED die. A cavity is defined between the inner surface and other portion except the bottom portion of the LED die. The phosphor layer covers and seals the LED die.