Patents by Inventor Hou-Te Lin

Hou-Te Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140209948
    Abstract: An exemplary light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, and an LED die mounted on a top surface of the substrate. The substrate also includes a bottom surface. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. An oxidation-resistant metal coating layer is formed on a top face of each of the first and second electrodes. The LED die is electrically connected to the first and second electrodes via the two oxidation-resistant metal coating layers.
    Type: Application
    Filed: November 12, 2013
    Publication date: July 31, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN
  • Patent number: 8779442
    Abstract: An LED module comprises an LED and a lens matching with the LED. The lens comprises a light-guiding portion and a plurality of retaining portions protruded from the light-guiding portion. The LED includes a substrate, a first electrode and a second electrode mounted on the substrate. A plurality of through holes is defined in the first electrode and a second electrode, respectively. Each retaining portion includes a rugged portion. The retaining portions are inserted into the through holes correspondingly, and the rugged portion abuts the substrate. Glue is applied between the rugged portion and the substrate.
    Type: Grant
    Filed: December 23, 2012
    Date of Patent: July 15, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Hou-Te Lin, Ming-Ta Tsai
  • Patent number: 8765499
    Abstract: A method for manufacturing an LED package includes following steps. A plate is provided. The plate defines a plurality of the through holes extending from an upper surface to a bottom surface of the plate. A blue film is attached to the bottom surface of the plate and covers openings of the through holes. The blue film and an inner wall of the plate defining the through hole cooperatively define a groove. Glue doped with phosphor particle is injected into the groove. The phosphor particles are condensed to a bottom surface of the glue adjacent to the blue film. The LED chips are embedded in the grooves and positioned at upper ends of the grooves. Finally, the blue film is removed and the plate is severed to obtain a plurality of individual LED packages each including a corresponding LED chip.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: July 1, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventor: Hou-Te Lin
  • Publication number: 20140175483
    Abstract: An LED package includes a first electrode, a second electrode electrically insulated from the first electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes an elongated first main portion and a first connecting portion bending downwardly from an end of the first main portion. The second electrode includes an elongated second main portion and a second connecting portion bending downwardly from an end of the second main portion. The LED chip is received in reflecting cup. The first main portion and the second main portion are embedded into the receiving cup, the end of the first main portion and the end of the second main portion extend outside the reflecting cup, and the first connecting portion and the second connecting portion are located outside the receiving cup.
    Type: Application
    Filed: August 30, 2013
    Publication date: June 26, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, PIN-CHUAN CHEN, LUNG-HSIN CHEN
  • Publication number: 20140175484
    Abstract: An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has a first connecting face away from the first main portion. The second electrode includes a second main portion and a second connecting portion extending outwardly from the second main portion. The second connecting portion has a second connecting face away from the second main portion. The first main portion and the second main portion are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup.
    Type: Application
    Filed: August 30, 2013
    Publication date: June 26, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, PIN-CHUAN CHEN, LUNG-HSIN CHEN
  • Patent number: 8729572
    Abstract: A light emitting diode package includes an electrically insulated base, first and second electrodes, an LED chip, a voltage stabilizing module, and an encapsulative layer. The base has a first surface and an opposite second surface. The first and second electrodes are formed on the first surface of the base. The LED chip is electrically connected to the first and second electrodes. The voltage stabilizing module is formed on the first surface of the base, positioned between and electrically connected to the first and second electrodes. The voltage stabilizing module connects to the LED chip in reverse parallel and has a polarity arranged opposite to that of the LED chip. The voltage stabilizing module has an annular shape and encircles the first electrode. The encapsulative layer is formed on the base and covers the LED chip.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: May 20, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hou-Te Lin, Chao-Hsiung Chang
  • Publication number: 20140117390
    Abstract: An LED package includes a first electrode and a second electrode electrically insulating from the first electrode, an LED chip, two electrically insulating connecting layers, and a reflector. Top surfaces of the first electrode and the second electrode are recessed to define a first receiving space and a second receiving space therein. The LED chip is mounted on the top surface of the first electrode and electrically connects the first electrode and the second electrode. The electrically insulating connecting layers are respectively received in the first receiving space and the second receiving space. The reflector is mounted on top surfaces of the connecting layers and enclosing the LED chip therein.
    Type: Application
    Filed: May 23, 2013
    Publication date: May 1, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, PIN-CHUAN CHEN, LUNG-HSIN CHEN
  • Publication number: 20140061712
    Abstract: A side view light emitting diode (LED) package includes an electrode structure, an LED die disposed on the electrode structure and an encapsulation layer covering the LED die. The encapsulation layer includes a light outputting surface. The electrode structure includes a first electrode and a second electrode spaced from each other to define a tortuous gap therebetween. Resin material for forming a substrate of the LED package fills in the gap to interconnect the first and second electrode together. The LED die is electrically connected to the first electrode and the second electrode. The present disclosure also provides a method for manufacturing the side view LED package.
    Type: Application
    Filed: August 21, 2013
    Publication date: March 6, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG
  • Publication number: 20140061697
    Abstract: An LED package includes adjacent first and second electrodes, first and second extension electrodes protruding sideward from the first and second electrodes, a molded body surrounding the first and second electrodes and an LED die. The molded body forms a reflecting cup located over the first and second electrodes, with each reflecting cup defining a receiving cavity in a top face thereof to receive the LED die. The first and second extension electrodes are exposed from an outer periphery of the molded body. The first electrode has a first bottom face. The second electrode has a second bottom face. The first and second bottom faces of the first and second electrodes are exposed out from a bottom face of the molded body. A method for manufacturing the LED package is also provided.
    Type: Application
    Filed: June 7, 2013
    Publication date: March 6, 2014
    Inventors: HOU-TE LIN, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG
  • Publication number: 20140061698
    Abstract: An LED package includes a first electrode, a second electrode adjacent to the first electrode, a molded body surrounding and encapsulating the first and second electrodes, and an LED die mounted on the second electrode. The molded body includes a reflecting cup located over the first and second electrodes and the reflecting cup defines a receiving cavity in a top face to receive the LED die. A first extension electrode protrudes sideward from the first electrode and a second extension electrode protrudes sideward from the second electrode. The first and second extension electrodes are exposed from an outer periphery of the molded body. A method for manufacturing the LED package is also provided.
    Type: Application
    Filed: June 26, 2013
    Publication date: March 6, 2014
    Inventors: HOU-TE LIN, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG
  • Publication number: 20140004632
    Abstract: A method for manufacturing an LED package includes following steps. A plate is provided. The plate defines a plurality of the through holes extending from an upper surface to a bottom surface of the plate. A blue film is attached to the bottom surface of the plate and covers openings of the through holes. The blue film and an inner wall of the plate defining the through hole cooperatively define a groove. Glue doped with phosphor particle is injected into the groove. The phosphor particles are condensed to a bottom surface of the glue adjacent to the blue film. The LED chips are embedded in the grooves and positioned at upper ends of the grooves. Finally, the blue film is removed and the plate is severed to obtain a plurality of individual LED packages each including a corresponding LED chip.
    Type: Application
    Filed: May 16, 2013
    Publication date: January 2, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventor: HOU-TE LIN
  • Publication number: 20140004633
    Abstract: A method of manufacturing an LED package including steps: providing an electrode, the electrode including a first electrode, a second electrode, a channel defined between the first electrode and the second electrode, the first electrode and the second electrode arranged with intervals mutually, a cavity arranged on the first electrode, and the cavity communicating with the channel; arranging an LED chip electrically connecting with the first electrode and the second electrode and arranged inside the cavity; providing a shield covering the first electrode and the second electrode; injecting a transparent insulating material to the cavity via the channel, and the first electrode, the second electrode, and the shield being interconnected by the transparent insulating material; solidifying the transparent insulating material to obtain the LED package.
    Type: Application
    Filed: August 30, 2013
    Publication date: January 2, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, MING-TA TSAI
  • Publication number: 20140001504
    Abstract: An LED package includes a substrate, a pair of electrodes connected to the substrate, an LED die electrically connected to the electrodes, an encapsulation formed on the substrate to cover the LED die, and a reflective cup surrounding the substrate and the encapsulation. A curved surface is formed on the reflective cup, and abuts against and protrudes towards the encapsulation. The present disclosure also provides a method for manufacturing the LED package described above.
    Type: Application
    Filed: May 23, 2013
    Publication date: January 2, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventor: HOU-TE LIN
  • Publication number: 20130341660
    Abstract: An exemplary LED module includes an LED and a lens covering the LED. The lens includes a light-guiding portion over the LED and retaining portions protruding downwardly from the light-guiding portion. The LED includes a substrate, a first electrode and a second electrode mounted on the substrate, and an LED chip electrically connecting the first electrode and the second electrode respectively. Through holes are defined in the first electrode and the second electrode, respectively. Each retaining portion includes a first rugged portion and a second rugged portion. The retaining portions are inserted into the through holes correspondingly, the first rugged portion connects glue filled in a corresponding through hole, and the second rugged portion abuts the substrate, whereby the lens and the substrate are securely connected together.
    Type: Application
    Filed: May 17, 2013
    Publication date: December 26, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHAO-HSIUNG CHANG, HOU-TE LIN
  • Publication number: 20130337594
    Abstract: A method for manufacturing LED packages includes following steps: providing an engaging frame including a lead frame, electrode structures having first and second electrodes, and defining slots between the electrode structure, each first electrode including a first inserting part and each second electrode including a second inserting part; providing a substrate and combining the substrate and the engaging frame together to make through holes of the substrate located at lateral sides of the first and second inserting parts respectively, insulating parts of the substrate received in the slots of the engaging frame, and cavities of the substrate receiving the first and second inserting parts; providing LED diodes, and connecting each LED diode electrically to the first and second electrodes; and cutting along the first and second inserting parts to make sides of the first and second inserting parts exposed to ambient air.
    Type: Application
    Filed: May 28, 2013
    Publication date: December 19, 2013
    Inventors: HOU-TE LIN, LUNG-HSIN CHEN
  • Patent number: 8569779
    Abstract: An exemplary light emitting diode (LED) package includes a substrate, an electrical member formed on the substrate, an LED chip mounted on the substrate and electrically connected to the electrical member, and a heat-dissipating member formed on the electrical member. The heat-dissipating member helps the LED chip to dissipate heat generated thereby when the LED chip is in operation.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: October 29, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Kai-Lun Wang, Shih-Yuan Hsu, Hou-Te Lin
  • Patent number: 8569789
    Abstract: An LED package includes a substrate, a transparent base, an LED chip and a reflective layer. The substrate has an upper surface. The transparent base is arranged on the upper surface of the substrate. The transparent base includes a first surface away from the substrate and a second surface opposite to the first surface. The LED chip is arranged on the first surface of the transparent base. The reflective layer is arranged between the substrate and the second surface of the transparent base.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: October 29, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Hou-Te Lin
  • Patent number: 8552462
    Abstract: An LED package includes an electrode, an LED chip, and an insulation layer. The electrode includes a first electrode and a second electrode. The first electrode and the second electrode are separate from each other. The LED chips are connected to the first and second electrodes. The insulation layer covers the first and second electrodes and the LED chip. A cavity is defined in the first electrode for receiving the LED chip therein. A channel is defined between the first electrode and the second electrode. The channel communicates with the cavity and the insulation layer fills in the cavity and the channel.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: October 8, 2013
    Assignee: Advanced Optoelectric Technology, Inc.
    Inventors: Hou-Te Lin, Ming-Ta Tsai
  • Patent number: 8546833
    Abstract: An exemplary LED package includes first and second electrodes, an LED die and an encapsulation. An inner wall of each first and second electrode includes a first oblique plane. The LED die is surrounded by and electrically connected to the first and second electrodes. The LED die includes an outputting surface. The encapsulation is filled between the first electrode ant the second electrode and covers the LED die, and includes opposite first and second outer surfaces, wherein the second outer surface acts as an outputting surface of the LED package. A reflective layer is coated on the first outer surface of the encapsulation. The first oblique plane of the electrode structure is light reflective and extends aslant from the outputting surface of the LED die towards the outputting surface of the LED package along a direction away from the LED die.
    Type: Grant
    Filed: August 15, 2012
    Date of Patent: October 1, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Hou-Te Lin
  • Patent number: 8545061
    Abstract: An LED device includes a substrate, an LED chip and a lens module. The substrate has an upper surface. The LED chip is arranged on the upper surface of the substrate. The LED chip has a light emitting surface away from the upper surface of the substrate. The lens module is arranged over the light emitting surface of the LED chip. The lens module includes a first lens. The first lens includes a first light outputting surface away from the light emitting surface of the LED chip. The first light outputting surface of the first lens defines a first cavity at a center thereof.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: October 1, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chao-Hsiung Chang, Hou-Te Lin, Ming-Ta Tsai