Abstract: An LED package device having a dam located on a substrate is provided, by which two regions are defined on the substrate. Two LED dies are respectively disposed on the two regions and separated by the dam; therefore, the LED package device has an enhanced intensity of the lateral-emitting light and a wide light emitting angle. The LED package devices can be used in backlight units to prevent mura and hot spot issues.

Abstract: An exemplary LED package includes first and second electrodes, an LED chip and two electrically conductive wires. The first electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the first electrode. The second electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the second electrode. The LED chip has a bottom surface attached to the top surface of the first electrode, and a top surface on which a first pad and a second pad are formed. One of the electrically conductive wires has an end connecting to the first pad and an opposite end joining with a bottom of the recess of the first electrode. The other has an end connecting to the second pad and an opposite end joining with a bottom of the recess of the second electrode.

Abstract: A backlight module includes a mounting plate and plural light-emitting diodes mounted on the mounting plate. The mounting plate includes plural ridges. Each of the ridges is strip-shaped and includes two mounting walls each extending inclinedly and upwardly from a corresponding connecting portion. An obtuse angle is formed between each of the mounting walls and the corresponding connecting portion. The light-emitting diodes are mounted on the mounting walls of the ridges, whereby the light-emitting diodes are tilted relative to connecting portions. The present disclosure further discloses a liquid crystal display using the backlight module. The light-emitting diodes face upwardly and inclinedly toward a liquid display screen of the display when the backlight module is located below the screen.

Abstract: A light emitting diode (LED) device includes a substrate, first and second LED chips arranged on the substrate, and a phosphor layer over the first and second LED chips. The phosphor layer includes a plurality of phosphor units, each including a phosphor particle and a silver halide layer encapsulating the phosphor particle. Light emitted from the second LED chip strikes the phosphor particles to generate a first light, which. combines with the light to generate a resultant light. The silver halide layer is reduced by the light from the first LED chip to produce silver particles around the phosphor particles. The silver particles can block the light emitted from the second LED chip from sticking the phosphor particles. By adjusting the current supplied to the first LED chip, the color temperature of the resultant light generated by the LED device can be changed.

Abstract: An LED device includes a substrate having a top surface, an LED chip arranged on the top surface of the substrate, an encapsulant arranged on the top surface of the substrate and covering the LED chip, and an optical element arranged over the encapsulant. The optical element includes a light input surface adjacent to the encapsulant and a light output surface opposite to the light input surface. The refractive index of the optical element is larger than that of the encapsulant.

Abstract: A light emitting diode lamp includes a lamp body, a light emitting diode arranged on the lamp body, and a lamp cover to cover the light emitting diode. The lamp cover includes a lens in front of the light emitting diode to modulate the light from the light emitting diode. The light emitting diode lamp further includes a driver and an adjusting device. The driver is formed between the lamp body and a lamp cover. The adjusting device controls the driver to adjust a distance between the lens and the light emitting diode, whereby a light filed of the light from the light emitting diode is adjustable.

Abstract: A light emitting diode package includes a triangular supporting member, a first substrate and a second substrate adhered on first and second inclined sidewalls the supporting member, respectively, a first LED chip and a second LED chip secured on the first substrate and the second substrate, respectively, and a package layer covering the first LED chip and a second LED chip. The first inclined sidewall and a bottom surface of the supporting member cooperatively form a first angle therebetween, and the second inclined sidewall and the bottom surface cooperatively form a second angle therebetween. The first angle and the second angle each range between 0 degree and 90 degrees. A method for making the light emitting diode package is also provided.

Abstract: A light emitting diode (LED) includes a substrate, an electrode structure positioned on the substrate, an LED component electrically connected to the electrode structure, and a lens structure positioned on the substrate and covering the LED component. The lens structure includes a rugged structure adjacent to the substrate; the roughness of the rugged structure decreases gradually along a direction from a center of the lens structure center toward a peripheral edge thereof. The present disclosure also provides a method for manufacturing the LED light source.

Abstract: An exemplary LED package includes first and second electrodes, an LED die and an encapsulation. An inner wall of each first and second electrode includes a first oblique plane. The LED die is surrounded by and electrically connected to the first and second electrodes. The LED die includes an outputting surface. The encapsulation is filled between the first electrode ant the second electrode and covers the LED die, and includes opposite first and second outer surfaces, wherein the second outer surface acts as an outputting surface of the LED package. A reflective layer is coated on the first outer surface of the encapsulation. The first oblique plane of the electrode structure is light reflective and extends aslant from the outputting surface of the LED die towards the outputting surface of the LED package along a direction away from the LED die.

Abstract: An LED includes a base, an LED chip, a first electrode, a second electrode, an encapsulating layer, and a reflective layer. The base forms a concave recessed from a top face thereof and a recess above the concave. The reflective layer is attached on the concave. The LED chip is received in the recess and located over the reflective layer. The LED chip has a light output face facing towards the reflective layer. The encapsulating layer is filled in the recess to cover the reflective layer and encapsulate the LED chip. The reflective layer includes a first reflective layer and a second reflective layer. The first reflective layer is located at a center of the concave. The second reflective layer surrounds and connects the first reflective layer. The first reflective layer has a curvature smaller than that of the second reflective layer.

Abstract: An LED package device having a dam located on a substrate is provided, by which two regions are defined on the substrate. Two LED dies are respectively disposed on the two regions and separated by the dam; therefore, the LED package device has an enhanced intensity of the lateral-emitting light and a wide light emitting angle. The LED package devices can be used in backlight units to prevent mura and hot spot issues.

Abstract: A light emitting diode (LED) device includes a substrate, first and second LED chips arranged on the substrate, and a phosphor layer over the first and second LED chips. The phosphor layer includes a plurality of phosphor units, each including a phosphor particle and a silver halide layer encapsulating the phosphor particle. Light emitted from the second LED chip strikes the phosphor particles to generate a first light, which. combines with the light to generate a resultant light. The silver halide layer is reduced by the light from the first LED chip to produce silver particles around the phosphor particles. The silver particles can block the light emitted from the second LED chip from sticking the phosphor particles. By adjusting the current supplied to the first LED chip, the color temperature of the resultant light generated by the LED device can be changed.

Abstract: A light emitting diode package includes an electrically insulated base, first and second electrodes, an LED chip, a voltage stabilizing module, and an encapsulative layer. The base has a first surface and an opposite second surface. The first and second electrodes are formed on the first surface of the base. The LED chip is electrically connected to the first and second electrodes. The voltage stabilizing module is formed on the first surface of the base, positioned between and electrically connected to the first and second electrodes. The voltage stabilizing module connects to the LED chip in reverse parallel and has a polarity arranged opposite to that of the LED chip. The voltage stabilizing module has an annular shape and encircles the first electrode. The encapsulative layer is formed on the base and covers the LED chip.

Abstract: An LED package includes an electrode, an LED chip, and an insulation layer. The electrode includes a first electrode and a second electrode. The first electrode and the second electrode are separate from each other. The LED chips are connected to the first and second electrodes. The insulation layer covers the first and second electrodes and the LED chip. A cavity is defined in the first electrode for receiving the LED chip therein. A channel is defined between the first electrode and the second electrode. The channel communicates with the cavity and the insulation layer fills in the cavity and the channel.

Abstract: An LED device includes a substrate, an LED chip and a lens module. The substrate has an upper surface. The LED chip is arranged on the upper surface of the substrate. The LED chip has a light emitting surface away from the upper surface of the substrate. The lens module is arranged over the light emitting surface of the LED chip. The lens module includes a first lens. The first lens includes a first light outputting surface away from the light emitting surface of the LED chip. The first light outputting surface of the first lens defines a first cavity at a center thereof.

Abstract: An LED package includes a substrate, a transparent base, an LED chip and a reflective layer. The substrate has an upper surface. The transparent base is arranged on the upper surface of the substrate. The transparent base includes a first surface away from the substrate and a second surface opposite to the first surface. The LED chip is arranged on the first surface of the transparent base. The reflective layer is arranged between the substrate and the second surface of the transparent base.

Abstract: An LED package includes a chip carrier, an LED chip, and an encapsulation. The chip carrier includes a first surface, a second surface opposite to the first surface, and a side surface interconnecting the first surface and the second surface. The chip carrier includes an insulator defining two holes, and two electrodes. Each electrode includes a first contact end exposed on the first surface and separated from the side surface by the insulator, a second contact end exposed on the second surface, and a connecting portion connecting the first contact end to the second contact end; the connecting portion has a bent part received in the hole. The LED chip is mounted on the first surface of the chip carrier. The encapsulation covers the LED chip.

Abstract: An exemplary light emitting diode (LED) package includes a substrate, an electrical member formed on the substrate, an LED chip mounted on the substrate and electrically connected to the electrical member, and a heat-dissipating member formed on the electrical member. The heat-dissipating member helps the LED chip to dissipate heat generated thereby when the LED chip is in operation.

Abstract: An exemplary LED package includes first and second electrodes, an LED chip and two electrically conductive wires. The first electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the first electrode. The second electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the second electrode. The LED chip has a bottom surface attached to the top surface of the first electrode, and a top surface on which a first pad and a second pad are formed. One of the electrically conductive wires has an end connecting to the first pad and an opposite end joining with a bottom of the recess of the first electrode. The other has an end connecting to the second pad and an opposite end joining with a bottom of the recess of the second electrode.