Patents by Inventor How T. Lin

How T. Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6644864
    Abstract: The present invention relates generally to fiber optical arrays, and particularly, but not by way of limitation, to 3-dimentional array fiber optical couplers. More particularly, the present invention provides means of coupling semiconductor laser light sources to fiber-optic transmission devices.
    Type: Grant
    Filed: March 14, 2002
    Date of Patent: November 11, 2003
    Assignee: International Business Machines Corporation
    Inventors: Benson Chan, Richard R. Hall, How T. Lin, John H. Sherman
  • Patent number: 6635866
    Abstract: An optical coupler that provides for the direct mounting of integrated circuit(s). The coupler includes a two-part housing with grooves for accommodating optical fibers that are held in place when the two parts are put together. Circuitry is formed on the housing and solder balls, when heated to a liquid state and cooled (reflowed), are used to attach integrated circuit(s) onto the housing. At least one of these integrated circuit(s) is an optical die that is positioned in close proximity to the optical fibers to provide for the receipt and/or transmission of optical signals. The reflowing of the solder balls forms an electrical connection between the circuitry on the housing and the integrated circuit(s) and provides for alignment of these components. The housing is attached to a circuitized substrate using reflowed solder balls or wirebonds.
    Type: Grant
    Filed: April 19, 2001
    Date of Patent: October 21, 2003
    Assignee: Internation Business Machines Corporation
    Inventors: Benson Chan, Richard R. Hall, How T. Lin, John H. Sherman
  • Publication number: 20030178471
    Abstract: An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.
    Type: Application
    Filed: March 20, 2002
    Publication date: September 25, 2003
    Applicant: International Business Machines Corporation
    Inventors: Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith
  • Publication number: 20030174970
    Abstract: The present invention relates generally to fiber optical arrays, and particularly, but not by way of limitation, to 3-dimentional array fiber optical couplers. More particularly, the present invention provides means of coupling semiconductor laser light sources to fiber-optic transmission devices.
    Type: Application
    Filed: March 14, 2002
    Publication date: September 18, 2003
    Applicant: International Business Machines Corporation
    Inventors: Benson Chan, Richard R. Hall, How T. Lin, John H. Sherman
  • Patent number: 6527457
    Abstract: An optical fiber guide includes a matrix of holes integrated directly into a substrate on which one or more optical chips are mounted. The substrate therefore functions both as a guide for optically coupling a plurality of optical fibers to an optical chip, as well as a carrier for the optical chip itself. The size of the fiber guide and its integration density is therefore improved over conventional fiber connectors. The substrate is preferably made of a material having a coefficient of thermal expansion substantially similar to the coefficient of thermal expansion of the optical chip. This ensures that the optical fibers will remain optically coupled to the chip through the matrix of holes in the substrate regardless of external temperature influences. If desired, integrated circuits may be mounted onto the substrate to increase the functionality of the fiber guide.
    Type: Grant
    Filed: February 1, 2001
    Date of Patent: March 4, 2003
    Assignee: International Business Machines Corporation
    Inventors: Benson Chan, Richard R. Hall, How T. Lin, John H. Sherman
  • Publication number: 20020189861
    Abstract: The present invention provides an interconnect between layers of a circuit board. A conductive object is embedded in the layer of a circuit board.
    Type: Application
    Filed: June 19, 2001
    Publication date: December 19, 2002
    Applicant: International Business Machines Corporation
    Inventors: Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith
  • Publication number: 20020154869
    Abstract: An optical coupler that provides for the direct mounting of integrated circuit(s). The coupler includes a two-part housing with grooves for accommodating optical fibers that are held in place when the two parts are put together. Circuitry is formed on the housing and solder balls, when heated to a liquid state and cooled (reflowed), are used to attach integrated circuit(s) onto the housing. At least one of these integrated circuit(s) is an optical die that is positioned in close proximity to the optical fibers to provide for the receipt and/or transmission of optical signals. The reflowing of the solder balls forms an electrical connection between the circuitry on the housing and the integrated circuit(s) and provides for alignment of these components. The housing is attached to a circuitized substrate using reflowed solder balls or wirebonds.
    Type: Application
    Filed: April 19, 2001
    Publication date: October 24, 2002
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benson Chan, Richard R. Hall, How T. Lin, John H. Sherman
  • Publication number: 20020102072
    Abstract: An optical fiber guide includes a matrix of holes integrated directly into a substrate on which one or more optical chips are mounted. The substrate therefore functions both as a guide for optically coupling a plurality of optical fibers to an optical chip, as well as a carrier for the optical chip itself. The size of the fiber guide and its integration density is therefore improved over conventional fiber connectors. The substrate is preferably made of a material having a coefficient of thermal expansion substantially similar to the coefficient of thermal expansion of the optical chip. This ensures that the optical fibers will remain optically coupled to the chip through the matrix of holes in the substrate regardless of external temperature influences. If desired, integrated circuits may be mounted onto the substrate to increase the functionality of the fiber guide.
    Type: Application
    Filed: February 1, 2001
    Publication date: August 1, 2002
    Applicant: International Business Machines Corporation
    Inventors: Benson Chan, Richard R. Hall, How T. Lin, John H. Sherman
  • Patent number: 5315227
    Abstract: A solar recharge station is described having a contact area, a battery bank charge area and a solar panel array for maintaining the battery bank charged. The contact area includes electric contacts formed for engagement automatically by contacts on an electric powered vehicle as the vehicle enters the contact area. The battery bank is connected so that its energy is available for either recharging the vehicle or other use, and in case the vehicle needs a recharge but the battery banks lacks sufficient charge, ordinary house voltage is used.
    Type: Grant
    Filed: January 29, 1993
    Date of Patent: May 24, 1994
    Inventors: Mark V. Pierson, How T. Lin
  • Patent number: 5290992
    Abstract: The present invention is an apparatus and method for maximizing light beam utilization in patterning applications by positioning a plurality of mask mirrors in the light beam path to form patterned light onto a plurality of work pieces. Each mask mirror is designed so that a portion of the light beam area needed for exposing a work piece to patterned light is reflected from the mask mirror, while the remainder is passed through the mask mirror to another mask mirror. Alternatively, each mask mirror can be designed so that a portion of the light beam area needed for exposing a work piece to patterned light is passed through the mask mirror, while the remainder is reflected to another mask mirror.
    Type: Grant
    Filed: October 7, 1992
    Date of Patent: March 1, 1994
    Assignee: International Business Machines Corporation
    Inventors: How T. Lin, Mark V. Pierson