Patents by Inventor Howe Yin Loo
Howe Yin Loo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10136516Abstract: The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.Type: GrantFiled: May 29, 2017Date of Patent: November 20, 2018Assignee: Intel CorporationInventors: Howe Yin Loo, Choong Kooi Chee
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Patent number: 10085342Abstract: A microelectronic device incorporating an air core inductor having one or more inserts to provide efficiency of the inductor are described. One or more inserts having a selected permeability may be placed within regions defined by coils of the air core inductor. The inserts can be formed of a solid material of the selected permeability or such a material can be applied to other structures, such as circuit components. Other embodiments may be described and/or claimed.Type: GrantFiled: December 13, 2016Date of Patent: September 25, 2018Assignee: Intel CorporationInventors: Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim, Chin Lee Kuan, Howe Yin Loo
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Patent number: 10083922Abstract: A device and method of utilizing spiral interconnects for voltage and power regulation are shown. Examples of spiral interconnects include air core inductors. An integrated circuit package attached to a motherboard using spiral interconnects is shown. Methods of attaching an integrated circuit package to a motherboard using spiral interconnects are shown including air core inductors. Methods of attaching spiral interconnects include using electrically conductive adhesive or solder.Type: GrantFiled: November 23, 2016Date of Patent: September 25, 2018Assignee: Intel CorporationInventors: Min Suet Lim, Chin Lee Kuan, Eng Huat Goh, Khang Choong Yong, Bok Eng Cheah, Jackson Chung Peng Kong, Howe Yin Loo
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Patent number: 10041282Abstract: A personal computing device is provided with a first housing portion, a second housing portion, and a hinge joining the first housing portion to the second housing portion. The hinge is configured to allow the first housing portion to rotate substantially three-hundred-sixty degrees relative to the second housing portion. The hinge can be implemented as a plurality of interlinked parallel hinge segments, each hinge segment to rotate about a respective one of a plurality of parallel axes of the hinge to enable the rotation of the first housing portion.Type: GrantFiled: December 24, 2015Date of Patent: August 7, 2018Assignee: Intel CorporationInventors: Bok Eng Cheah, Howe Yin Loo, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh
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Patent number: 10036187Abstract: An apparatus is provided including a docking device to accept a computing device, the docking device including a keyboard and a hinge to connect the computing device to the keyboard, the hinge is configured to allow the computing device, when connected to the hinge, to rotate relative to the keyboard in a laptop orientation. The hinge includes a plurality of interlinked parallel hinge segments at least partially enclosed in a flexible covering, and each hinge segment is to rotate about a respective one of a plurality of parallel axes of the hinge.Type: GrantFiled: January 15, 2016Date of Patent: July 31, 2018Assignee: Intel CorporationInventors: Bok Eng Cheah, Howe Yin Loo, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh
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Publication number: 20180175002Abstract: A system-in-package apparatus includes a package substrate configured to carry at least one semiconductive device on a die side and a package bottom interposer disposed on the package substrate on a land side. A land side board mates with the package bottom interposer, and enough vertical space is created by the package bottom interposer to allow space for at least one device disposed on the package substrate on the land side.Type: ApplicationFiled: December 15, 2016Publication date: June 21, 2018Inventors: Howe Yin Loo, Eng Huat Goh, Min Suet Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong
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Patent number: 10000954Abstract: A personal computing device is provided with a first housing portion, a second housing portion, and a hinge joining the first housing portion to the second housing portion. The hinge is configured to allow the first housing portion to rotate substantially three-hundred-sixty degrees relative to the second housing portion. The hinge can be implemented as a plurality of interlinked parallel hinge segments, each hinge segment to rotate about a respective one of a plurality of parallel axes of the hinge to enable the rotation of the first housing portion.Type: GrantFiled: December 24, 2015Date of Patent: June 19, 2018Assignee: Intel CorporationInventors: Bok Eng Cheah, Howe Yin Loo, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh
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Patent number: 10000953Abstract: An apparatus is provided including a docking device to accept a computing device, the docking device including a keyboard and a hinge to connect the computing device to the keyboard, the hinge is configured to allow the computing device, when connected to the hinge, to rotate relative to the keyboard in a laptop orientation. The hinge includes a plurality of interlinked parallel hinge segments at least partially enclosed in a flexible covering, and each hinge segment is to rotate about a respective one of a plurality of parallel axes of the hinge.Type: GrantFiled: January 15, 2016Date of Patent: June 19, 2018Assignee: Intel CorporationInventors: Bok Eng Cheah, Howe Yin Loo, Min Suet Lim, Chung Peng Jackson Kong, Poh Tat Oh
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Publication number: 20180168043Abstract: A microelectronic device incorporating an air core inductor having one or more inserts to provide efficiency of the inductor are described. One or more inserts having a selected permeability may be placed within regions defined by coils of the air core inductor. The inserts can be formed of a solid material of the selected permeability or such a material can be applied to other structures, such as circuit components. Other embodiments may be described and/or claimed.Type: ApplicationFiled: December 13, 2016Publication date: June 14, 2018Inventors: Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim, Chin Lee Kuan, Howe Yin Loo
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Publication number: 20180157289Abstract: Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the users skin in the portion of the users body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the users body, the second electrode is arranged to not contact the users skin in the portion of the users body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.Type: ApplicationFiled: January 12, 2018Publication date: June 7, 2018Inventors: Thorsten Meyer, Dirk Plenkers, Hans-Joachim Barth, Bernd Waidhas, Yen Hsiang Chew, Kooi Chi Ooi, Howe Yin Loo
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Publication number: 20180145042Abstract: A device and method of utilizing spiral interconnects for voltage and power regulation are shown. Examples of spiral interconnects include air core inductors. An integrated circuit package attached to a motherboard using spiral interconnects is shown. Methods of attaching an integrated circuit package to a motherboard using spiral interconnects are shown including air core inductors. Methods of attaching spiral interconnects include using electrically conductive adhesive or solder.Type: ApplicationFiled: November 23, 2016Publication date: May 24, 2018Inventors: Min Suet Lim, Chin Lee Kuan, Eng Huat Goh, Khang Choong Yong, Bok Eng Cheah, Jackson Chung Peng Kong, Howe Yin Loo
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Publication number: 20180145051Abstract: A system-in-package apparatus includes a package substrate configured to carry at least one semiconductive device on a die side and a through-mold via package bottom interposer disposed on the package substrate on a land side. A land side board mates with the through-mold via package bottom interposer, and enough vertical space is created by the through-mold via package bottom interposer to allow space for at least one device disposed on the package substrate on the land side.Type: ApplicationFiled: November 21, 2016Publication date: May 24, 2018Inventors: Howe Yin Loo, Eng Huat Goh, Min Suet Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong
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Patent number: 9904321Abstract: Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the user's skin in the portion of the user's body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the user's body, the second electrode is arranged to not contact the user's skin in the portion of the user's body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.Type: GrantFiled: November 12, 2014Date of Patent: February 27, 2018Assignee: INTEL CORPORATIONInventors: Thorsten Meyer, Dirk Plenkers, Hans-Joachim Barth, Bernd Waidhas, Yen Hsiang Chew, Kooi Chi Ooi, Howe Yin Loo
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Publication number: 20170265306Abstract: The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.Type: ApplicationFiled: May 29, 2017Publication date: September 14, 2017Applicant: INTEL CORPORATIONInventors: Howe Yin Loo, Choong Kooi Chee
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Patent number: 9699904Abstract: The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.Type: GrantFiled: March 13, 2012Date of Patent: July 4, 2017Assignee: Intel CorporationInventors: Howe Yin Loo, Choong Kooi Chee
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Publication number: 20170075388Abstract: A computing device includes a flexible display screen, a housing to house at least one processor device and at least one memory element, and a first wing to support a side portion of the display screen. The front face of the housing includes a center portion of the display screen. The first wing is connected to the housing by a hinge, the first wing configured to swivel about an axis defined by the hinge. The hinge is configured to lock the first wing in at least two wing positions, a first of the wing positions supports the side portion of the display screen in a first orientation, a second of the wing positions supports the side portion of the display screen in a second orientation, and the side portion of the display screen is active in the first orientation and hidden in the second orientation.Type: ApplicationFiled: September 13, 2015Publication date: March 16, 2017Inventors: Chee Chun Yee, David W. Browning, Bok Eng Cheah, Jackson Chung Peng Kong, Min Suet Lim, Howe Yin Loo, Poh Tat Oh
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Publication number: 20160274621Abstract: Embodiments of wearable electronic devices, components thereof, and related systems and techniques are disclosed herein. For example, a wearable electronic device may include a wearable support structure having a first surface and a second surface; a first electrode located at the first surface, wherein, when the wearable electronic device is worn by a user on a portion of the user's body, the first electrode is arranged to contact the user's skin in the portion of the user's body; a second electrode located at the second surface, wherein, when the wearable electronic device is worn by a user on the portion of the user's body, the second electrode is arranged to not contact the user's skin in the portion of the user's body; and a resistance switch having first and second input terminals coupled to the first and second electrodes, respectively. Other embodiments may be disclosed and/or claimed.Type: ApplicationFiled: November 12, 2014Publication date: September 22, 2016Inventors: Thorsten Meyer, Dirk Plenkers, Hans-Joachim Barth, Bernd Waidhas, Yen Hsiang Chew, Kooi Chi Ooi, Howe Yin Loo
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Patent number: 9360896Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low-profile hinge design that includes a first segment that connects to a first element using a first coupler and to a second segment that connects to the first segment using a second coupler, where the second segment connects to a second element using a third coupler. The first coupler, the second coupler, and the third coupler may each have a first coupling arm and a second coupling arm and the first coupling arm can be offset from a plane of the second coupling arm by about five degrees to about forty-five degrees.Type: GrantFiled: March 28, 2014Date of Patent: June 7, 2016Assignee: Intel CorporationInventors: Min Suet Lim, Bok Eng Cheah, Howe Yin Loo, Jackson Chung Peng Kong, Poh Tat Oh
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Patent number: D759029Type: GrantFiled: May 21, 2015Date of Patent: June 14, 2016Assignee: Intel CorporationInventors: Howe Yin Loo, Greg A. La Tour, Chan Kim Lee, Bok Eng Cheah, Khai Ern See, Han Kung Chua, Chow Soon Lim, Choy Mei Yeow
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Patent number: D773452Type: GrantFiled: September 14, 2015Date of Patent: December 6, 2016Assignee: Intel CorporationInventors: Bok Eng Cheah, Howe Yin Loo, Min Suet Lim, Jackson Chung Peng Kong, Poh Tat Oh