Patents by Inventor Howe Yin Loo

Howe Yin Loo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160130849
    Abstract: A personal computing device is provided with a first housing portion, a second housing portion, and a hinge joining the first housing portion to the second housing portion. The hinge is configured to allow the first housing portion to rotate substantially three-hundred-sixty degrees relative to the second housing portion. The hinge can be implemented as a plurality of interlinked parallel hinge segments, each hinge segment to rotate about a respective one of a plurality of parallel axes of the hinge to enable the rotation of the first housing portion.
    Type: Application
    Filed: December 24, 2015
    Publication date: May 12, 2016
    Inventors: Bok Eng Cheah, Howe Yin Loo, Min Suet Lim, Jackon Chung Peng Kong, Poh Tat Oh
  • Publication number: 20160132077
    Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low profile hinge design that includes a micro-hinge. The micro-hinge can couple a first element to a second element and can include a first attachment that couples to the first element, a second attachment that couples to the second element, and a plurality of linkages that couples the first attachment to the second attachment. The low profile hinge can further include a plurality of micro-hinges and a plurality of support rods.
    Type: Application
    Filed: January 15, 2016
    Publication date: May 12, 2016
    Inventors: Bok Eng Cheah, Howe Yin Loo, Min Suet Lim, Jackon Chung Peng Kong, Poh Tat Oh
  • Publication number: 20150277506
    Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low profile hinge design that includes a micro-hinge. The micro-hinge can couple a first element to a second element and can include a first attachment that couples to the first element, a second attachment that couples to the second element, and a plurality of linkages that couples the first attachment to the second attachment. The low profile hinge can further include a plurality of micro-hinges and a plurality of support rods.
    Type: Application
    Filed: March 29, 2014
    Publication date: October 1, 2015
    Inventors: Bok Eng Cheah, Howe Yin Loo, Min Suet Lim, Jackson Chung Peng Kong, Poh Tat Oh
  • Publication number: 20150277505
    Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a low-profile hinge design that includes a first segment that connects to a first element using a first coupler and to a second segment that connects to the first segment using a second coupler, where the second segment connects to a second element using a third coupler. The first coupler, the second coupler, and the third coupler may each have a first coupling arm and a second coupling arm and the first coupling arm can be offset from a plane of the second coupling arm by about five degrees to about forty-five degrees.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 1, 2015
    Inventors: Min Suet Lim, Bok Eng Cheah, Howe Yin Loo, Jackson Chung Peng Kong, Poh Tat Oh
  • Publication number: 20140293563
    Abstract: The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.
    Type: Application
    Filed: March 13, 2012
    Publication date: October 2, 2014
    Inventors: Howe Yin Loo, Choong Kooi Chee
  • Patent number: D756349
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: May 17, 2016
    Assignee: Intel Corporation
    Inventors: Min Suet Lim, Bok Eng Cheah, Howe Yin Loo, Jackson Chung Peng Kong, Poh Tat Oh