Patents by Inventor Hozumi Yasuda
Hozumi Yasuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20070187259Abstract: A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.Type: ApplicationFiled: March 9, 2007Publication date: August 16, 2007Inventors: Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita, Hozumi Yasuda
-
Publication number: 20070187257Abstract: An electrolytic processing apparatus can maintain a difference in electric resistance between a recessed portion and a raised portion in the surface of a workpiece, thereby providing a processed surface with improved flatness.Type: ApplicationFiled: March 16, 2005Publication date: August 16, 2007Applicant: EBARA CORPORATIONInventors: Ikutaro Noji, Hozumi Yasuda, Takeshi Iizumi, Itsuki Kobata, Kazuto Hirokawa, Takayuki Saito, Tsukuru Suzuki, Yasushi Toma, Akira Kodera
-
Publication number: 20070181432Abstract: The present invention replaces all or a portion of substrate processing by chemical-mechanical polishing with electrolytic processing using deionized water, ultrapure water or the like. An electrolytic processing apparatus comprises: a chemical-mechanical polishing section for chemically-mechanically polishing a surface of a substrate; an electrolytic processing section having a processing electrode and a feeding electrode, and also having an ion exchanger provided at least either between the substrate and the processing electrode or between the substrate and the feeding electrode, for electrolytically processing a surface of a workpiece under existence of a solution by applying a voltage between the processing electrode and the feeding electrode; and a top ring capable of freely moving between the chemical-mechanical polishing section and the processing electrode section.Type: ApplicationFiled: March 22, 2007Publication date: August 9, 2007Inventors: Mitsuhiko Shirakashi, Masayuki Kumekawa, Hozumi Yasuda, Itsuki Kobata, Ikutaro Noji, Kaori Yoshida
-
Publication number: 20070095659Abstract: The present invention provides an electrolytic processing apparatus and an electrolytic processing method which can perform processing of a substrate without destroying devices formed in the substrate even when a fragile material is employed in the substrate and which can reduce non-uniformity in the contact pressure of an electrode member on a substrate during processing, thereby equalizing the processing amount in the entire processing surface of the substrate and the surface roughness after processing. The electrolytic processing apparatus includes: a substrate holder for holding a substrate; an electrode base provided with an electrode member for contact with the substrate, held by the substrate holder, in the presence of a liquid to effect processing of the substrate; and a support base for floatingly supporting the electrode base by a floating mechanism.Type: ApplicationFiled: July 28, 2004Publication date: May 3, 2007Inventors: Hozumi Yasuda, Ikutaro Noji, Kazuto Hirokawa, Takeshi Iizumi, Itsuki Kobata
-
Patent number: 7208076Abstract: A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.Type: GrantFiled: September 11, 2002Date of Patent: April 24, 2007Assignee: Ebara CorporationInventors: Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita, Hozumi Yasuda
-
Publication number: 20070004324Abstract: A polishing apparatus includes a polishing object holding mechanism for holding an object to be polished, and a table having a polishing surface. The polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing object held by the holding mechanism and the polishing surface of the table. An elastic sheet 11 is stretched over the upper surface of the table, and a polishing pad 16 having a polishing surface on the upper side thereof is replaceably stretched over the elastic sheet 11.Type: ApplicationFiled: October 24, 2003Publication date: January 4, 2007Inventors: Masayoshi Hirose, Hozumi Yasuda, Kazuto Hirokawa, Ikutarou Noji
-
Patent number: 7156725Abstract: There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.Type: GrantFiled: July 10, 2002Date of Patent: January 2, 2007Assignee: Ebara CorporationInventors: Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi
-
Publication number: 20060234508Abstract: There is provided a substrate processing apparatus which can process a substrate by using an electrolytic processing method, while reducing a load upon a CMP processing to the least possible extent. The substrate processing apparatus of the present invention includes: an electrolytic processing unit (36) for electrolytically removing the surface of the substrate W having a to-be-processed film formed in said surface, said unit including a feeding section (373) that comes into contact with said surface of the substrate W; a bevel-etching unit (48) for etching away the to-be-processed film remaining unprocessed at the portion of the substrate that has been in contact with the feeding section (373) in the electrolytic processing unit (36); a chemical mechanical polishing unit (34) for chemically and mechanically polishing the surface of the substrate.Type: ApplicationFiled: May 16, 2003Publication date: October 19, 2006Inventors: Mitsuhiko Shirakashi, Hozumi Yasuda, Masayuki Kumekawa, Itsuki Kobata
-
Publication number: 20060234609Abstract: The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.Type: ApplicationFiled: June 14, 2006Publication date: October 19, 2006Inventors: Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi
-
Patent number: 7101465Abstract: There is provided an electrolytic processing device including: a processing electrode to be brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section for supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided.Type: GrantFiled: January 7, 2003Date of Patent: September 5, 2006Assignee: Ebara CorporationInventors: Itsuki Kobata, Mitsuhiko Shirakashi, Masayuki Kumekawa, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita, Hozumi Yasuda
-
Patent number: 7083507Abstract: The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.Type: GrantFiled: January 5, 2005Date of Patent: August 1, 2006Assignee: Ebara CorporationInventors: Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi
-
Publication number: 20060144711Abstract: A object of this invention is to provide an electrolytic processing method and apparatus that can suppress a change in the electric conductivity of a fluid due to contaminants, such as processing products produced in electrolytic processing, so that the fluid can maintain good flattening properties.Type: ApplicationFiled: July 18, 2003Publication date: July 6, 2006Inventors: Itsuki Kobata, Masayuki Kumekawa, Osamu Nabeya, Roberto Serikawa, Takayuki Saito, Tsukuru Suzuki, Akira Kodera, Hozumi Yasuda, Takeshi Iizumi, Mitsuhiko Shirakashi
-
Publication number: 20050121328Abstract: This invention relates to an electrolytic processing apparatus and method useful for processing a conductive material formed in the surface of a substrate, or for removing impurities adhering to the surface of a substrate. An electrolytic processing apparatus, including, a processing electrode that can come close to a workpiece, a feeding electrode for feeding electricity to the workpiece, an ion exchanger disposed in the space between the workpiece and the processing and the feeding electrodes, a fluid supply section for supplying a fluid between the workpiece and the ion exchanger, and a power source, wherein the processing electrode and/or the feeding electrode is electrically divided into a plurality of parts, and the power source applies a voltage to each of the divided electrode parts and can control voltage and/or electric current independently for each of the divided electrode parts.Type: ApplicationFiled: January 31, 2003Publication date: June 9, 2005Inventors: Mitsuhiko Shirakashi, Masayuki Kumekawa, Hozumi Yasuda, Itsuki Kobata, Osamu Nabeya
-
Publication number: 20050115838Abstract: There is provided an electrolytic processing apparatus and method that can effect processing of a substrate with high processing precision and can produce an intended form of processed substrate with high accuracy of form. The electrolytic processing apparatus includes: a holder (30) for holding a substrate (W); a processing electrode (32) that can come close to the substrate; a feeding electrode (34) for feeding electricity to the substrate; an ion exchanger (40) disposed in the space between the substrate and the processing electrode, or the substrate and the feeding electrode; a fluid supply section (70) for supplying a fluid into the space; a power source (68) for applying a voltage between the processing electrode and the feeding electrode; a drive sections (44, 56 and 60) for allowing the substrate and the processing electrode, facing each other, to make a relative movement; and a numerical controller (72) for effecting a numerical control of the drive sections.Type: ApplicationFiled: January 7, 2003Publication date: June 2, 2005Inventors: Yuzo Mori, Mitsuhiko Shirakashi, Masayuki Kumekawa, Hozumi Yasuda, Itsuki Kobata, Yasushi Toma
-
Publication number: 20050118935Abstract: The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.Type: ApplicationFiled: January 5, 2005Publication date: June 2, 2005Inventors: Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi
-
Patent number: 6890402Abstract: A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.Type: GrantFiled: July 31, 2001Date of Patent: May 10, 2005Assignee: Ebara CorporationInventors: Yoshihiro Gunji, Hozumi Yasuda, Keisuke Namiki, Hiroshi Yoshida
-
Publication number: 20050072527Abstract: A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.Type: ApplicationFiled: October 26, 2004Publication date: April 7, 2005Inventors: Yoshihiro Gunji, Hozumi Yasuda, Keisuke Namiki, Hiroshi Yoshida
-
Publication number: 20050067289Abstract: An electrolytic processing apparatus can detect the endpoint of electrolytic processing stably with high precision and with a relatively simple construction. The electrolytic processing apparatus including: a processing electrode which can come close to or into contact with a processing object; a feeding electrode for feeding electricity to the processing object; a fluid supply section for supplying fluid between the processing object and at least one of the processing electrode and the feeding electrode; a processing power source for applying a voltage between the processing electrode and the feeding electrode; a drive section for causing relative movement between the processing object and at least one of the processing electrode and the feeding electrode; and an eddy current sensor for detecting the thickness of the processing object from a change in eddy current loss, said sensor being disposed not in contact with or separately by an insulator from the processing electrode and/or the feeding electrode.Type: ApplicationFiled: September 24, 2004Publication date: March 31, 2005Inventors: Ikutaro Noji, Hozumi Yasuda, Takeshi Iizumi, Kazuto Hirokawa, Itsuki Kobata
-
Publication number: 20050051432Abstract: There is provided an electrolytic processing apparatus and method that can effect processing of a workpiece with high processing precision and can produce an intended form of processed workpiece with high accuracy of form. The electrolytic processing apparatus includes: a processing electrode which can come close to a workpiece; a feeding electrode for feeding electricity to the workpiece; an ion exchanger disposed in at least one of the space between the workpiece and the processing electrode and the space between the workpiece and the feeding electrode; a fluid supply section for supplying a fluid to the space between the workpiece and at least one of the processing electrode and the feeding electrode; and a power source for supplying an electric power between the processing electrode and the feeding electrode while arbitrarily controlling at least one of a voltage and an electric current.Type: ApplicationFiled: December 11, 2002Publication date: March 10, 2005Inventors: Mitsuhiko Shirakashi, Masayuki Kumekawa, Hozumi Yasuda, Itsuki Kobata
-
Publication number: 20050035001Abstract: There are provided an electrolytic processing apparatus and an electrolytic processing method which can regenerate an ion exchanger with an enhanced regeneration rate of ion-exchange capacity without adversely affecting the throughput of the apparatus. The electrolytic processing apparatus includes: a holder for holding a workpiece; an electrode section including an electrode, a contact member, and a discharge portion for discharging metal ions which have been taken from the workpiece into the contact member during processing, said electrode section coming close to or into contact with the workpiece held by the holder to effect processing of the workpiece in the presence of a liquid; and a regeneration dummy electrode which can come close to or into contact with the contact member.Type: ApplicationFiled: August 10, 2004Publication date: February 17, 2005Inventors: Hozumi Yasuda, Ikutaro Noji, Kazuto Hirokawa, Takeshi Iizumi, Itsuki Kobata