Patents by Inventor Hsiang Hsu

Hsiang Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230375872
    Abstract: An electronic device is provided. The electronic device includes a first substrate, a polarizer, and a conductive adhesive. The polarizer is disposed on the first substrate and has a conductive layer. The conductive adhesive is disposed on the first substrate and electrically connected to the conductive layer. From a top view, the conductive adhesive is adjacent to an edge of the polarizer and has an extending direction. An angle between the extending direction and an absorption-axis direction of the polarizer is between 80° and 100°.
    Type: Application
    Filed: April 13, 2023
    Publication date: November 23, 2023
    Inventors: Tsung-Che LU, Chieh-Hsiang HSU, Chang-Heng TSAI
  • Publication number: 20230367068
    Abstract: Integrated optical devices and methods of forming the same are disclosed. A method of forming an integrated optical device includes the following steps. A substrate is provided. The substrate includes, from bottom to top, a first semiconductor layer, an insulating layer and a second semiconductor layer. The second semiconductor layer is patterned to form a waveguide pattern. A surface smoothing treatment is performed to the waveguide pattern until a surface roughness Rz of the waveguide pattern is equal to or less than a desired value. A cladding layer is formed over the waveguide pattern.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chan-Hong Chern, Min-Hsiang Hsu
  • Publication number: 20230367062
    Abstract: Disclosed are semiconductor packages and manufacturing method of the semiconductor packages. In one embodiment, a semiconductor package includes a substrate, a first waveguide, a semiconductor die, and an adhesive layer. The first waveguide is disposed on the substrate. The semiconductor die is disposed on the substrate and includes a second waveguide aligned with the first waveguide. The adhesive layer is disposed between the first waveguide and the second waveguide.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo, Tsung-Yuan Yu, Che-Hsiang Hsu, Chewn-Pu Jou, Cheng-Tse Tang
  • Publication number: 20230369520
    Abstract: The present disclosure provides a photo sensing device and a method for forming a photo sensing device. The photo sensing device includes a substrate, a photosensitive member, a superlattice layer and a diffusion barrier structure. The substrate includes a silicon layer at a front surface. The photosensitive member extends into and at least partially surrounded by the silicon layer, wherein an upper portion of the photosensitive member protruding from the silicon layer has a top surface and a facet tapering toward the top surface. The superlattice layer is disposed between the photosensitive member and the silicon layer. The diffusion barrier structure is disposed at a first side of the photosensitive member and a bottom of the diffusion barrier structure is at a level below a top surface of the silicon layer, wherein at least a portion of the diffusion barrier structure is laterally surrounded by the silicon layer.
    Type: Application
    Filed: July 21, 2023
    Publication date: November 16, 2023
    Inventors: CHAN-HONG CHERN, WEIWEI SONG, CHIH-CHANG LIN, LAN-CHOU CHO, MIN-HSIANG HSU
  • Publication number: 20230357670
    Abstract: Provided are a polysaccharide composition and method capable of reducing, whether during pre-wear immersion or during post-wear cleaning, the amount of protein adsorbed on hard contact lenses and orthokeratology lenses. The polysaccharide composition and method reduce the amount of protein adsorbed on hard contact lenses and thereby prevent corneal abrasions and inflammations of the conjunctiva and cornea.
    Type: Application
    Filed: August 8, 2022
    Publication date: November 9, 2023
    Applicant: National Taipei University of Technology
    Inventors: Hsu-Wei Fang, Chen-Ying Su, You-Cheng Chang, Pin-Hsuan Huang, Ling-Hsiang Hsu
  • Patent number: 11808998
    Abstract: Disclosed are apparatus and methods for optical coupling in optical communications. In one embodiment, an apparatus for optical coupling is disclosed. The apparatus includes: a planar layer; an array of scattering elements arranged in the planar layer at a plurality of intersections of a first set of concentric elliptical curves crossing with a second set of concentric elliptical curves rotated proximately 90 degrees to form a two-dimensional (2D) grating; a first taper structure formed in the planar layer connecting a first convex side of the 2D grating to a first waveguide; and a second taper structure formed in the planar layer connecting a second convex side of the 2D grating to a second waveguide. Each scattering element is a pillar into the planar layer. The pillar has a top surface whose shape is a concave polygon having at least 6 corners.
    Type: Grant
    Filed: December 14, 2022
    Date of Patent: November 7, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chan-Hong Chern, Min-Hsiang Hsu
  • Patent number: 11812575
    Abstract: A server system comprises a deck, a front panel arranged on the deck and defining a collecting space; two doors arranged on opposite sides of the deck, and being perpendicular to the front panel; two receiving frame structures arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two periphery corridors are each defined between one of the doors and one of the receiving frame structure facing the one door; two circuit boards arranged between the two receiving frame structures, wherein the two circuit boards comprise a plurality of slits, wherein a central corridor is defined between the two circuit boards; a storage cover disposed above the deck over the two periphery corridors, the central corridor, the two receiving frame structures, and the two circuit boards.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: November 7, 2023
    Assignee: CHENBRO MICOM CO., LTD.
    Inventors: Chien-Wen Wang, Han-Chung Chien, Sheng-Chan Lin, Hao-Hsiang Hsu, Chiung-Wei Lin, An-Hsin Chen
  • Patent number: 11809000
    Abstract: A photonic integrated circuit includes a substrate, an interconnection layer, and a plurality of silicon waveguides. The interconnection layer is over the substrate. The interconnection layer includes a seal ring structure and an interconnection structure surrounded by the seal ring structure. The seal ring structure has at least one recess from a top view. The recess concaves towards the interconnection structure. The silicon waveguides are embedded in the substrate.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: November 7, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Yuan Yu, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Ming Weng, Hua-Kuei Lin, Che-Hsiang Hsu
  • Patent number: 11812578
    Abstract: An enclosure for receiving a plurality of storage components is provided. The enclosure includes a deck, a top cover, a front panel, a stress distributing member, and a pair of component housings. The front panel is disposed between the deck and the top cover disposed over the deck. The stress distributing member traverses an entire width of the deck and is fastened to the deck and the top cover. A front section is defined between the front panel and the stress distributing member. The component housings are arranged in the front section. Each of the component housings has a front end facing outward the enclosure and a back end facing inward the enclosure. Each of the component housings is configured to receive at least a set of one or more of the storage components, and ends of the stress distributing member extend beyond the front ends of the component housings.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: November 7, 2023
    Assignee: CHENBRO MICOM CO., LTD.
    Inventors: Chien-Wen Wang, Han-Chung Chien, Sheng-Chan Lin, Hao-Hsiang Hsu, Chiung-Wei Lin, An-Hsin Chen
  • Patent number: 11796739
    Abstract: Disclosed are edge couplers having a high coupling efficiency and low polarization dependent loss, and methods of making the edge couplers. In one embodiment, a semiconductor device for optical coupling is disclosed. The semiconductor device includes: a substrate; an optical waveguide over the substrate; and a plurality of layers over the optical waveguide. The plurality of layers includes a plurality of coupling pillars disposed at an edge of the semiconductor device. The plurality of coupling pillars form an edge coupler configured for optically coupling the optical waveguide to an optical fiber placed at the edge of the semiconductor device.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: October 24, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Min-Hsiang Hsu, Chewn-Pu Jou, Chan-Hong Chern, Cheng-Tse Tang, Yung-Jr Hung, Lan-Chou Cho
  • Patent number: 11789296
    Abstract: An optical modulator includes a dielectric layer and a waveguide. The waveguide is disposed on the dielectric layer. The waveguide includes an electrical coupling portion, a slab portion, and an optical coupling portion. The slab portion is directly in contact with both of the electrical coupling portion and the optical coupling portion. The slab portion has a first sub-portion and a second sub-portion connected to the first sub-portion. A top surface of the electrical coupling portion, a top surface of the first sub-portion, and a top surface of the second sub-portion are located at different level heights.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: October 17, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Lan-Chou Cho, Chewn-Pu Jou, Feng-Wei Kuo, Huan-Neng Chen, Min-Hsiang Hsu
  • Patent number: 11782338
    Abstract: A photomask and a method of manufacturing a photomask are provided. According to an embodiment, a method includes: providing a substrate; depositing a reflective layer over the substrate; depositing a capping layer over the reflective layer; depositing an absorption layer over the capping layer; and treating the reflective layer by a laser beam to form a border region. The borderer region has a reflectivity less than about 0.1%.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: October 10, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Feng Yuan Hsu, Tran-Hui Shen, Ching-Hsiang Hsu
  • Publication number: 20230314719
    Abstract: An optical device for coupling light propagating between a waveguide and an optical transmission component is provided. The optical device includes a taper portion and a grating portion. The taper portion is disposed between the grating portion and the waveguide. The grating portion includes rows of grating patterns. A first size of a first grating pattern in a first row of grating patterns is larger than a second size of a second grating pattern in a second row of grating patterns. A first distance between the first row of grating patterns and the waveguide is less than a second distance between the second row of grating patterns and the waveguide.
    Type: Application
    Filed: June 8, 2023
    Publication date: October 5, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chan-Hong Chern, Chih-Chang Lin, Chewn-Pu Jou, Chih-Tsung Shih, Feng-Wei Kuo, Lan-Chou Cho, Min-Hsiang Hsu, Weiwei Song
  • Publication number: 20230315393
    Abstract: A random bit generator includes a voltage source, a bit data cell, and a sensing control circuit. The voltage source provides a scan voltage during enroll operations. The data cell includes a first transistor and a second transistor. The first transistor has a first terminal coupled to a first bit line, a second terminal coupled to the voltage source, and a control terminal. The second transistor has a first terminal coupled to a second bit line, a second terminal coupled to the voltage source, and a control terminal. The sensing control circuit is coupled to the first bit line and the second bit line, and outputs a random bit data according to currents generated through the first transistor and the second transistor during an enroll operation of the bit data cell.
    Type: Application
    Filed: June 5, 2023
    Publication date: October 5, 2023
    Applicant: eMemory Technology Inc.
    Inventor: Ching-Hsiang Hsu
  • Patent number: 11770642
    Abstract: An image sensor integrated with a convolutional neural network computation circuit is provided. The image sensor includes: a pixel array including pixels divided into pixel groups, wherein each pixel converts a light signal into a PWM signal; a convolution computation circuit controlling a turn-on time of a corresponding weighted current according to the first PWM signal of each pixel, and accumulating the weighted currents into an integrated current; a comparison circuit converting the integrated current into a second PWM signal and comparing it with that of an adjacent pixel group to output a larger one; and a classification circuit quantizing the second PWM signal to a quantization value according to a weight of a node in a fully-connected layer corresponding to each pixel group, accumulating the quantization values of all pixel groups into a feature value, and comparing the feature value with a feature threshold to obtain a classification result.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: September 26, 2023
    Assignee: National Tsing Hua University
    Inventors: Chih-Cheng Hsieh, Tzu-Hsiang Hsu
  • Patent number: 11769845
    Abstract: The present disclosure provides a photo sensing device, the photo sensing device includes a substrate, including a silicon layer at a front surface, a photosensitive member extending into and at least partially surrounded by the silicon layer, a first doped region having a first conductivity type at a first side of the photosensitive member, wherein the first doped region is in the silicon layer, and a second doped region having a second conductivity type different from the first conductivity type at a second side of the photosensitive member opposite to the first side, wherein the second doped region is in the silicon layer, and the first doped region is apart from the second doped region, and a superlattice layer disposed between the photosensitive member and the silicon layer, wherein the superlattice layer includes a first material and a second material different from the first material.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: September 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chan-Hong Chern, Weiwei Song, Chih-Chang Lin, Lan-Chou Cho, Min-Hsiang Hsu
  • Patent number: 11762147
    Abstract: Integrated optical devices and methods of forming the same are disclosed. A method of forming an integrated optical device includes the following steps. A substrate is provided. The substrate includes, from bottom to top, a first semiconductor layer, an insulating layer and a second semiconductor layer. The second semiconductor layer is patterned to form a waveguide pattern. A surface smoothing treatment is performed to the waveguide pattern until a surface roughness Rz of the waveguide pattern is equal to or less than a desired value. A cladding layer is formed over the waveguide pattern.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: September 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chan-Hong Chern, Min-Hsiang Hsu
  • Patent number: 11764105
    Abstract: A semiconductor device structure includes a silicon-on-insulator (SOI) region. The SOI region includes a semiconductor substrate, a buried oxide layer disposed over the semiconductor substrate, and a silicon layer disposed over the buried oxide layer. The semiconductor device structure also includes a first shallow trench isolation (STI) structure penetrating through the silicon layer and the buried oxide layer and extending into the semiconductor substrate. The first STI structure includes a first liner contacting the semiconductor substrate and the silicon layer, a second liner covering the first liner and contacting the buried oxide layer, and a third liner covering the second liner. The first liner, the second liner and the third liner are made of different materials. The first STI structure also includes a first trench filling layer disposed over the third liner and separated from the second liner by the third liner.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: September 19, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Chia-Hsiang Hsu
  • Patent number: 11759670
    Abstract: A barbell support assembly is provided, including: a base; a support arm, including a connection section and a hook section connected with a first end of the connection section, the connection section being rotatably connected to the base and swingable between a first position and a second position, the hook section defining a hooking space; and a restoration unit, connected with a second end of the connection section, biasing the support arm toward the first position; when a rod of a barbell is received within the hooking space, the barbell drives the support arm to move from the first position to the second position, and when the rod of the barbell is removed from the support arm, the restoration unit forces the support arm to return to the first position.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: September 19, 2023
    Assignee: FITNESS AUTHORITY INDUSTRIAL CO., LTD.
    Inventors: You-Hsiang Hsu, Yu-Chun Huang
  • Patent number: D1003928
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: November 7, 2023
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Cheng-Kuang Lee, Chen-Chieh Wang, Chia-Hsiang Hsu, Rong-Yeu Chang