Abstract: Conductive element structures and methods of manufacture thereof are disclosed. In some embodiments, a method of forming a conductive element in an insulating layer includes: forming a recess in a metal layer disposed over the insulating layer; selectively forming a metal liner on a sidewall of the recess; and etching a via in the insulating layer using the metal layer and the metal liner as a mask.

Abstract: A device comprises a first rounded metal line in a metallization layer over a substrate, a second rounded metal line in the metallization layer, a first air gap between sidewalls of the first rounded metal line and the second metal line, a first metal line in the metallization layer, wherein a top surface of the first metal line is higher than a top surface of the second rounded metal line and a bottom surface of the first metal line is substantially level with a bottom surface of the second rounded metal line and a second air gap between sidewalls of the second rounded metal line and the first metal line.

Abstract: The present disclosure relates to a method of forming a BEOL metallization layer that uses different conductive materials (e.g., metals) to fill different size openings in an inter-level dielectric layer, and an associated apparatus. In some embodiments, the present disclosure relates to an integrated chip having a first plurality of metal interconnect structures disposed within a first BEOL metallization layer, which include a first conductive material. The integrated chip also has a second plurality of metal interconnect structures disposed within the first BEOL metallization layer at positions laterally separated from the first plurality of metal interconnect structures. The second plurality of metal interconnect structures have a second conductive material that is different than the first conductive material.

Abstract: Conductive element structures and methods of manufacture thereof are disclosed. In some embodiments, a method of forming a conductive element in an insulating layer includes: forming a recess in a metal layer disposed over the insulating layer; selectively forming a metal liner on a sidewall of the recess; and etching a via in the insulating layer using the metal layer and the metal liner as a mask.

Abstract: Disclosed herein is a structure conductive lines disposed in a base layer and separated by a first region. Pillars are each disposed over a respective one of the conductive lines. A dielectric fill layer is disposed over the pillars and extending between the pillars into the first region, and a void is disposed in the dielectric fill layer in the first region between the conductive lines.

Abstract: An analog to digital converter is disclosed herein. The analog to digital converter includes a bit conversion module and a control module. The bit conversion module is configured to generate a quantization output in accordance with an input signal. The control module is configured to control the bit conversion module, so as to make the bit conversion module operate in one of a sigma delta mode and a successive approximation mode.

Abstract: An analog to digital converter is disclosed herein. The analog to digital converter includes a bit conversion module and a control module. The bit conversion module is configured to generate a quantization output in accordance with an input signal. The control module is configured to control the bit conversion module, so as to make the bit conversion module operate in one of a sigma delta mode and a successive approximation mode.

Abstract: A method to reduce the integral non-linearity (INL) of a digital-to-analog converter (DAC) and a DAC implementing said method are disclosed. The method in this invention is a pseudo dynamic element matching (PDEM) method. Compared with a prior art, the method of this invention provides a better performance in glitch. Compared with another prior art, the method of this invention also guarantees that DEM will not fail even if the input digital code remains constant.

Abstract: A container data center includes a container, and a number of cabinets arranged in the container. A shockproof device is mounted to the bottom of the cabinet. A supporting apparatus is mounted between the top of the cabinet and the container. The supporting apparatus includes a first sleeve fixed to the top of the container, and a second sleeve, wherein a first end of the second sleeve is slidably engaged in the first sleeve, and a second end of the second sleeve is fixed to the top of the top wall of the cabinet.

Abstract: A method to reduce the integral non-linearity (INL) of a digital-to-analog converter (DAC) and a DAC implementing said method are disclosed. The method in this invention is a pseudo dynamic element matching (PDEM) method. Compared with a prior art, the method of this invention provides a better performance in glitch. Compared with another prior art, the method of this invention also guarantees that DEM will not fail even if the input digital code remains constant.

Abstract: A supporting apparatus is used for supporting a device on a platform. The supporting apparatus includes a base fixed to the platform, a shockproof member, and a sliding member. The base defines a receiving recess for receiving the shockproof member. The shockproof member is attached to an inner sidewall bounding the receiving recess. The sliding member is supported on a bottom of the receiving recess. The bottom of the receiving recess is concave. The sliding member includes a block to be engaged in the device. The bottom of the sliding member is convex for mating with the bottom of the receiving recess.

Abstract: A supporting apparatus is used for supporting a device on a platform. The supporting apparatus includes a base fixed to the platform, a shockproof member, and a sliding member. The base defines a receiving recess for receiving the shockproof member. The shockproof member is attached to an inner sidewall bounding the receiving recess. The sliding member is supported on a bottom of the receiving recess. The sliding member includes a locking block, to be engaged in the device.

Abstract: A container data center includes a container, and a number of cabinets arranged in the container. A shockproof device is mounted to the bottom of the cabinet. A supporting apparatus is mounted between the top of the cabinet and the container. The supporting apparatus includes a first sleeve fixed to the top of the container, and a second sleeve, wherein a first end of the second sleeve is slidably engaged in the first sleeve, and a second end of the second sleeve is fixed to the top of the top wall of the cabinet.

Abstract: A mounting apparatus is provided to mount a data storage device includes a bracket and a number of fastening members. The bracket includes two opposite clamping arms to sandwich the data storage device. The fastening members extend through the clamping arms to be locked to the data storage device. Two resilient portions are respectively formed on a top and a bottom of each clamping arm.

Abstract: A hard disc drive carrier comprises a main body, a first element extending from the main body, a second element extending from the main body opposite to the first element with a hard disc disposed between the first and second elements, at least one first pad disposed on the first element, and at least one second pad disposed on the second element. The first and second elements serve as rails for the hard disc drive carrier sliding in a hard disc drive bay. When the hard disc drive carrier reaches a predetermined position in the hard disc drive bay, the first and second pads abuts the hard disc drive bay to avoid vibration between the hard disc drive carrier and the hard disc drive bay.

Abstract: A hard disc drive carrier comprises a main body, a first element extending from the main body, a second element extending from the main body opposite to the first element with a hard disc disposed between the first and second elements, at least one first pad disposed on the first element, and at least one second pad disposed on the second element. The first and second elements serve as rails for the hard disc drive carrier sliding in a hard disc drive bay. When the hard disc drive carrier reaches a predetermined position in the hard disc drive bay, the first and second pads abuts the hard disc drive bay to avoid vibration between the hard disc drive carrier and the hard disc drive bay.

Abstract: A server system and a vibration-free extractable hard disc drive assembly thereof. The server system includes a chassis and the vibration-free hard disc drive assembly. The assembly is disposed in the chassis in an extractable manner. The vibration-free hard disc drive assembly includes a tray, a vibration-absorbing pad, and a hard disc drive. The tray is disposed in the chassis in an extractable manner. The vibration-absorbing pad is disposed on the tray. The hard disc drive is disposed on the tray via the vibration-absorbing pad. Thus, external vibration transmitted to the tray is reduced by the vibration-absorbing pad, limiting the vibration transmitted to the hard disc drive; therefore, the vibration applied to the hard disc drive is reduced.

Abstract: A server system and a vibration-free extractable hard disc drive assembly thereof. The server system includes a chassis and the vibration-free hard disc drive assembly. The assembly is disposed in the chassis in an extractable manner. The vibration-free hard disc drive assembly includes a tray, a vibration-absorbing pad, and a hard disc drive. The tray is disposed in the chassis in an extractable manner. The vibration-absorbing pad is disposed on the tray. The hard disc drive is disposed on the tray via the vibration-absorbing pad. Thus, external vibration transmitted to the tray is reduced by the vibration-absorbing pad, limiting the vibration transmitted to the hard disc drive; therefore, the vibration applied to the hard disc drive is reduced.