Patents by Inventor Hsiao Chen

Hsiao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9500857
    Abstract: A microelectromechanical system (MEMS) device includes a substrate and at least one MEMS unit disposed on the substrate. The MEMS unit includes at least one first electrode, at least one second electrode, at least one landing element, and a hinge layer. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate. The landing element is disposed on the substrate. The hinge layer includes a hinge portion and at least one cantilever portion. The hinge portion is connected to the second electrode. The cantilever portion is connected to the hinge portion. The cantilever portion has a first opening and at least one spring disposed in the first opening and connected to at least one side of the first opening. When a voltage difference exists between the first electrode and the second electrode, the hinge portion is distorted and the spring thus touches the landing element.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: November 22, 2016
    Assignee: Himax Display, Inc.
    Inventors: Hui-Lun Chen, Wei-Hsiao Chen, Chien-Tang Wang, Nan Liu, Roland V. Gelder, Chun-Hao Su
  • Patent number: 9503130
    Abstract: A signal transmitter with adjustable signal power includes a housing, a first adjustable metal shielding layer and a circuit board. The first adjustable metal shielding layer is disposed within the housing. The area of the first adjustable metal shielding layer consists of a first shielding area and a first un-shielding area. The first shielding area and the first un-shielding area are adjustable. The circuit board is disposed within the housing, and is located below the first adjustable metal shielding layer. The circuit board is electrically connected with the first adjustable metal shielding layer, and includes a signal emission chip. The signal emission chip is configured for adjusting signal emission power to emit a signal according to the first un-shielding area of the first adjustable metal shielding layer. A message generating system and a signal power adjusting method are disclosed herein as well.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: November 22, 2016
    Assignee: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Yeh-Kuang Wu, Liang-Chun Chang, Hui-Chun Wang, Wen-Tai Hsieh, Hsiao-Chen Chang
  • Publication number: 20160317659
    Abstract: The present invention provides a pharmaceutical kit, methods for cancer treatment and for preparing a metal nanoparticle-antibody fragment conjugate, which can reduce the recurrence rate of cancer and provide a safer and less invasive therapeutic method for cancer treatment.
    Type: Application
    Filed: July 12, 2016
    Publication date: November 3, 2016
    Inventor: Chieh Hsiao Chen
  • Publication number: 20160311678
    Abstract: A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.
    Type: Application
    Filed: June 30, 2016
    Publication date: October 27, 2016
    Inventors: Tung-Feng Wu, Wei-Hsiao Chen, Chun-Hao Su, Jui-Wen Chen, Mao-Chien Cheng
  • Publication number: 20160296291
    Abstract: One example method to determine a position of a probe in a surgical site with a plurality of reference structures may include receiving a three-dimensional image of the surgical site generated before the probe enters the surgical site and receiving a first two-dimensional image generated by the probe from a position within the surgical site. The three-dimensional image is associated with a first coordinate system, and the first two-dimensional image is associated with a second coordinate system.
    Type: Application
    Filed: August 19, 2015
    Publication date: October 13, 2016
    Inventors: Chieh Hsiao CHEN, Kuan Ju WANG
  • Patent number: 9466104
    Abstract: A method is provided for a computing device with an imaging device to detect a characteristic of an analyte in a specimen sample from a specimen test strip with reaction areas that have colors based on the characteristic of the analyte in different ranges of values. The method includes capturing images of the specimen test strip under different exposures or light intensities, selecting an image comprising captured reaction areas that have a proper exposure or a proper lighting intensity from the images, selecting a captured reaction area from the image, and correlating a color of the captured reaction area to a value of the characteristic of the analyte.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: October 11, 2016
    Assignee: IXENSOR INC.
    Inventors: Tungmeng Tsai, Chieh Hsiao Chen, Yenyu Chen
  • Patent number: 9439524
    Abstract: An anti-spray drinking bottle has a body, a lid, at least one check valve, a dividing mount and a guiding element. The body has a storage recess and a screwing section. The lid is detachably connected to the body and has a threaded segment connected to the screwing section, a buffering segment connected to the threaded segment and a buffering space formed in the buffering segment. The at least one check valve is mounted on the lid. The dividing board is connected to the lid, is mounted in the body and has a dividing board, a sidewall, an outlet pipe and an abutting segment. The guiding element is connected to the dividing mount, is mounted in the body and has an elongate straw tube connected to the outlet pipe.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: September 13, 2016
    Inventor: Hsiao-Chen Liang
  • Patent number: 9425274
    Abstract: The semiconductor device structures and methods for forming the same are provided. The semiconductor device structure includes a metal gate over a substrate. A first spacer is formed over sidewalls of the metal gate and having a first height. A second spacer is formed over the sidewalls of the metal gate and having a second height. The first height is higher than the second height. The first spacer is farther from the sidewalls of the metal gate than the second spacer. In addition, the semiconductor device structure includes a dielectric layer formed over the substrate to surround the first spacer and the metal gate.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: August 23, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Chen-Liang Liao, Chih-Hsiao Chen, Yi-Lii Huang, Yao-Yu Li
  • Patent number: 9415238
    Abstract: The present invention provides a pharmaceutical kit, methods for cancer treatment and for preparing a metal nanoparticle-antibody fragment conjugate, which can reduce the recurrence rate of cancer and provide a safer and less invasive therapeutic method for cancer treatment.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: August 16, 2016
    Inventor: Chieh-Hsiao Chen
  • Patent number: 9409766
    Abstract: A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: August 9, 2016
    Assignee: Himax Display, Inc.
    Inventors: Tung-Feng Wu, Wei-Hsiao Chen, Chun-Hao Su, Jui-Wen Chen, Mao-Chien Cheng
  • Publication number: 20160203984
    Abstract: The semiconductor device structures and methods for forming the same are provided. The semiconductor device structure includes a metal gate over a substrate. A first spacer is formed over sidewalls of the metal gate and having a first height. A second spacer is formed over the sidewalls of the metal gate and having a second height. The first height is higher than the second height. The first spacer is farther from the sidewalls of the metal gate than the second spacer. In addition, the semiconductor device structure includes a dielectric layer formed over the substrate to surround the first spacer and the metal gate.
    Type: Application
    Filed: March 21, 2016
    Publication date: July 14, 2016
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chen-Liang LIAO, Chih-Hsiao CHEN, Yi-Lii HUANG, Yao-Yu LI
  • Publication number: 20160176094
    Abstract: A method for manufacturing a dull polyamide 56 fiber includes steps as follows. Bright polyamide 56 chips are provided. A viscosity adjusting step is provided, wherein a relative viscosity in sulfuric acid of the bright polyamide 56 chips is adjusted to a range of 2.90 to 3.00. A moisture adjusting step is provided, wherein a moisture content of the bright polyamide 56 chips is adjusted to a range of 350 to 550 ppm. A spinning step is provided, which includes providing dull polyamide 6 chips and a blending step. The dull polyamide 6 chips include TiO2. In the blending step, the dull polyamide 6 chips and the bright polyamide 56 chips dealt with the viscosity adjusting step and the moisture adjusting step are melted and blended, and then spun at a temperature ranging from 275° C. to 285° C., thus the dull polyamide 56 fiber is obtained.
    Type: Application
    Filed: August 19, 2015
    Publication date: June 23, 2016
    Inventors: Yen-Hsiao CHEN, Tsung-Hsien CHAO, Shih-Yang CHEN, I-Chen HSIEH
  • Publication number: 20160148225
    Abstract: A product sales forecasting system and a product sales forecasting method are provided herein. The product sales forecasting method includes: querying for a first relevant product corresponding to a first product in a relevant product database according to the first product, in which the relevant product database stores products and relevant products corresponding to the products respectively; searching for trading record data and comment data corresponding to the first relevant product in an e-commerce platform according to the first relevant product and a price range corresponding to the first relevant product; generating a forecasted consumer volume corresponding to the first product according to the trading record data and the comment data; and generating a forecasted sales volume corresponding to the first product according to the forecasted consumer volume.
    Type: Application
    Filed: December 3, 2014
    Publication date: May 26, 2016
    Inventors: Tsun KU, Cheng-Hung TSAI, Wen-Tai HSIEH, Ren-Dar YANG, Hsiao-Chen CHANG
  • Patent number: 9349817
    Abstract: Embodiments of the disclosure provide semiconductor device structures and methods of forming the same. The semiconductor device structure includes a metal gate over a substrate. A first spacer is formed over sidewalls of the metal gate and having a first height. A second spacer is formed over the sidewalls of the metal gate and having a second height. The first height is higher than the second height. The first spacer is farther from the sidewalls of the metal gate than the second spacer. In addition, the semiconductor device structure includes a dielectric layer formed over the substrate to surround the first spacer and the metal gate.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: May 24, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Chen-Liang Liao, Chih-Hsiao Chen, Yi-Lii Huang, Yao-Yu Li
  • Publication number: 20160142351
    Abstract: An information processing system includes a register module, a determining module, and a transfer module. The register module is configured to store event data corresponding to a specific QR code. The determining module is configured to obtain the event data, and to communicate with a mobile device, so as to determine whether application programs on the mobile device includes a first application program which is corresponding to any one of the event data. If yes, the determining module transmits launch information to make the mobile device lunch the first application program. If not, the determining module transmits install information to make the mobile device install the first application program. The transmitting module is configured to transmit a message corresponding to the first application program to the mobile device, so that the first application program launched by the mobile device displays the message.
    Type: Application
    Filed: November 27, 2014
    Publication date: May 19, 2016
    Inventors: Chien-Chung CHIU, Jing-Ming CHIU, Ren-Dar YANG, Hsiao-Chen CHANG, Yeh-Kuang WU, Wen-Tai HSIEH
  • Publication number: 20160120343
    Abstract: An anti-spray drinking bottle has a body, a lid, at least one check valve, a dividing mount and a guiding element. The body has a storage recess and a screwing section. The lid is detachably connected to the body and has a threaded segment connected to the screwing section, a buffering segment connected to the threaded segment and a buffering space formed in the buffering segment. The at least one check valve is mounted on the lid. The dividing board is connected to the lid, is mounted in the body and has a dividing board, a sidewall, an outlet pipe and an abutting segment. The guiding element is connected to the dividing mount, is mounted in the body and has an elongate straw tube connected to the outlet pipe.
    Type: Application
    Filed: November 3, 2014
    Publication date: May 5, 2016
    Inventor: Hsiao-Chen LIANG
  • Patent number: 9324864
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure includes an isolation structure positioned in the semiconductor substrate and adjacent to a first active region of the semiconductor substrate. The semiconductor device structure includes a gate stack disposed over the first active region. The semiconductor device structure includes a first contact structure disposed over the first active region and positioned between the isolation structure and the gate stack. The semiconductor device structure includes a dummy gate stack disposed over the isolation structure and adjacent to the gate stack. The dummy gate stack is not positioned over a portion of the isolation structure next to the first contact structure.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: April 26, 2016
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Yao Liang, Chen-Liang Liao, Ming Lei, Chih-Hsiao Chen, Yi-Lii Huang
  • Publication number: 20160112076
    Abstract: A signal transmitter with adjustable signal power includes a housing, a first adjustable metal shielding layer and a circuit board. The first adjustable metal shielding layer is disposed within the housing. The area of the first adjustable metal shielding layer consists of a first shielding area and a first un-shielding area. The first shielding area and the first un-shielding area are adjustable. The circuit board is disposed within the housing, and is located below the first adjustable metal shielding layer. The circuit board is electrically connected with the first adjustable metal shielding layer, and includes a signal emission chip. The signal emission chip is configured for adjusting signal emission power to emit a signal according to the first un-shielding area of the first adjustable metal shielding layer. A message generating system and a signal power adjusting method are disclosed herein as well.
    Type: Application
    Filed: November 18, 2014
    Publication date: April 21, 2016
    Inventors: Yeh-Kuang WU, Liang-Chun CHANG, Hui-Chun WANG, Wen-Tai HSIEH, Hsiao-Chen CHANG
  • Publication number: 20160088960
    Abstract: A tumbler with a bi-layer structure has a collision-resistant outer tumbler body, a glass inner container and a lid. The collision-resistant outer tumbler body is made of plastic. The glass inner container is made of glass, is mounted in the collision-resistant outer tumbler body to form a bi-layer structure, and has a container space. The lid is mounted on the collision-resistant outer tumbler body and the glass inner container and has a combining base combined with the collision-resistant outer tumbler body and the glass inner container, an opening unit mounted in the combining base and communicating with the container space, and a closing cap combined with the combining base and selectively closing the opening unit.
    Type: Application
    Filed: September 29, 2014
    Publication date: March 31, 2016
    Inventor: Hsiao-Chen LIANG
  • Publication number: 20160093736
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure includes an isolation structure positioned in the semiconductor substrate and adjacent to a first active region of the semiconductor substrate. The semiconductor device structure includes a gate stack disposed over the first active region. The semiconductor device structure includes a first contact structure disposed over the first active region and positioned between the isolation structure and the gate stack. The semiconductor device structure includes a dummy gate stack disposed over the isolation structure and adjacent to the gate stack. The dummy gate stack is not positioned over a portion of the isolation structure next to the first contact structure.
    Type: Application
    Filed: September 30, 2014
    Publication date: March 31, 2016
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Yao LIANG, Chen-Liang LIAO, Ming LEI, Chih-Hsiao CHEN, Yi-Lii HUANG