Patents by Inventor Hsien A. Chen

Hsien A. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153860
    Abstract: An electronic device is provided. The electronic device includes a redistribution structure, an electronic unit and a first conductive pad. The first conductive pad is disposed between the redistribution structure and the electronic unit. The electronic unit is electrically connected to the redistribution structure through the first conductive pad. The first conductive pad has a first coefficient of thermal expansion and a first Young's modulus. The first coefficient of thermal expansion and the first Young's modulus conform to the following formula: 0.7×(0.0069E2?1.1498E+59.661)?CTE?1.3×(0.0069E2?1.1498E+59.661), wherein CTE is the first coefficient of thermal expansion, and E is the first Young's modulus in the formula.
    Type: Application
    Filed: December 21, 2022
    Publication date: May 9, 2024
    Inventors: Te-Hsun LIN, Wen-Hsiang LIAO, Yung-Feng CHEN, Ming-Hsien SHIH
  • Publication number: 20240155798
    Abstract: A carrier for different form factors for insertion in a slot of a computing device is disclosed. The different form factors have different thicknesses defined by the E1.S specification. The carrier includes a base holding a first type of form factor. A bezel is configurable for insertion in a slot for a device of the first type of form factor. The bezel has an attachment surface. The base is attachable to the attachment surface of the bezel. A second type of form factor is also attachable to the attachment surface of the bezel. A cover encloses the first type of form factor when joined to the base. The base and cover are discarded when the second type of form factor is attached to the bezel. The attached bezel and second type of form factor may also be inserted in the slot.
    Type: Application
    Filed: December 14, 2022
    Publication date: May 9, 2024
    Inventors: Yaw-Tzorng TSORNG, Tung-Hsien WU, Yu-Ying TSENG, Wei-Jie CHEN
  • Patent number: 11978809
    Abstract: A transient voltage suppression device includes at least one P-type lightly-doped structure and at least one electrostatic discharge structure. The electrostatic discharge structure includes an N-type lightly-doped well, an N-type well, a first P-type heavily-doped area, and a first N-type heavily-doped area. The N-type lightly-doped well is formed in the P-type lightly-doped structure. The N-type well is formed in the N-type lightly-doped well. The doping concentration of the N-type lightly-doped well is less than that of the N-type well. The first P-type heavily-doped area is formed in the N-type well. The first N-type heavily-doped area is formed in the P-type lightly-doped structure.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: May 7, 2024
    Assignee: AMAZING MICROELECTRONIC CORP.
    Inventors: Chih-Wei Chen, Kuan-Yu Lin, Kun-Hsien Lin
  • Patent number: 11980040
    Abstract: A semiconductor device includes a substrate; a memory array over the substrate, the memory array including first magnetic tunnel junctions (MTJs), where the first MTJs are in a first dielectric layer over the substrate; and a resistor circuit over the substrate, the resistor circuit including second MTJs, where the second MTJs are in the first dielectric layer.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tai-Yen Peng, Tsung-Hsien Chang, Yu-Shu Chen, Chih-Yuan Ting, Jyu-Horng Shieh, Chung-Te Lin
  • Publication number: 20240145370
    Abstract: A semiconductor device includes a first region and a second region, and the second region surrounds the first region. The semiconductor device includes at least one electronic unit, a redistribution structure, a plurality of first pads, and a plurality of second pads. The redistribution structure may be electrically connected to at least one electronic unit. A plurality of first pads are arranged on the redistribution structure and correspondingly to the first region. There is a first pitch between two adjacent first pads. A plurality of second pads are arranged on the redistribution structure and correspondingly to the second region. There is a second pitch between two adjacent second pads, so that the first pitch is smaller than the second pitch.
    Type: Application
    Filed: December 18, 2022
    Publication date: May 2, 2024
    Applicant: InnoLux Corporation
    Inventors: Te-Hsun LIN, Wen-Hsiang LIAO, Ming-Hsien SHIH, Yung-Feng CHEN, Cheng-Chi WANG
  • Publication number: 20240143038
    Abstract: A portable electronic device including a casing, a heat source, a fan, a heat dissipation fin, a heat pipe and a dust collecting member is provided. The heat source, the fan, the heat dissipation fin, and the heat pipe are located inside the casing, and the heat pipe is thermally coupled between the heat source and the heat dissipation fin. The dust collecting member is detachably assembled to the casing and is inserted into the casing. The heat dissipation fin is disposed as corresponding to the fan, and the dust collecting member is located between the fan and the heat dissipation fin.
    Type: Application
    Filed: October 24, 2023
    Publication date: May 2, 2024
    Applicant: Acer Incorporated
    Inventors: Chun-Hung Wen, Chun-Hsien Chen
  • Publication number: 20240145403
    Abstract: An electronic package is provided, in which electronic elements and at least one packaging module including a semiconductor chip and a shielding structure covering the semiconductor chip are disposed on a carrier structure, an encapsulation layer encapsulates the electronic elements and the packaging module, and a shielding layer is formed on the encapsulation layer and in contact with the shielding structure. Therefore, the packaging module includes the semiconductor chip and the shielding structure and has a chip function and a shielding wall function simultaneously.
    Type: Application
    Filed: February 6, 2023
    Publication date: May 2, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chih-Chiang HE, Ko-Wei CHANG, Chia-Yang CHEN
  • Publication number: 20240141144
    Abstract: Disclosed herein is a hydrogel composition that includes a crosslinked collagen polymer, a carboxymethyl cellulose derivative, an aqueous sodium chloride solution, a humectant, and an antimicrobial agent. The crosslinked collagen polymer has collagen, a hydrophilic polyether, and a dicarbamate group linking the collagen to the hydrophilic polyether. The carboxymethyl cellulose derivative is selected from the group consisting of carboxymethyl cellulose, an alkali metal salt of carboxymethyl cellulose, an ammonium salt of carboxymethyl cellulose, and combinations thereof. The humectant is selected from the group consisting of glycerin, propylene glycol, and a combination thereof. The antimicrobial agent is a combination of glycine betaine and polyhexamethylene biguanide hydrochloride.
    Type: Application
    Filed: April 17, 2023
    Publication date: May 2, 2024
    Inventors: Szu-Hsien CHEN, Chiu-Fang CHEN, Ya-Wen KU, Ren-Shian WANG
  • Patent number: 11974367
    Abstract: A lighting device includes a light board and a light dimmer circuit. The light board includes multiple first light emitting elements and second light emitting elements. The first light emitting elements are disposed in a first area of the light board. The second light emitting elements are disposed in a second area of the light board. The light dimmer circuit is configured to drive the second light emitting elements to generate flickering lights from the second area of the light board, and is configured to drive the first light emitting elements to generate non-flickering lights from the first area of the light board.
    Type: Grant
    Filed: October 4, 2022
    Date of Patent: April 30, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chih-Hsien Wang, Ming-Chieh Cheng, Po-Yen Chen, Shih-Chieh Chang, Kuan-Hsien Tu, Xiu-Yi Lin, Ling-Chun Wang
  • Patent number: 11970569
    Abstract: Disclosed herein is a polyurethane foam sponge produced by the steps of a) providing an hydrophobic polyol which has six hydroxyl groups, b) providing a hydrophilic diisocyanate obtained by reacting a diisocyanate with a hydrophilic polyether diol, c) reacting the hydrophobic polyol with the hydrophilic diisocyanate to obtain a prepolymer which includes 3 to 6 isocyanate groups, and d) mixing the prepolymer with a hydrophilic polyether polyol, a blowing agent, an end-capping agent, a reinforcing agent, and a catalyst to obtain the polyurethane foam sponge. A wound dressing including the polyurethane foam sponge is also disclosed.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 30, 2024
    Assignee: Tronjen Medical Technology Inc.
    Inventors: Szu-Hsien Chen, Ya-Wen Ku, Ren-Shian Wang, Chiu-Fang Chen
  • Publication number: 20240134470
    Abstract: An electronic device includes a first insulating layer, a first conductive portion, a second conductive portion, a transistor, and an electronic unit. The first insulating layer has a first opening penetrating the first insulating layer along a first direction. The first conductive portion is disposed in the first opening. The second conductive portion is electrically connected to the first conductive portion. The transistor is electrically connected to the second conductive portion. The electronic unit is electrically connected to the first conductive portion. In a cross-sectional view of the electronic device, the electronic unit and the second conductive portion are disposed on two opposite sides of the first insulating layer respectively, the first conductive portion has a first length along a second direction perpendicular to the first direction, the second conductive portion has a second length along the second direction, and the first length is different from the second length.
    Type: Application
    Filed: January 4, 2024
    Publication date: April 25, 2024
    Applicant: InnoLux Corporation
    Inventors: Po-Yang Chen, Hsing-Yuan Hsu, Tzu-Min Yan, Chun-Hsien Lin, Kuei-Sheng Chang
  • Publication number: 20240133000
    Abstract: An aluminum alloy material includes 1.0 wt % to 13.0 wt % of Si, 0.2 wt % to 1.4 wt % of Fe, 0.2 wt % to 0.8 wt % of Ni, and the remainder being Al and inevitable impurities. The aluminum alloy material can be 3D printed or die-casted to form an aluminum alloy object with a high thermal conductivity.
    Type: Application
    Filed: November 15, 2022
    Publication date: April 25, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Hsien CHOU, Chi-San CHEN
  • Publication number: 20240130686
    Abstract: A coupled physiological signal measuring device is provided. The coupled physiological signal measuring device includes at least two measuring electrodes, a signal processing unit and a multiplex feedback circuit unit. The measuring electrodes are used to obtain a real-time physiological signal through measurement. The signal processing unit includes a discharge control element. If an electrostatic surge of the real-time physiological signal meets a condition, a discharge control signal is outputted. The multiplex feedback circuit unit is used to discharge the measuring electrodes according to the discharge control signal.
    Type: Application
    Filed: January 20, 2023
    Publication date: April 25, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yun-Yi HUANG, Yu-Chiao TSAI, Hung-Hsien KO, Heng-Yin CHEN
  • Publication number: 20240131010
    Abstract: In some embodiments of the present disclosure, a sustained release osmotic-controlled pharmaceutical composition is provided, including: a core and a semi-permeable membrane coated on the core. The core includes a drug compartment, in which the drug compartment includes a first active ingredient, a first polymer and a first osmogen, and the first active ingredient includes lurasidone, a pharmaceutical acceptable salt of the lurasidone or a combination thereof. The semi-permeable membrane includes a membrane body and at least one pore distributed in the membrane body.
    Type: Application
    Filed: October 15, 2023
    Publication date: April 25, 2024
    Inventors: Chun-You LIOU, Tzu-Hsien CHAN, Hua-Jing JHAN, I-Hsiang LIU, Tse-Hsien CHEN, Chi-Heng JIAN
  • Patent number: 11968908
    Abstract: In an embodiment, a method includes: forming a first inter-metal dielectric (IMD) layer over a semiconductor substrate; forming a bottom electrode layer over the first IMD layer; forming a magnetic tunnel junction (MTJ) film stack over the bottom electrode layer; forming a first top electrode layer over the MTJ film stack; forming a protective mask covering a first region of the first top electrode layer, a second region of the first top electrode layer being uncovered by the protective mask; forming a second top electrode layer over the protective mask and the first top electrode layer; and patterning the second top electrode layer, the first top electrode layer, the MTJ film stack, the bottom electrode layer, and the first IMD layer with an ion beam etching (IBE) process to form a MRAM cell, where the protective mask is etched during the IBE process.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tai-Yen Peng, Hui-Hsien Wei, Han-Ting Lin, Sin-Yi Yang, Yu-Shu Chen, An-Shen Chang, Qiang Fu, Chen-Jung Wang
  • Publication number: 20240124706
    Abstract: A liquid crystal polymer, composition, liquid crystal polymer film, laminated material and method of forming liquid crystal polymer film are provided. The liquid crystal polymer includes a first repeating unit, a second repeating unit, a third repeating unit, and a fourth repeating unit. The first repeating unit has a structure of Formula (I), the second repeating unit has a structure of Formula (II), the third repeating unit has a structure of Formula (III), and the fourth repeating unit has a structure of Formula (IV), a structure of Formula (V) or a structure of Formula (VI) wherein A1, A2, A3, Z1, R1, R2, R3 and Q are as defined in the specification.
    Type: Application
    Filed: September 22, 2023
    Publication date: April 18, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Lin CHU, Jen-Chun CHIU, Po- Hsien HO, Yu-Min HAN, Meng-Hsin CHEN, Chih-Hsiang LIN
  • Publication number: 20240126861
    Abstract: A device unlocking method and an electronic device are provided. The method includes: detecting fingerprint information of a user by a first sensor of the electronic device; authenticating the fingerprint information and temporarily storing an authentication result of the fingerprint information; after authenticating the fingerprint information, detecting operation environment information related to the electronic device by a second sensor of the electronic device; and in response to the operation environment information meeting a default condition, unlocking the electronic device according to the authentication result.
    Type: Application
    Filed: May 9, 2023
    Publication date: April 18, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chih-Hsien Yang, Hui-Fen Chen, I-Hsi Wu
  • Publication number: 20240128876
    Abstract: A switching control circuit for use in controlling a resonant flyback power converter generates a first driving signal and a second driving signal. The first driving signal is configured to turn on the first transistor to generate a first current to magnetize a transformer and charge a resonant capacitor. The transformer and charge a resonant capacitor are connected in series. The second driving signal is configured to turn on the second transistor to generate a second current to discharge the resonant capacitor. During a power-on period of the resonant flyback power converter, the second driving signal includes a plurality of short-pulses configured to turn on the second transistor for discharging the resonant capacitor. A pulse-width of the short-pulses of the second driving signal is short to an extent that the second current does not exceed a current limit threshold.
    Type: Application
    Filed: June 15, 2023
    Publication date: April 18, 2024
    Inventors: Yu-Chang Chen, Ta-Yung Yang, Kun-Yu Lin, Fu-Ciao Syu, Chia-Hsien Yang, Hsin-Yi Wu
  • Publication number: 20240128420
    Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.
    Type: Application
    Filed: December 6, 2022
    Publication date: April 18, 2024
    Applicant: AUO Corporation
    Inventors: Chia-Hui Pai, Tai-Tso Lin, Wen-Hsien Tseng, Wei-Chieh Chen, Kuan-Yi Lee, Chih-Chun Yang
  • Patent number: 11963295
    Abstract: Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Hung-Hsien Ko, Yi-Cheng Lu, Heng-Yin Chen, Hao-Wei Yu, Te-Hsun Lin