Abstract: An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing.

Abstract: The present invention provides an antenna module and an antenna thereof. The antenna includes a first radiation element, a second radiation element, a third radiation element, and a short-circuit portion. The second radiation element has one end connected with the first radiation element. The third radiation element connected with the other end of the second radiation element, and includes a first connection section, a second connection section, and a third connection section. The first connection section is perpendicular to the second radiation element. The second connection section connected with the first connection section. The third connection section is connected with the second connection section and located at an internal side of the second connection section. The short-circuit portion connected with the second connection section and located at an external side of the second connection portion.

Abstract: A method for manufacturing an LED (light emitting diode) is disclosed wherein a metal substrate is provided. A chip fastening area with a depression and two wire fixing areas on the first metal substrate are defined on the metal substrate. The chip fastening area and the wire fixing areas are separated by a plurality of first grooves. An LED chip is provided in the depression of the chip fastening area and electrically connected to the wire fixing areas by wires. An encapsulant is formed to cover and connect the chip fastening area and the wire fixing areas. Portions of the metal substrate except the chip fastening area and the wire fixing areas are removed.

Abstract: An LED lighting device includes a slave driving stage and a master driving stage. The slave driving stage includes a first luminescent device and a first current controller for providing a constant current setting in an ON phase. The master driving stage includes a second luminescent device and a current control unit having a second current controller and a current envelope controller. The second current controller provides a current envelope in the ON phase. The current envelope controller sets a level of the current envelope according to a rectified AC voltage. The driving current is regulated by the first current controller according to the constant current setting when the constant current setting is smaller than the level of the current envelope, or by the second current controller according to the current envelope when the level of the current envelope is smaller than the constant current setting.

Abstract: An exemplary light-emitting diode (LED) includes a substrate, a first electrode and a second electrode sandwiching the substrate therebetween, an LED chip electrically connected to the first electrode and the second electrode, a reflector located on the first electrode and the second electrode and surrounding the LED chip, and a first retaining wall mounted on an edge of the first electrode and a second retaining wall mounted on an edge of the second electrode. The first retaining wall and the second retaining wall are made of conductive material. The first retaining wall and the second retaining wall are at a same side of the LED. Outer surfaces of the first retaining wall and the second retaining wall are exposed out of the reflector.

Abstract: An LED lighting device includes multiple driving stages. A first driving stage includes a first luminescent device driven by a first current and a first current controller coupled in parallel with the first luminescent device. The first current controller is configured to conduct a second current according to a voltage established across the first current controller and regulate the second current so that a sum of the first current and the second current does not exceed a first value. The second driving stage includes a second luminescent device driven by a third current and a second current controller coupled in series to the second luminescent device. The second current controller is configured to conduct a fourth current according to a voltage established across the second current controller and regulate the fourth current so that a sum of the third current and the fourth current does not exceed a second value.

Abstract: A two-terminal current controller controls a first current flowing through a parallel-coupled load. During a rising period of a rectified AC voltage, when a load voltage does not exceed a first voltage, the two-terminal current controller operates in a first mode. When the load voltage exceeds the first voltage but does not exceed a second voltage, the two-terminal current controller operates in a second mode. When the load voltage exceeds the second voltage, the two-terminal current controller operates in a third mode. When the load voltage drops to a third voltage smaller than the second voltage after exceeding the second voltage, the two-terminal current controller operates in the second mode when a difference between the second and third voltages exceeds a hysteresis band and operates in the third mode when a difference between the second and third voltages does not exceed the hysteresis band.

Abstract: A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages.

Abstract: A light emitting diode (LED) package includes a substrate, a pin structure and a reflector formed on the substrate, an LED chip arranged on the pin structure and a first encapsulation layer mixed with phosphor filled in the reflector. The LED chip includes a top surface, a side surface extending downward from the top surface and a bottom surface opposite to the top surface. A bottom end of the first encapsulation layer is located above the top surface of the LED chip. A transparent second encapsulation layer is located below the first encapsulation layer and surrounds the LED die.

Abstract: A method for manufacturing an LED package structure is disclosed wherein a substrate with a first electrode, a second electrode and a connecting layer is provided. A photoresist coating is provided to cover the substrate, the first electrode, the second electrode and the connecting layer. A portion of the photoresist coating is removed to define a groove corresponding to the connecting layer. A metal layer is formed in the groove to join the connecting layer. A remaining portion of the photoresist coating is removed and a concave is formed and surrounded by the metal layer. A reflective layer is formed on an inside surface of the concave to join the metal layer to form a reflective cup. An LED die is mounted in the reflective cup and electrically connects with the first and second electrodes.

Abstract: An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber. A method for manufacturing the LED is also disclosed.

Abstract: A fluorescent layer, its preparation method and uses are provided. The fluorescent layer is provided from a fluorescent material and a calcining material. The fluorescent material is in an amount ranging from about 5 wt % to about 95 wt % based on the total weight of the fluorescent layer. The fluorescent layer of the present invention can be used in a light-emitting diode to change the color of emitting-light and improve the heat dissipation of the light-emitting diode. Furthermore, the fluorescent layer of the present invention is free of an organic resin, and thus, does not have the problem of aging (etiolation). The final product has a stable, lasting and durable luminescent quality.

Abstract: An exemplary light-emitting diode (LED) package includes a first electrode, a second electrode spaced from the first electrode, an electrically insulating substrate sandwiched by and connecting with the first electrode and the second electrode, a first LED chip and a second LED chip mounted on top surfaces of the first and second electrodes respectively, and a reflector covering the top surfaces of the first and second electrodes. The first LED chip mounted on the top surface of the first electrode is above the second LED chip mounted on the top surface of the second surface. L-shaped retaining walls are formed on the top surfaces of the first and second electrodes. By the retaining walls, the LED package can also be used as a side-view LED package.

Abstract: A light emitting diode luminance system includes a first power source, a voltage divider, a first switch, a clamping device, a plurality of current sources and a feedback circuit. The voltage divider is coupled to the first voltage source. The first switch is coupled to the voltage divider and a ground. The clamping device includes a plurality of transistors each coupled to a respective set of light emitting diodes and the voltage divider. The plurality of current sources is coupled to the plurality of transistors respectively. The feedback circuit is coupled to the plurality of transistors and the plurality sets of light emitting diodes.

Abstract: An LED lighting device includes a first luminescent device, a second luminescent device, a first current controller and a second current controller. The first current controller is coupled in parallel with the first luminescent device and configured to operate according to a first current setting, a switch-on voltage and a switch-off voltage. The second current controller is coupled in series to the second luminescent device and configured to operate according to a second current setting. The first current setting, the second current setting, the switch-on voltage and the switch-off voltage are adjusted by setting the mode selection pins of the first and second current controllers.

Abstract: A method for making an LED package includes the following steps: providing a substrate with an electrode formed thereon; forming at least one barrier portion on the electrode; forming a reflective cup on the substrate wherein the reflective cup covers the at least one barrier portion; providing an LED die in the reflective cup and electrically connecting the LED die to the electrode; and forming an encapsulation in the reflective cup, the encapsulation covering the LED die.

Abstract: The present invention provides a light source dimming control circuit, which includes a voltage signal generator for generating a first voltage signal between a predetermined voltage level and a ground level; a reference voltage signal generator for generating a reference voltage signal at an output end according to the first voltage signal and a second voltage signal; a first switch with a first end coupled to an output end of alight source; a first resistor with a first end coupled to a second end of the first switch, and a second end coupled to a ground end; a switch controller coupled to the first switch and the voltage signal generator for controlling on/off states of the first switch according to a sawtooth signal and the first voltage signal; and a current controller for controlling current flowing through the first resistor according to the reference voltage signal.

Abstract: An LED package includes a base, an LED chip, and an electrode layer. The base has thereon a first electrical connecting layer and a separated second electrical connecting layer. The LED chip is placed on the base and electrically connected with the first electrical connecting layer and the second electrical connecting layer by flip chip bonding. The electrode layer comprises a first electrode and a separated second electrode, and a receiving groove being defined between the first electrode and the second electrode. The base is received in the receiving groove of the electrode layer with the first electrical connecting layer being electrically connected to the first electrode, and the second electrical connecting layer being electrically connected to the second electrode.

Abstract: A light emitting diode luminance system includes a first power source, a voltage divider, a first switch, a clamping device, a plurality of current sources and a feedback circuit. The voltage divider is coupled to the first voltage source. The first switch is coupled to the voltage divider and a ground. The clamping device includes a plurality of transistors each coupled to a respective set of light emitting diodes and the voltage divider. The plurality of current sources is coupled to the plurality of transistors respectively. The feedback circuit is coupled to the plurality of transistors and the plurality sets of light emitting diodes.

Abstract: A bonding structure of a touch panel and a flexible circuit board includes a touch panel, a flexible circuit board and a conductive adhesive film. The touch panel includes a shielding layer and multiple transmission wires disposed on the shielding layer. The flexible circuit board is under the touch panel and includes a substrate and multiple connection wires on the substrate. Each the connection wire includes a first connection portion and a second connection portion, and the two connection portions are separated from each other by an interval and electrically insulated from each other. The conductive adhesive film is between the transmission wires of the touch panel and the connection wires of the flexible circuit board, in which the first connection portions and the second connection portions of the connection wires are electrically connected to the transmission wires via the conductive adhesive film so as to form an electric loop.