Abstract: An LED lighting device includes a first luminescent device for providing light according to a first current, a second luminescent device coupled in series to the first luminescent device for providing light according to a second current, an impedance device for limiting the second current within a predetermined range when a voltage established across the first luminescent device and the second luminescent device exceeds a first predetermined value, and a two-terminal current controller coupled in parallel with the first luminescent device and in series to the second luminescent device and configured to regulate the second current according to a voltage established across the two-terminal current controller.

Abstract: The disclosure provides a manufacturing method for an LED package. A first luminescent conversion layer comprising one first luminescent conversion element is located on an LED chip, wherein the first luminescent conversion element is precipitated via centrifugation around the LED chip without sheltering the LED chip. Thereafter, a second luminescent conversion layer is located on the first luminescent conversion layer. The second luminescent layer has a second luminescent conversion element which has an excited efficiency lower that that of the first luminescent conversion element.

Abstract: A current distributor includes a plurality of current adjustment units and a reference voltage adjustment unit. The plurality of current adjustment units is for distributing currents flowing through plural sets of light emitting diodes. The reference voltage adjustment unit is coupled to the plurality of current adjustment units for controlling the plurality of current adjustment units according to a reference voltage.

Abstract: An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber. A method for manufacturing the LED is also disclosed.

Abstract: The present invention provides a light source dimming control circuit, which includes a voltage signal generator for generating a first voltage signal between a predetermined voltage level and a ground level; a reference voltage signal generator for generating a reference voltage signal at an output end according to the first voltage signal and a second voltage signal; a first switch with a first end coupled to an output end of alight source; a first resistor with a first end coupled to a second end of the first switch, and a second end coupled to a ground end; a switch controller coupled to the first switch and the voltage signal generator for controlling on/off states of the first switch according to a sawtooth signal and the first voltage signal; and a current controller for controlling current flowing through the first resistor according to the reference voltage signal.

Abstract: A two-terminal current controller having a current limiting unit and an adjusting unit regulates a first current flowing through a load according to a load voltage. When the load voltage does not exceed a first voltage, the two-terminal current controller operates in a first mode for conducting a second current associated a rectified AC voltage, thereby limiting the first current to zero and adjusting the second current accordingly. When the load voltage is between the first voltage and a second voltage, the two-terminal current controller operates in a second mode for conducting the second current, thereby limiting the first current to zero and limiting the second current to a constant value larger than zero. When the load voltage exceeds the second voltage, the two-terminal current controller operates in a third mode for turning off the current limiting unit. The adjusting unit can adjust the predetermined value and the second voltage.

Abstract: A two-terminal current controller having a current limiting unit and an adjusting unit regulates a first current flowing through a load according to a load voltage. When the load voltage does not exceed a first voltage, the two-terminal current controller operates in a first mode for conducting a second current associated a rectified AC voltage, thereby limiting the first current to zero and adjusting the second current accordingly. When the load voltage is between the first voltage and a second voltage, the two-terminal current controller operates in a second mode for conducting the second current, thereby limiting the first current to zero and limiting the second current to a constant value larger than zero. When the load voltage exceeds the second voltage, the two-terminal current controller operates in a third mode for turning off the current limiting unit. The adjusting unit can adjust the predetermined value and the second voltage.

Abstract: An LED includes a base, a first lead and a second lead mounted to the base, a light emitting chip electrically connected to the first lead and the second lead, and an encapsulant sealing the chip. The first lead and the second lead each include a first beam and a second beam connected to each other. Each of the first beam and the second beam has two opposite ends protruding beyond two opposite lateral faces of the base, respectively, for electrically connecting with a circuit board.

Abstract: A method for manufacturing an LED (light emitting diode) is disclosed wherein a metal substrate is provided. A chip fastening area with a depression and two wire fixing areas on the first metal substrate are defined on the metal substrate. The chip fastening area and the wire fixing areas are separated by a plurality of first grooves. An LED chip is provided in the depression of the chip fastening area and electrically connected to the wire fixing areas by wires. An encapsulant is formed to cover and connect the chip fastening area and the wire fixing areas. Portions of the metal substrate except the chip fastening area and the wire fixing areas are removed.

Abstract: An exemplary light-emitting diode (LED) package includes a first electrode, a second electrode spaced from the first electrode, an electrically insulating substrate sandwiched by and connecting with the first electrode and the second electrode, a first LED chip and a second LED chip mounted on top surfaces of the first and second electrodes respectively, and a reflector covering the top surfaces of the first and second electrodes. The first LED chip mounted on the top surface of the first electrode is above the second LED chip mounted on the top surface of the second surface. L-shaped retaining walls are formed on the top surfaces of the first and second electrodes. By the retaining walls, the LED package can also be used as a side-view LED package.

Abstract: A method for making an LED package includes the following steps: providing a substrate with an electrode formed thereon; forming at least one barrier portion on the electrode; forming a reflective cup on the substrate wherein the reflective cup covers the at least one barrier portion; providing an LED die in the reflective cup and electrically connecting the LED die to the electrode; and forming an encapsulation in the reflective cup, the encapsulation covering the LED die.

Abstract: A method of packaging a light emitting diode comprising: providing a flexible substrate with a heat-conducting layer, an insulating layer covering on a surface of the heat-conducting layer and an electrically conductive layer positioned on the insulating layer; etching the conductive layer to form a gap in the conductive layer and expose a part of the insulating layer, the conductive layer being separated by the gap into a first electrode and a second electrode isolated from each other; stamping the flexible substrate with a mold at the position of the gap to form a recess in the flexible substrate; positioning a light emitting element on the conductive layer and electrically connecting the light emitting element to the conductive layer; and forming an encapsulation to cover the light emitting element.

Abstract: An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber.

Abstract: An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing.

Abstract: An LED (light emitting diode) chip includes a semiconductor. The semiconductor includes a main emitting surface on a top surface and a mounting surface on a bottom surface thereof. The LED chip further includes a P-type electrode and an N-type electrode protruding from the semiconductor, a first electrode layer extending from the P-type electrode to the mounting surface, a second electrode layer extending from the N-type electrode to the mounting surface and an insulating layer insulating the first electrode layer and the second electrode from the semiconductor. The first and second electrode layers are for surface mounting to a substrate. Each of the P-type and N-type electrodes includes a plurality of interdigital structures.

Abstract: An LED lighting device includes a first luminescent device for providing light according to a first current, a second luminescent device coupled in series to the first luminescent device for providing light according to a second current, a silicon-controlled rectifier coupled in parallel to the first luminescent device and configured to conduct a third current when a voltage established across the first luminescent device exceeds a break-over voltage, and a two-terminal current controller coupled in parallel with the first luminescent device and in series to the second luminescent device and configured to regulate the second current according to a voltage established across the two-terminal current controller.

Abstract: A method for packaging an LED, includes steps: providing a substrate; arranging an LED die on the substrate; forming a photoresist layer on the substrate to cover the LED die; arranging a mask directly on the photoresist layer; exposing the photoresist layer with the mask to a radiation source; removing the mask and the unexposed portion of the photoresist layer formerly sheltered by the mask, thereby leaving the exposed portion of the photoresist layer formerly unsheltered by the mask on the substrate, wherein the remained exposed portion of the photoresist layer surrounds the LED die; spraying fluorescent material toward the LED die surrounded by the remained exposed portion of the photoresist layer; removing the remained exposed portion of the photoresist layer; and finally encapsulating the LED die covered by the fluorescent material.

Abstract: A method for manufacturing an LED package structure is disclosed wherein a substrate with a first electrode, a second electrode and a connecting layer is provided. A photoresist coating is provided to cover the substrate, the first electrode, the second electrode and the connecting layer. A portion of the photoresist coating is removed to define a groove corresponding to the connecting layer. A metal layer is formed in the groove to join the connecting layer. A remaining portion of the photoresist coating is removed and a concave is formed and surrounded by the metal layer. A reflective layer is formed on an inside surface of the concave to join the metal layer to form a reflective cup. An LED die is mounted in the reflective cup and electrically connects with the first and second electrodes.

Abstract: An LED package includes a substrate, an LED chip mounted on the substrate. The LED chip has a side surface and an upper surface. A fluorescent layer is evenly distributed over the LED chip. An encapsulant covers the LED chip and the fluorescent layer. A method of manufacturing the LED package is also provided.

Abstract: This specification discloses a method of managing data snapshot images in a storage system. The method includes the steps of: establishing a section allocation system that includes at least a media extent; establishing a section allocation table and a block association set in the media extent, wherein the section allocation table has a field containing information pointing to the block association set and the block association set corresponds to a Source Volume as the basis for performing a snapshot backup thereof; establishing a block association table in the block association set, wherein the block association table is used to store cross-reference information in order to correspond to backup data with the original storage addresses; and copying the data before updating the data into the section association set, when the data in the Source-Volume need to be updated.