Patents by Inventor Hsin-An Chiang

Hsin-An Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE
    Publication number: 20130217159
    Abstract: A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages.
    Type: Application
    Filed: August 10, 2012
    Publication date: August 22, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HSIN-CHIANG LIN, PIN-CHUAN CHEN, LUNG-HSIN CHEN
  • LED package and method for making the same
    Patent number: 8513695
    Abstract: An LED package includes a substrate, an LED die, electrodes, a reflective cup, a barrier portion and an encapsulation. The substrate includes a first surface and a second surface opposite to the first surface. The electrodes are formed on the substrate and spaced from each other. The barrier portion is formed on the electrodes and covered by the reflective cup, wherein a bonding force between the barrier portion and the electrodes is larger than that between the reflective cup and the electrodes. The LED die is mounted on one of the electrodes, received in the reflective cup and electrically connected to the electrodes via wire bonding. The disclosure also provides a method for making an LED package.
    Type: Grant
    Filed: December 15, 2011
    Date of Patent: August 20, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hsin-Chiang Lin, Pin-Chuan Chen
  • LED and method for manufacturing the same
    Patent number: 8492180
    Abstract: An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing. A method for manufacturing the LED is also disclosed.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: July 23, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hsin-Chiang Lin, Pin-Chuan Chen
  • Clutch mechanism with overload protection
    Patent number: 8485334
    Abstract: A clutch mechanism with overload protection provided between a power input shaft and a power output shaft of an actuator includes a magnet set including at least a first magnet and a second magnet that are arranged as magnetically attractive to each other and are attached to the power input shaft and the power output shaft, respectively; and a friction assembly including a first friction member and a second friction member arranged adjacent to each other and between the first magnet and the second magnet, so as to provide a constant friction between the magnets. The magnet set and the friction assembly jointly set a limit of a torque between the power input shaft and the power output shaft. When the torque exceeds the limit, the power input shaft and the power output shaft are disconnected, so as to achieve overload protection.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: July 16, 2013
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Hsin-An Chiang, Ching-Fang Hu
  • LIGHT EMITTING DIODE DEVICE WITH MULTIPLE LIGHT EMITTING DIODES
    Publication number: 20130168709
    Abstract: A light emitting diode (LED) device includes a substrate having a top surface, a first LED and a second LED arranged on the top surface of the substrate, and a lens arranged over the light emitting surface of the first and second LEDs. The first and second LEDs each have a light emitting surface away from the top surface of the substrate. A first wavelength of light emitted from the first LED is shorter than a second wavelength of light emitted from the second LED. The lens includes a convergent part located right above the second LED and a divergent part located right above the first LED.
    Type: Application
    Filed: August 8, 2012
    Publication date: July 4, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventor: HSIN-CHIANG LIN
  • Light emitting diode package having multiple luminescent conversion layers
    Patent number: 8476664
    Abstract: A light emitting diode package comprises a light emitting diode chip, a first luminescent conversion layer and a separate second luminescent conversion layer on the first luminescent conversion layer. The first luminescent conversion layer has a first luminescent conversion element surrounding the light emitting diode chip. The second luminescent conversion layer has a second luminescent conversion element located above the light emitting diode chip. An excitation efficiency of the first luminescent conversion element is higher than that of the second luminescent conversion element.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: July 2, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hsin-Chiang Lin, Wen-Liang Tseng, Chieh-Ling Chang
  • METHOD FOR PACKAGING LIGHT EMITTING DIODE HAVING FLUORESCENT MATERIAL DIRECTLY COATED ON LED DIE THEREOF
    Publication number: 20130164868
    Abstract: A method for packaging an LED, includes steps: providing a substrate; arranging an LED die on the substrate; forming a photoresist layer on the substrate to cover the LED die; arranging a mask directly on the photoresist layer; exposing the photoresist layer with the mask to a radiation source; removing the mask and the unexposed portion of the photoresist layer formerly sheltered by the mask, thereby leaving the exposed portion of the photoresist layer formerly unsheltered by the mask on the substrate, wherein the remained exposed portion of the photoresist layer surrounds the LED die; spraying fluorescent material toward the LED die surrounded by the remained exposed portion of the photoresist layer; removing the remained exposed portion of the photoresist layer; and finally encapsulating the LED die covered by the fluorescent material.
    Type: Application
    Filed: August 30, 2012
    Publication date: June 27, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: PIN-CHUAN CHEN, HSIN-CHIANG LIN
  • LED WITH VERSATILE MOUNTING WAYS
    Publication number: 20130161681
    Abstract: An LED includes a base, a first lead and a second lead mounted to the base, a light emitting chip electrically connected to the first lead and the second lead, and an encapsulant sealing the chip. The first lead and the second lead each include a first beam and a second beam connected to each other. Each of the first beam and the second beam has two opposite ends protruding beyond two opposite lateral faces of the base, respectively, for electrically connecting with a circuit board.
    Type: Application
    Filed: August 27, 2012
    Publication date: June 27, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HSIN-CHIANG LIN, PIN-CHUAN CHEN
  • Method for manufacturing light emitting diode
    Patent number: 8455274
    Abstract: A method for manufacturing light emitting diodes includes steps: providing a substrate having an upper conductive layer and a lower conductive layer formed on a top face and bottom face thereof; dividing each of the upper conductive layer and the lower conductive layer into first areas and second areas; defining cavities in the substrate through the first areas of the upper conductive layer to expose the lower conductive layer; forming conductive posts within the substrate; forming an overlaying layer to connect the first areas of the upper and lower conductive layers; mounting chips on the overlaying layer within the cavities and electrically connecting each chip with an adjacent first area and post; forming an encapsulant on the substrate to cover the chips; and cutting the substrate into individual packages.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: June 4, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Pin-Chuan Chen, Hsin-Chiang Lin, Wen-Liang Tseng
  • Assembling mechanism of a self-locking linear actuator
    Patent number: 8448540
    Abstract: An assembling mechanism of a self-locking linear actuator includes a gearbox, a one-piece rear retainer seat and a casing. The gearbox is composed of two half pieces, which are mated with each other for accommodating and locating a transmission mechanism of the actuator. The rear retainer seat is fixedly held in the gearbox for supporting a bearing of a threaded rod of the transmission mechanism and bearing the stress from the threaded rod. The contact faces of the rear retainer seat and the gearbox are regular polygonal to facilitate adjustment of fixing angle of the rear retainer seat. The casing is composed of two half casings, which are mated with each other to accommodate the transmission mechanism, the gearbox and the rear retainer seat. The mating faces of the half casings are parallel to the axis of the output shaft of a motor to facilitate connection operation of the casing.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: May 28, 2013
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Hsin-An Chiang, Tung-Hsin Chen, Tai-Hung Lin, Shih-Yuan Tseng, Kuo-En Tseng
  • MOLD AND METHOD FOR SECTIONALLY ADJUSTING COOLING EFFICIENCY OF THE MOLD
    Publication number: 20130125603
    Abstract: The present invention provides a method for sectionally controlling a cooling efficiency of a mold. The method comprises steps of: (a) configuring at least a cooling passage including a first section having a first heat-dissipating inner surface area and a second section having a second heat-dissipating inner surface area in the mold; and (b) adjusting the first and the second heat-dissipating inner surface areas unequally by using a heat-dissipating element.
    Type: Application
    Filed: December 28, 2011
    Publication date: May 23, 2013
    Applicant: METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE
    Inventors: Wei-Liang Liu, Tzu-Hsin Chiang, Ming-Fu Lee, Wen-Yen Wang, Chinh-Yu Chuang, Yi-Chiun Chen
  • LIGHT-EMITTING DIODE AND METHOD MANUFACTURING THE SAME
    Publication number: 20130069092
    Abstract: An LED includes a base, first and second electrodes embedded in the base, and an LED chip electrically connected with the first and second electrodes. The first electrode includes a first main body portion and three first branch portions. The second electrode includes a second main body and three second branch portions. The first and second branch portions are exposed at sidewalls of the base. One of the first branch portions and one of the second branch portions are exposed at two opposite lateral sides of the base respectively, and another one of the first branch portions and another one of the second branch portions are exposed at the same lateral side of the base. This disclosure also discloses a manufacture method for making the LED.
    Type: Application
    Filed: March 8, 2012
    Publication date: March 21, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: PIN-CHUAN CHEN, HSIN-CHIANG LIN
  • METHOD FOR MANUFACTURING LED AND LED OBTAINED THEREBY
    Publication number: 20130069101
    Abstract: A method for manufacturing a light emitting diode is disclosed. Firstly, two leads each including a plateau are provided. A blocking layer is then formed on each plateau. A base is molded on the leads to embed the two leads therein, wherein the two blocking layer are exposed from the base. The blocking layers are removed from the plateaus so that the two plateaus are exposed. A light emitting chip is bonded on one plateau with a wire connecting the chip with the other plateau. Finally, an encapsulant is formed on the base to seal the chip and the wire.
    Type: Application
    Filed: August 7, 2012
    Publication date: March 21, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HSIN-CHIANG LIN, WEN-LIANG TSENG, LI-HSIANG CHEN, HSING-FEN LO
  • METHOD FOR MANUFACTURING LED WITH AN ENCAPSULANT HAVING A FLAT TOP FACE
    Publication number: 20130065332
    Abstract: A method for manufacturing LEDs is disclosed. A base is firstly provided. The base includes a plate, sidewalls formed on the plate and pairs of leads connected to the plate. The sidewalls enclose cavities above the plate. Light emitting chips are fixed in the cavities and electrically connected to the leads, respectively. Encapsulants are formed in the cavities to seal the light emitting chips. Each encapsulant has a convex top face protruding beyond top faces of the sidewalls. The convex top faces of the encapsulants are grinded to become flat. Finally, the base is cut to form individual LEDs.
    Type: Application
    Filed: August 23, 2012
    Publication date: March 14, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HSIN-CHIANG LIN, WEN-LIANG TSENG
  • METHOD FOR PACKAGING LIGHT EMITTING DIODE
    Publication number: 20130052764
    Abstract: A method of packaging a light emitting diode comprising: providing a flexible substrate with a heat-conducting layer, an insulating layer covering on a surface of the heat-conducting layer and an electrically conductive layer positioned on the insulating layer; etching the conductive layer to form a gap in the conductive layer and expose a part of the insulating layer, the conductive layer being separated by the gap into a first electrode and a second electrode isolated from each other; stamping the flexible substrate with a mold at the position of the gap to form a recess in the flexible substrate; positioning a light emitting element on the conductive layer and electrically connecting the light emitting element to the conductive layer; and forming an encapsulation to cover the light emitting element.
    Type: Application
    Filed: June 14, 2012
    Publication date: February 28, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: LI-HSIANG CHEN, HSIN-CHIANG LIN, PIN-CHUAN CHEN
  • Light emitting diode package
    Patent number: 8373189
    Abstract: An LED package includes an insulated frame, a first metallic conductor and a second metallic conductor, a chip and an encapsulation. The insulated frame has a receiving groove defined therein. The two metallic conductors are both mounted on bottom of the insulated frame and separated from each other. The chip is placed in the receiving groove and electrically connected to the two metallic conductors. The encapsulation is located in the receiving groove. The first metallic conductor and the second metallic conductor each comprise a mounting portion exposed to the receiving groove and a reflecting portion extending from the mounting portion into the insulated frame. The first reflecting portion and the second reflecting portion cooperatively surround the receiving groove of the insulated frame.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: February 12, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hsin-Chiang Lin, Pin-Chuan Chen
  • LED MODULE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20130020607
    Abstract: An LED (light emitting diode) module includes a circuit board and a plurality of LEDs mounted on the circuit board. The circuit board includes a support layer, an insulative layer and a conductive layer sequentially stacked on each other. The circuit board is embossed to form a plurality of pleats on top and bottom surfaces thereof, to thereby increase heat dissipation area of the circuit board.
    Type: Application
    Filed: December 25, 2011
    Publication date: January 24, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HSIN-CHIANG LIN, WEN-LIANG TSENG
  • LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20130015479
    Abstract: An LED package includes a base, an LED chip, and an electrode layer. The base has thereon a first electrical connecting layer and a separated second electrical connecting layer. The LED chip is placed on the base and electrically connected with the first electrical connecting layer and the second electrical connecting layer by flip chip bonding. The electrode layer comprises a first electrode and a separated second electrode, and a receiving groove being defined between the first electrode and the second electrode. The base is received in the receiving groove of the electrode layer with the first electrical connecting layer being electrically connected to the first electrode, and the second electrical connecting layer being electrically connected to the second electrode.
    Type: Application
    Filed: February 10, 2012
    Publication date: January 17, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HSIN-CHIANG LIN, PIN-CHUAN CHEN
  • FLUORESCENT LAYER AND ITS PREPARATION METHOD AND USES
    Publication number: 20130015759
    Abstract: A fluorescent layer, its preparation method and uses are provided. The fluorescent layer is provided from a fluorescent material and a calcining material. The fluorescent material is in an amount ranging from about 5 wt % to about 95 wt % based on the total weight of the fluorescent layer. The fluorescent layer of the present invention can be used in a light-emitting diode to change the color of emitting-light and improve the heat dissipation of the light-emitting diode. Furthermore, the fluorescent layer of the present invention is free of an organic resin, and thus, does not have the problem of aging (etiolation). The final product has a stable, lasting and durable luminescent quality.
    Type: Application
    Filed: June 14, 2012
    Publication date: January 17, 2013
    Inventors: Te-Hsin CHIANG, Ru-Shi LIU, Der-Shing CHIANG, Chang-Yang CHIANG
  • LED AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20130015490
    Abstract: An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing. A method for manufacturing the LED is also disclosed.
    Type: Application
    Filed: December 20, 2011
    Publication date: January 17, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HSIN-CHIANG LIN, PIN-CHUAN CHEN