Abstract: A display panel composed of red, green, blue, and white subpixels which avoids imaging artifacts is provided. The display panel defines a plurality of pixel units. Each pixel unit includes a complete red sub-pixel, a complete green sub-pixel, and a half-sized blue sub-pixel, and a half-sized white sub-pixel.

Abstract: A TFT substrate includes a substrate and a plurality of TFTs on the substrate. Each TFT includes a channel layer, a source electrode and a drain electrode on opposite sides of the channel layer. An ohmic contact layer is applied between the channel layer and the source electrode, and between the channel layer and the drain electrode. Both the channel layer and the ohmic contact layer are made of a metal oxide containing zinc. The channel layer has a zinc atomic percentage of less than 35%, and the ohmic contact layer has a zinc atomic percentage of more than 65%.

Abstract: A thin film transistor comprises a substrate, a gate electrode formed on the substrate, an electrically insulating layer covering the gate electrode, a channel layer made of a semiconductor material and formed on the electrically insulating layer, a source electrode formed on a first lateral side of the electrically insulating layer, and a drain electrode formed on an opposite second lateral side of the electrically insulating layer. The source electrode has an inner end covering a first outer end of the channel layer and electrically connecting therewith. The drain electrode has an inner end covering an opposite second outer end of the channel layer and electrically connecting therewith. An area of the channel layer adjacent to and not covered by one of the source electrode and the drain electrode has an electrical conductivity lower than the electrical conductivity of other area of the channel layer.

Abstract: A liquid crystal display device capable of being grounded to avoid afterimages includes a liquid crystal panel, a time controller, a gate driver, a data driver, a common voltage generating circuit, and a discharging circuit. The liquid crystal panel includes a plurality of pixel electrodes and a plurality of common electrodes. The pixel electrodes and common electrodes cooperate with each other to form a liquid crystal capacitor. In a power off process, the discharging circuit of the display controls the gate driver to stop generating grayscale voltages and grounds the common voltage generating circuit to discharge the liquid crystal capacitor.

Abstract: A thin film transistor can include a substrate, a gate electrode on the substrate, a first electrode located on the substrate and surrounded by the gate electrode, a second electrode located on the first electrode and surrounded by the gate electrode, and a channel layer located between the first electrode and the second electrode. The gate electrode can include a first margin metal layer on the substrate and a second metal layer located on the first margin metal layer. A method for manufacturing the thin film transistor is also provided.

Abstract: A method for manufacturing a thin film transistor (TFT) which includes a gate, a gate insulation layer, a channel layer, an etching stopping layer, a source, and a drain. The gate is formed on a substrate. The gate insulation layer covers the gate and the substrate. The channel layer is formed on the gate insulation layer to correspond with the gate. The etching stopping layer is formed on a surface of the channel layer. The channel layer and the etching stopping layer are formed in a same photo etching process.

Abstract: A thin film transistor (TFT) includes a substrate, a TFT formed on the substrate, and a passivation layer formed on the TFT. The TFT includes a gate, a source, a drain, and a channel layer. The source and the drain are respectively located at opposite sides of the channel layer. The channel layer includes oxygen ions which are implanted into the channel layer by an oxygen implanting process performed in an environment having an air pressure greater than a standard atmospheric pressure.

Abstract: A TFT substrate includes a substrate and a plurality of TFTs on the substrate. Each TFT includes a channel layer, a source electrode and a drain electrode on opposite sides of the channel layer. An ohmic contact layer is applied between the channel layer and the source electrode, and between the channel layer and the drain electrode. Both the channel layer and the ohmic contact layer are made of a metal oxide containing zinc. The channel layer has a zinc atomic percentage of less than 35%, and the ohmic contact layer has a zinc atomic percentage of more than 65%.

Abstract: A method for making an array substrate includes the following steps: forming a poly-silicon semiconductor layer on a substrate; forming a buffer layer on the substrate; depositing a first metal layer, and patterning the first metal layer to form gate electrodes for a driving TFT, a switch TFT, and a poly-silicon TFT; forming a first gate insulator layer; forming a second gate insulator layer; defining through holes passing through the buffer layer, the first gate insulator layer, and the second gate insulator layer to expose the poly-silicon semiconductor layer; depositing a metal oxide layer to form a first metal oxide semiconductor layer; and depositing a second metal layer to form source electrodes and drain electrodes for the driving TFT, the switch TFT, and the poly-silicon TFT.

Abstract: A thin film transistor can include a substrate, a gate electrode on the substrate, a first electrode located on the substrate and surrounded by the gate electrode, a second electrode located on the first electrode and surrounded by the gate electrode, and a channel layer located between the first electrode and the second electrode. The gate electrode can include a first margin metal layer on the substrate and a second metal layer located on the first margin metal layer. A method for manufacturing the thin film transistor is also provided.

Abstract: A display apparatus includes a plurality of pixel units. Each pixel unit is driven by a pixel driving circuit. The 4T-2C type pixel driving circuit is consist of the first switch, the second switch, the third switch, the transistor, the capacitor and an organic light emitting diode. In one frame, the pixel driving circuit operates sequentially a reset period, a compensation period, a first writing period, a second writing period, and an illumination period. During the reset period and the compensation period, the first switch turns on, and the transistor receives an offset electric potential from the data line. During the first writing period, the first switch turns on, and the transistor receives a signal electric potential from the data line. During the second writing period and the illumination period, the first switch turns off and electrically disconnects the connection between the transistor and the data line.

Abstract: An array substrate for a liquid crystal display device includes a first storage capacitor and a second storage capacitor for increased capacitance. The first storage capacitor is formed by a first common electrode and a pixel electrode. The second storage capacitor is formed by a second common electrode and the pixel electrode.

Abstract: A method of providing a conducting structure over a substrate, which comprises: disposing a lower sub-layer over a substrate, the lower sub-layer comprising a conductive metal oxide material that includes indium and zinc, wherein the indium and zinc content in the bottom sub-layer substantially defines a first indium to zinc content ratio; performing a first hydrogen treatment over an exposed surface of the lower sub-layer for introducing hydrogen content therein; disposing a middle sub-layer over the lower sub-layer, the middle sub-layer comprising a metal material; disposing an upper sub-layer over the middle sub-layer, the upper sub-layer comprising a conductive metal oxide material that includes indium and zinc, wherein the indium and the zinc content in the upper sub-layer substantially defines a second indium to zinc content ratio smaller than the first indium to zinc content ratio; and patterning the multi-layered conductive structure to generate a composite lateral etch profile.

Abstract: A TFT array substrate includes a plurality of scan lines, a plurality of date lines, a plurality of pixels, a first TFT, and a second TFT. The number of scan lines includes a first scan line. The date lines are insulated with the scan lines include a first date line and a second date line. The first date line is insulated and at least partly covering the second date line. The pixels are defined by two adjacent scan lines and two adjacent date lines. The first TFT is configured to drive a first pixel at the first side of the first scan line and being coupled with the first scan line and the first date line. The second TFT is configured to drive a second pixel at the second side of the first scan line and being coupled with the first scan line and the second date line.

Abstract: A semiconductor device comprises a multi-layered structure disposed over a substrate and defining a composite lateral etch profile. The multi-layered structure includes a lower sub-layer disposed over the substrate and comprising a metal oxide material that includes indium and zinc, the indium and zinc content in the bottom sub-layer substantially defining a first indium to zinc content ratio; a middle sub-layer disposed over the bottom sub-layer and comprising a metal material; an upper sub-layer disposed over the middle sub-layer and comprising a metal oxide material that includes indium and zinc, the indium to zinc content in the upper sub-layer substantially defining a second indium to zinc content ratio smaller than the first indium to zinc content ratio; and a lateral byproduct layer formed over the lateral etched surface, comprising substantially an metal oxide of the metal material in the middle sub-layer.

Abstract: An array substrate includes a substrate, driving TFTs, and switch TFTs directly on the substrate. The driving TFT includes a buffer layer, a gate, a first gate insulator layer, a second gate insulator layer, and a metal oxide semiconductor layer stacked in that order on the substrate, and a source electrode and a drain electrode coupled to the metal oxide semiconductor layer. The switch TFT includes a buffer layer, a gate, a second gate insulator layer, and a metal oxide semiconductor layer stacked in that order on the substrate, and a source electrode and a drain electrode coupled to the metal oxide semiconductor layer.

Abstract: A thin film transistor (TFT) includes a gate, a gate insulation layer, a channel, a source, and a drain. The gate is formed on a substrate. The gate insulation layer covers the gate and the substrate. The channel layer is formed on the gate insulation layer to correspond with the gate. The source and a drain are respectively coupled at opposite sides of the channel layer. The channel layer includes a conductor layer and a semiconductor layer. The semiconductor layer includes a first portion and a second portion respectively coupled at opposite sides of the conductor layer.

Abstract: A thin film transistor array panel includes a first conductive layer including a gate electrode; a channel layer disposed over the gate; and a second conductive layer disposed over the channel layer. The second conductive layer includes a multi-layered portion defining a source electrode and a drain electrode, which includes a first sub-layer, a second sub-layer, and a third sub-layer sequentially disposed one over another. Both the third and the first sub-layers include indium and zinc oxide materials. An indium to zinc content ratio in the first sub-layer is greater than that in the third sub-layer. The content ratio differentiation between the first and the third sub-layers affects a lateral etch profile associated with a gap generated in the second conductive layer between the source and the drain electrodes, where the associated gap width in the third sub-layer is wider than that that in the first sub-layer.

Abstract: A semiconductor device comprises a multi-layered structure disposed over a substrate and defining a composite lateral etch profile. The multi-layered structure includes a lower sub-layer disposed over the substrate and comprising a metal oxide material that includes indium and zinc, the indium and zinc content in the bottom sub-layer substantially defining a first indium to zinc content ratio; a middle sub-layer disposed over the bottom sub-layer and comprising a metal material; an upper sub-layer disposed over the middle sub-layer and comprising a metal oxide material that includes indium and zinc, the indium to zinc content in the upper sub-layer substantially defining a second indium to zinc content ratio smaller than the first indium to zinc content ratio; and a lateral byproduct layer formed over the lateral etched surface, comprising substantially an metal oxide of the metal material in the middle sub-layer.

Abstract: A thin film transistor array panel includes a first conductive layer including a gate electrode; a channel layer disposed over the gate; and a second conductive layer disposed over the channel layer. The second conductive layer includes a multi-layered portion defining a source electrode and a drain electrode, which includes a first sub-layer, a second sub-layer, and a third sub-layer sequentially disposed one over another. Both the third and the first sub-layers include indium and zinc oxide materials. An indium to zinc content ratio in the first sub-layer is greater than that in the third sub-layer. The content ratio differentiation between the first and the third sub-layers affects a lateral etch profile associated with a gap generated in the second conductive layer between the source and the drain electrodes, where the associated gap width in the third sub-layer is wider than that that in the first sub-layer.