Abstract: A full color organic light emitting backlight device for liquid crystal display applications defined by a first OLED panel, designed to emit light in a red bandwidth, a second OLED panel, positioned adjacent the first OLED panel and designed to emit light in a green bandwidth, and a third OLED panel, positioned adjacent the second OLED panel and designed to emit light in a blue bandwidth. The light emitting device having positioned on an uppermost surface a liquid crystal display. The device intended for incorporation into portable electronic devices. The device is fabricated to achieve a full color image using field sequential color techniques.

Abstract: An active matrix OED array includes an array area defined on a semiconductor substrate defining rows and columns of pixels and driver areas spaced from the array area with driver circuits including row drivers coupled to row buses and column drivers coupled to column buses formed in the driver areas. An active control circuit and an OED are formed in each pixel of the array area and coupled to a row and a column bus adjacent each pixel. A second substrate is formed of light transmissive material and includes externally accessible electrical connectors coupled to the driver circuits. The semiconductor substrate includes a first bump pad encircling the array area and the second substrate includes a mating second bump pad with the first and second bump pads engaged to seal the array area.

Abstract: Image scanner and display apparatus including an array of organic electroluminescent devices, each device operating as a light emitter when forward biased and as a light detector when reverse biased. Electronics coupled to the array and having a display mode and a scanner mode, the electronics sequentially forward biasing the array of organic electroluminescent devices, one row at a time, to emit light in the display mode, and sequentially forward biasing alternate columns of devices to emit light, one column at a time, and reverse biasing an associated column of devices for detecting light in the scanning mode, whereby light emitted from a forward biased column and reflected by information being scanned is received by the reverse biased associated column.

Abstract: An organic electroluminescent device with graded region is formed, which includes a hole transporting region formed of hole transporting organic material, an electron transporting region formed of electron transporting organic material, and a graduated region disseminated between the hole transporting region and the electron transporting region. The graduated region changes, either in steps or continuously, from hole transporting organic material adjacent the hole transporting region to electron transporting organic material adjacent the electron transporting region. Electrical contacts are formed in communication with the hole transporting region and the electron transporting region.

Abstract: An organic electroluminescent display device (10) includes a plurality of organic layers (16, 18, and 20) disposed between opposing electrode assemblies (12 and 14). One electrode assembly (12), the anode assembly, is fabricated of a substrate (22) and electrode (24), and a layer of a compensating material (26) disposed between electrode (24) and the overlying layers of light emitting materials (16, 18, 20). Layer (26) compensates for physical mismatches between the inorganic electrode layer (24) and the organic light emitting layers (16, 18, 20).

Abstract: An organic EL device comprises a cathode, an electron transporting layer (ETL), a hole transporting layer (HTL) and an anode which are laminated in sequence, wherein the materials making up the ETL and HTL are so selected that the energy barrier for hole injection from the HTL to the ETL is substantially higher than the energy barrier for electron injection from the ETL to the HTL. The organic EL device obtained has efficient light emission from the HTL layer when an efficient fluorescent dye as an emitter is doped in the HTL or the part of the HTL close to the ETL/HTL interface.

Abstract: An electroluminescent device is composed of a body of small molecule organic material(s) sandwiched between a first and a second electrode, wherein a layer of first insulative material is placed between the body of small molecule organic material(s) and the first electrode, and an optional layer of second insulative material is placed between the body of small molecule organic material(s) and the second electrode. The layer of first insulative material has a thickness which allows first carriers from the first electrode to tunnel therethrough and the second insulative material has a thickness which allows second carriers from the second electrode to tunnel therethrough. Further, the layer of first insulative material provides a barrier to the second carriers and the layer of second insulative material provides a barrier to the first carriers.

Abstract: A method of photoelectro-synthesizing probe arrays including the steps of providing a photoconductive layer of material having a layer of electrically conductive material on a first surface thereof and a solution of a plurality of a first oligonucleotide modified monomer positioned in electrical contact with an opposing second surface thereof such that a potential is connected therebetween. A beam of light is directed through a portion of the photoconductive layer of material to complete an electrical circuit between the layer of electrically conductive material and the solution through the portion of the photoconductive layer, whereby the monomers in the solution are electropolymerized on a surface area which is coupled into the electrical circuit by the beam of light.

Abstract: A light emitting diode display package and method of fabricating a light emitting diode (LED) display package including a light emitting diode array on a substrate, having row and column connection pads routed to display connection pads positioned on an uppermost surface of the LED array device, a separate silicon driver device having connection pads routed to an uppermost surface, positioned to cooperatively meet those of the LED device when properly registered, the LED device flip chip bump bonded to the driver device using standard C5 DCA, an underfill layer positioned between the space defined by the LED device and the driver device. The LED display and driver device package subsequently having selectively removed the substrate onto which the LED array was initially formed. The light emitted from the LED display device, being emitted through the remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer of the LED device.

Abstract: An organic light emitting device is positioned on an optically transmissive supporting substrate and includes a layer of ITO positioned on a planar surface of the substrate. A layer of hole transporting material with fluorescent dye molecules as fluorescent centers is supported on the layer of ITO, directly or with other layers, e.g. a hole injecting layer, therebetween. A layer of electron transporting material with fluorescent dye molecules as fluorescent centers is positioned on the hole transporting material and a layer of low work function metal is positioned on the layer of electron transporting material.

Abstract: A matrix of light emitting devices including a voltage source constructed to repetitiously supply a multi-step voltage waveform and a matrix of rows and columns of pixels, each pixel being connected to the voltage source. A method of driving the matrix including addressing each of the pixels of the matrix by supplying scan and image data activating signals to each of the pixels, the image data activating signal being used to activate a pixel by completing a current path from the pixel to a return for the voltage source, and activating the voltage source to repetitiously supply multi-step waveforms of voltage and sequentially supply each step of each of the multi-step voltage waveforms to the pixels, and addressing each of the pixels in the matrix for each step supplied.

Abstract: An integrated electro-optical package including a plurality of organic light emitting devices (LEDs) directly interconnected to external driver circuits utilizing a printed circuit board, having formed therein a plurality of plated through-hole vias and a method of fabricating the integrated electro-optical package. The organic LEDs are fabricated on a supporting substrate and include vertical interconnections to driver and control circuits mounted on an uppermost surface of a printed circuit board (PCB). The vertical interconnections are formed utilizing plated through-hole conductive vias formed in the printed circuit board, conductive leads, and conductive epoxy. A hermetic seal is formed by positioning a sealing ring formed on the printed circuit board in sealing contact with a sealing area on the surface of the substrate so as to hermetically seal the organic light emitting devices.

Abstract: An integrated electro-optical package including a plurality of organic light emitting devices (LEDs) directly interconnected to external driver circuits utilizing a printed circuit board, having formed therein a plurality of plated through-hole vias and a method of fabricating the integrated electro-optical package. The organic LEDs are fabricated on a supporting substrate and include vertical interconnections to driver and control circuits mounted on an uppermost surface of a printed circuit board (PCB). The vertical interconnections are formed utilizing plated through-hole conductive vias formed in the printed circuit board, conductive leads, and conductive epoxy. A hermetic seal is formed by positioning a sealing ring formed on the printed circuit board in sealing contact with a sealing area on the surface of the substrate so as to hermetically seal the organic light emitting devices.

Abstract: A hard plastic card display device including a hard plastic card having a major surface and a driver circuit. A display, including a plurality of inverted organic light emitting diodes, is formed on the major surface and coupled to the driver circuit.

Abstract: An organic EL device comprises a cathode, an electron transporting layer (ETL), a hole transporting layer (HTL) and an anode which are laminated in sequence, wherein the materials making up the ETL and HTL are so selected that the energy barrier for hole injection from the HTL to the ETL is substantially higher than the energy barrier for electron injection from the ETL to the HTL. The organic EL device obtained has efficient light emission from the HTL layer when an efficient fluorescent dye as an emitter is doped in the HTL or the part of the HTL close to the ETL/HTL interface.

Abstract: Items of material are patterned on a substrate by forming a layer of photoresist on the substrate and a layer of metal on the photoresist. The photoresist is patterned to define an opening exposing a portion of the substrate and the metal is patterned to define an aperture smaller than the opening so as to divide the exposed surface of the substrate into shadow areas and a non-shadow area. A first material system is evaporated generally perpendicular to the aperture to form a first organic light emitting diode on the surface of the substrate in the non-shadow area and second and third material systems are evaporated at angles to the aperture to form second and third organic light emitting diodes in the shadow areas. Passivation material is evaporated perpendicularly onto the first diode and at the angle onto the second diode.

Abstract: A short wavelength VCSEL including a mirror stack positioned on a substrate, formed of a plurality of pairs of relatively high and low index of refraction layers a second mirror stack formed of a plurality of pairs of relatively high and low index of refraction layers, an active region sandwiched between the first stack and the second stack, the active region being formed of quantum well layers of GaAsP having barrier layers of GaInP sandwiched therebetween, the quantum well and barrier layers having substantially equal and opposite lattice mismatch.

Abstract: A light emitting diode display package and method of fabricating a light emitting diode (LED) display package including a light emitting diode array on a substrate, having row and column connection pads routed to display connection pads positioned on an uppermost surface of the LED array device, a separate silicon driver device having connection pads routed to an uppermost surface, positioned to cooperatively meet those of the LED device when properly registered, the LED device flip chip bump bonded to the driver device using standard C5 DCA, an underfill layer positioned between the space defined by the LED device and the driver device. The LED display and driver device package subsequently having selectively removed the substrate onto which the LED array was initially formed. The light emitted from the LED display device, being emitted through the remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer of the LED device.

Abstract: Patterned-mirrors for VCSELs are fabricated by forming a first mirror stack of a plurality of pairs of relatively high and low index of refraction layers, forming an active region of aluminum-free material on the first mirror stack, and forming a second mirror stack of a plurality of pairs of relatively high and low index of refraction layers. The second mirror stack includes first and second portions of materials selected to provide different rates of etching between the first and second portions. The second portion is selectively etched to the first portion by utilizing the first portion as an etch stop.

Abstract: A method for controlling carbon doping levels in a Distributed Bragg Reflectors (DBRs) for a Vertical Cavity Surface Emitting Laser (VCSELs) devices is provided. A first stack of mirrors (105) is deposited on the surface (101) of the substrate (102). A first cladding region (106) is deposited on the first stack of mirrors (105). An active layer (108) is deposited on the first cladding layer (106). A second cladding layer (109) is deposited on the active layer (108). A second stack of mirrors (111) is deposited on the second cladding layer (109) having a carbon doping level controlled by ratio of Group V containing organometallic (tertiarybutylarsine) to Group III organometallics (trimethylgallium and trimethylaluminum).