Abstract: A circuit device is provided. The circuit device comprises a transparent substrate, a first transparent blocking layer, a first patterned conductive layer, and a second conductive layer. The transparent substrate has a first surface. The first transparent blocking layer is disposed on the first surface. The first patterned conductive layer is disposed on the first transparent blocking layer, and the second conductive layer is disposed on a side of the transparent substrate opposite to the first surface.

Abstract: An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.

Abstract: A broadband connection structure is disclosed. The broadband connection structure includes a carrier and a chip. The carrier includes a first resonator. The chip includes a second resonator and configured on the carrier using a flip-chip method. The first resonator is connected to the second resonator via a magnetic field and an electric field existing therebetween to transmit a broadband signal between the carrier and the chip. A broadband connection method is also disclosed.

Abstract: A heating apparatus for a nozzle of an injection machine includes a helical-spring shaped heating portion, a first sleeve, and a second sleeve. The first sleeve includes a first blocking portion and forms internal threads. The second sleeve includes a second blocking portion and forms external threads. The heating portion is received in the second sleeve. The internal threads are screwed into the external threads. The first blocking portion and the second blocking portion sandwich the heating portion.

Abstract: The present disclosure discloses a device for, and a method of, detecting a signal delay. The method of detecting a signal delay includes inputting a first signal and a second signal to a logic circuit to obtain an output signal; measuring an average voltage of the output signal; and determining a delay time of the second signal relative to the first signal based on a difference between the average voltage of the output signal and a reference voltage. The device for detecting a signal delay includes a clock output of a clock generator connected to a first logic input of a logic circuit and to a connection area for receiving a circuit to be tested. A second logic input of the logic circuit is also connected to the connection area. The voltage measurement device is connected to a logic output of the logic circuit.

Abstract: Disclosed are an electronic device and a waterproof touch module of the electronic device. The electronic device includes a casing and the waterproof touch module, and an installing portion is formed on a surface of the casing. The waterproof touch module includes a touch unit, an adhesive and a waterproof plate, and the touch unit is installed at the installing portion, and the waterproof plate is attached onto a surface of the casing through the adhesive and covered onto the touch unit, so that the touch unit is sealed in the installing portion to achieve a good waterproof effect.

Abstract: A touch panel including a flexible substrate, first and second electrode patterns and a trace structure is mounted inside a casing unit with a main casing and a side frame connected to a periphery of the main casing and provided with a key icon. The substrate is disposed in the casing unit and includes first and second areas respectively corresponding to the main casing and side frame. The first electrode pattern is formed on the substrate at the first area. The second electrode pattern is formed on the substrate at the second area corresponding to the key icon. The trace structure is formed on the substrate with contacts and traces connected among the first electrode pattern, the second electrode pattern and the contacts.