Abstract: Disclosed are an electronic device and a waterproof touch module of the electronic device. The electronic device includes a casing and the waterproof touch module, and an installing portion is formed on a surface of the casing. The waterproof touch module includes a touch unit, an adhesive and a waterproof plate, and the touch unit is installed at the installing portion, and the waterproof plate is attached onto a surface of the casing through the adhesive and covered onto the touch unit, so that the touch unit is sealed in the installing portion to achieve a good waterproof effect.

Abstract: A circuit device is provided. The circuit device comprises a transparent substrate, a first transparent blocking layer, a first patterned conductive layer, and a second conductive layer. The transparent substrate has a first surface. The first transparent blocking layer is disposed on the first surface. The first patterned conductive layer is disposed on the first transparent blocking layer, and the second conductive layer is disposed on a side of the transparent substrate opposite to the first surface.

Abstract: A touch panel comprises a sensing area, a periphery area, a plurality of wires and a plurality of bonding pads. The periphery area is disposed around the sensing area. The periphery area comprises a bonding area. The wires are disposed in the periphery area. The bonding pads are disposed in the bonding area and electrical connected to the wires correspondingly. Each of the bonding pads comprises at least a bending portion.

Abstract: A broadband connection structure is disclosed. The broadband connection structure includes a carrier and a chip. The carrier includes a first resonator. The chip includes a second resonator and configured on the carrier using a flip-chip method. The first resonator is connected to the second resonator via a magnetic field and an electric field existing therebetween to transmit a broadband signal between the carrier and the chip. A broadband connection method is also disclosed.

Abstract: An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.

Abstract: A heating apparatus for a nozzle of an injection machine includes a helical-spring shaped heating portion, a first sleeve, and a second sleeve. The first sleeve includes a first blocking portion and forms internal threads. The second sleeve includes a second blocking portion and forms external threads. The heating portion is received in the second sleeve. The internal threads are screwed into the external threads. The first blocking portion and the second blocking portion sandwich the heating portion.

Abstract: An injection mold includes a first plate, a second plate, a movable plate, a ball screw, a ball nut, an injection screw, a transmission shaft, an injection motor, a metering motor, a first driving assembly and a second driving assembly. The ball screw is rotatably supported by the first plate. The ball nut is fixed to the movable plate, and is threadedly engaged with the ball screw. The injection screw is coaxially positioned with the ball screw. The transmission shaft is rotatably supported by the second plate. The injection motor is fixedly mounted on the first plate. The metering motor is fixed mounted on the second plate. The first driving assembly is connected to the injection motor to drive the ball screw. The second driving assembly is connected to the metering motor to rotate the transmission shaft for moving the injection screw.

Abstract: This disclosure provides a LC panel and a LCD apparatus using the LC panel. The LC panel includes: a first substrate and a second substrate opposing the first substrate, arranging the first substrate to face the second substrate; a LC layer containing a plurality of LC molecules between the first substrate and second substrate; and a plurality of vertical alignment molecules, each comprising a long-chain alignment terminal, a cross-linking terminal, and at least one bonding terminal; wherein the at least one bonding terminal couples the vertical alignment molecule to the first or second substrate to form a surface bonding, the long-chain alignment terminals are parallel to each other and perpendicular to the first or second substrate, the cross-linking terminals link the neighboring vertical alignment molecules together, and the LC molecules are vertically aligned between the first substrate and second substrate by means of the long-chain alignment terminals.

Abstract: A liquid crystal display (LCD) panel includes a first substrate, a second substrate, and a liquid crystal layer. The first substrate includes a first alignment layer. The second substrate is disposed opposite to the first substrate, and includes a second alignment layer. The liquid crystal layer is disposed between the first and second substrates, and the first alignment layer and the second alignment layer contact the liquid crystal layer. The first alignment layer and the second alignment layer are defined as first-type alignment layers, and either the first substrate or the second substrates has a second-type alignment layer.

Abstract: A conformal shielding module comprising a substrate, at least one electronic component mounted on the substrate, and a molding compound covering the electronic component. The molding compound includes a vertical channel extending from a surface of the molding component to the electronic component, and an electrically conductive structure formed inside the vertical channel. The electrically conductive structure is electrically connected to the electronic component and includes a testing contact on the surface of the molding compound for in-circuit test of the electronic component.

Abstract: A ladder tape includes two pairs of warp strings, and two weft strings repeatedly passing through the warp strings in a predetermined way to form two cords and a plurality of bridge sections between the cords. The weft strings respectively are wound around one section of each pair of the warp strings only to form an opening between the warp strings that the ladder tape may engage with the rotary drum of the window blind in a fast and easy way. The weft strings are wound around the warp strings in a way that the ladder tape will not get entangled with other objects unexpectedly.

Abstract: A ladder tape includes two pairs of warp strings, and two weft strings repeatedly passing through the warp strings in a predetermined way to form two cords and a plurality of bridge sections between the cords. The weft strings respectively are wound around one section of each pair of the warp strings only to form an opening between the warp strings that the ladder tape may engage with the rotary drum of the window blind in a fast and easy way. The weft strings are wound around the warp strings in a way that the ladder tape will not get entangled with other objects unexpectedly.

Abstract: An injection mold includes a first plate, a second plate, a movable plate, a ball screw, a ball nut, an injection screw, a transmission shaft, an injection motor, a metering motor, a first driving assembly and a second driving assembly. The ball screw is rotatably supported by the first plate. The ball nut is fixed to the movable plate, and is threadedly engaged with the ball screw. The injection screw is coaxially positioned with the ball screw. The transmission shaft is rotatably supported by the second plate. The injection motor is fixedly mounted on the first plate. The metering motor is fixed mounted on the second plate. The first driving assembly is connected to the injection motor to drive the ball screw. The second driving assembly is connected to the metering motor to rotate the transmission shaft for moving the injection screw.