Patents by Inventor Hsing Li

Hsing Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8144479
    Abstract: A wireless communication module includes: amounting board including a dielectric frame and a dielectric panel that are stacked together, the frame defining a frame space; at least one electronic component mounted on the mounting board and extending into the frame space; and a plurality of conductive bodies embedded in the dielectric frame and surrounding the frame space so as to prevent electromagnetic interference resulting from the electronic component.
    Type: Grant
    Filed: December 24, 2007
    Date of Patent: March 27, 2012
    Assignee: Universal Scientific Industrial Co., Ltd.
    Inventors: Kuo-Hsien Liao, Kuan-Hsing Li
  • Patent number: 8059416
    Abstract: An electromagnetic shielding device includes a metal frame mounted on a circuit board and having a looped surrounding wall configured with an inner space divided into first and second space portions by a partition wall unit. A cover is mounted fittingly into the inner space in the metal frame, and includes a dielectric cover body, and a conductive material layer attached to an outer surface of the cover body. The cover body has a looped surrounding wall extending downwardly from a periphery of a top wall and disposed in proximity to the looped surrounding wall of the metal frame such that the conductive material layer is in electrical contact with the looped surrounding wall of the metal frame. The cover cooperates with the metal frame to define first and second cavities having different depths and corresponding respectively to the first and second space portions.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: November 15, 2011
    Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd.
    Inventors: Kuan-Hsing Li, Chih-Hsien Chiu
  • Patent number: 7787250
    Abstract: A metallic cover of a miniaturization module includes a substrate, a SMD chip unit and a metallic cover, the metallic cover embracing the SMD chip unit and having at least one sizing hole and a plurality of venting holes, the venting holes being disposed around the sizing hole, and the sizing hole and the venting holes being positioned above the SMD chip unit so that glue portions fill up slits between the metallic cover and the SMD chip unit. The venting holes stop the glue portion from running over the second chip unit. The glue-filled slits between the top lid and the SMD chip unit provides a strong support to prevent any deformation of the metallic cover when the metallic cover is tested and processed.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: August 31, 2010
    Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd.
    Inventors: Kuan-Hsing Li, Kuo-Hsien Liao
  • Publication number: 20090284266
    Abstract: A test method for Land Grid Array components includes the steps of: providing a test board with a plurality of test points; providing a secondary test board which has a plurality of conductors extending therethrough from a top surface to a bottom surface and forms a drop thereon, placing the secondary test board on the test board and contacting the conductors with the test points correspondingly; disposing a conducting spacer on the secondary test board, which is contacted with the conductors of the secondary test board correspondingly; and placing a test object on the conducting spacer, which has a plurality of conducting terminals contacted with the conducting spacer, and pressing the test object downwards so that the conducting terminals, the conducting spacer, the conductors and the test points are electrically connected for testing the test object. A test device for Land Grid Array components also is provided.
    Type: Application
    Filed: May 16, 2008
    Publication date: November 19, 2009
    Inventor: Kuan-Hsing Li
  • Publication number: 20090244876
    Abstract: An electromagnetic shielding device includes a metal frame mounted on a circuit board and having a looped surrounding wall configured with an inner space divided into first and second space portions by a partition wall unit. A cover is mounted fittingly into the inner space in the metal frame, and includes a dielectric cover body, and a conductive material layer attached to an outer surface of the cover body. The cover body has a looped surrounding wall extending downwardly from a periphery of a top wall and disposed in proximity to the looped surrounding wall of the metal frame such that the conductive material layer is in electrical contact with the looped surrounding wall of the metal frame. The cover cooperates with the metal frame to define first and second cavities having different depths and corresponding respectively to the first and second space portions.
    Type: Application
    Filed: March 31, 2008
    Publication date: October 1, 2009
    Applicant: Universal Scientific Industrial Co.Ltd.
    Inventors: Kuan-Hsing Li, Chih-Hsien Chiu
  • Publication number: 20090231825
    Abstract: An electromagnetic shielding device includes a base board mounted with an electronic component on a top surface thereof and having a looped surrounding surface interconnecting the top surface and a bottom surface. The surrounding surface has an inclined upper surface portion extending outwardly and downwardly from a periphery of the top surface and attached with a looped solder pad. A metal cover is mounted on the base board, and has a looped surrounding wall extending downwardly from a periphery of a top wall. The surrounding wall has a bottom end connected electrically and fixedly to the solder pad such that the metal cover cooperates with the base board to define an inner receiving space therebetween for receiving the electronic component.
    Type: Application
    Filed: March 14, 2008
    Publication date: September 17, 2009
    Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD.
    Inventors: Kuan-Hsing LI, Chih-Hsien CHIU
  • Publication number: 20090166830
    Abstract: A metallic cover of a miniaturization module includes a substrate, a SMD chip unit and a metallic cover, the metallic cover embracing the SMD chip unit and having at least one sizing hole and a plurality of venting holes, the venting holes being disposed around the sizing hole, and the sizing hole and the venting holes being positioned above the SMD chip unit so that glue portions fill up slits between the metallic cover and the SMD chip unit. The venting holes stop the glue portion from running over the second chip unit. The glue-filled slits between the top lid and the SMD chip unit provides a strong support to prevent any deformation of the metallic cover when the metallic cover is tested and processed.
    Type: Application
    Filed: December 28, 2007
    Publication date: July 2, 2009
    Inventors: Kuan-Hsing Li, Kuo-Hsien Liao
  • Patent number: 7554189
    Abstract: A wireless communication module includes: a module board including a module substrate having opposite first and second surfaces, conductive pads formed on the first surface, and an electronic component mounted to the second surface; a carrier stacked to the module board and having opposite first and second surfaces and a peripheral end that has a peripheral end face extending between the first and second surfaces of the carrier and formed with multiple spaced apart grooves; multiple spaced apart first conductive contacts formed on the first surface of the module substrate, and contacting a respective one of the module contacts; multiple spaced apart second conductive contacts formed on the second surface of the module substrate; and multiple conductive leads that interconnect the first and second conductive contacts.
    Type: Grant
    Filed: March 3, 2008
    Date of Patent: June 30, 2009
    Assignee: Universal Scientific Industrial Co., Ltd.
    Inventors: Kuan-Hsing Li, Chia-Yang Chen
  • Patent number: D627775
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: November 23, 2010
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D628196
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: November 30, 2010
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D628197
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: November 30, 2010
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D635132
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: March 29, 2011
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D635133
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: March 29, 2011
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D635134
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: March 29, 2011
    Assignee: Getac Technology Corporation
    Inventors: Chun-Hsing Li, Kuanpang Chen
  • Patent number: D635135
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: March 29, 2011
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D635564
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: April 5, 2011
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D635565
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: April 5, 2011
    Assignee: Getac Technology Corporation
    Inventors: Chun-Hsing Li, Kuanpang Chen
  • Patent number: D670693
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: November 13, 2012
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D670694
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: November 13, 2012
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D670695
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: November 13, 2012
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li