Abstract: A wireless communication module includes: amounting board including a dielectric frame and a dielectric panel that are stacked together, the frame defining a frame space; at least one electronic component mounted on the mounting board and extending into the frame space; and a plurality of conductive bodies embedded in the dielectric frame and surrounding the frame space so as to prevent electromagnetic interference resulting from the electronic component.

Abstract: An electromagnetic shielding device includes a metal frame mounted on a circuit board and having a looped surrounding wall configured with an inner space divided into first and second space portions by a partition wall unit. A cover is mounted fittingly into the inner space in the metal frame, and includes a dielectric cover body, and a conductive material layer attached to an outer surface of the cover body. The cover body has a looped surrounding wall extending downwardly from a periphery of a top wall and disposed in proximity to the looped surrounding wall of the metal frame such that the conductive material layer is in electrical contact with the looped surrounding wall of the metal frame. The cover cooperates with the metal frame to define first and second cavities having different depths and corresponding respectively to the first and second space portions.

Abstract: A metallic cover of a miniaturization module includes a substrate, a SMD chip unit and a metallic cover, the metallic cover embracing the SMD chip unit and having at least one sizing hole and a plurality of venting holes, the venting holes being disposed around the sizing hole, and the sizing hole and the venting holes being positioned above the SMD chip unit so that glue portions fill up slits between the metallic cover and the SMD chip unit. The venting holes stop the glue portion from running over the second chip unit. The glue-filled slits between the top lid and the SMD chip unit provides a strong support to prevent any deformation of the metallic cover when the metallic cover is tested and processed.

Abstract: A test method for Land Grid Array components includes the steps of: providing a test board with a plurality of test points; providing a secondary test board which has a plurality of conductors extending therethrough from a top surface to a bottom surface and forms a drop thereon, placing the secondary test board on the test board and contacting the conductors with the test points correspondingly; disposing a conducting spacer on the secondary test board, which is contacted with the conductors of the secondary test board correspondingly; and placing a test object on the conducting spacer, which has a plurality of conducting terminals contacted with the conducting spacer, and pressing the test object downwards so that the conducting terminals, the conducting spacer, the conductors and the test points are electrically connected for testing the test object. A test device for Land Grid Array components also is provided.

Abstract: An electromagnetic shielding device includes a metal frame mounted on a circuit board and having a looped surrounding wall configured with an inner space divided into first and second space portions by a partition wall unit. A cover is mounted fittingly into the inner space in the metal frame, and includes a dielectric cover body, and a conductive material layer attached to an outer surface of the cover body. The cover body has a looped surrounding wall extending downwardly from a periphery of a top wall and disposed in proximity to the looped surrounding wall of the metal frame such that the conductive material layer is in electrical contact with the looped surrounding wall of the metal frame. The cover cooperates with the metal frame to define first and second cavities having different depths and corresponding respectively to the first and second space portions.

Abstract: An electromagnetic shielding device includes a base board mounted with an electronic component on a top surface thereof and having a looped surrounding surface interconnecting the top surface and a bottom surface. The surrounding surface has an inclined upper surface portion extending outwardly and downwardly from a periphery of the top surface and attached with a looped solder pad. A metal cover is mounted on the base board, and has a looped surrounding wall extending downwardly from a periphery of a top wall. The surrounding wall has a bottom end connected electrically and fixedly to the solder pad such that the metal cover cooperates with the base board to define an inner receiving space therebetween for receiving the electronic component.

Abstract: A metallic cover of a miniaturization module includes a substrate, a SMD chip unit and a metallic cover, the metallic cover embracing the SMD chip unit and having at least one sizing hole and a plurality of venting holes, the venting holes being disposed around the sizing hole, and the sizing hole and the venting holes being positioned above the SMD chip unit so that glue portions fill up slits between the metallic cover and the SMD chip unit. The venting holes stop the glue portion from running over the second chip unit. The glue-filled slits between the top lid and the SMD chip unit provides a strong support to prevent any deformation of the metallic cover when the metallic cover is tested and processed.

Abstract: A wireless communication module includes: a module board including a module substrate having opposite first and second surfaces, conductive pads formed on the first surface, and an electronic component mounted to the second surface; a carrier stacked to the module board and having opposite first and second surfaces and a peripheral end that has a peripheral end face extending between the first and second surfaces of the carrier and formed with multiple spaced apart grooves; multiple spaced apart first conductive contacts formed on the first surface of the module substrate, and contacting a respective one of the module contacts; multiple spaced apart second conductive contacts formed on the second surface of the module substrate; and multiple conductive leads that interconnect the first and second conductive contacts.