Patents by Inventor Hsiu-Wei Yang
Hsiu-Wei Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961919Abstract: A method of forming a semiconductor device includes: forming a fin protruding above a substrate, where a top portion of the fin comprises a layer stack that includes alternating layers of a first semiconductor material and a second semiconductor material; forming a dummy gate structure over the fin; forming openings in the fin on opposing sides of the dummy gate structure; forming source/drain regions in the openings; removing the dummy gate structure to expose the first semiconductor material and the second semiconductor material under the dummy gate structure; performing a first etching process to selectively remove the exposed first semiconductor material, where after the first etching process, the exposed second semiconductor material form nanostructures, where each of the nanostructures has a first shape; and after the first etching process, performing a second etching process to reshape each of the nanostructures into a second shape different from the first shape.Type: GrantFiled: March 21, 2022Date of Patent: April 16, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Chung Chang, Hsiu-Hao Tsao, Ming-Jhe Sie, Shun-Hui Yang, Chen-Huang Huang, An Chyi Wei, Ryan Chia-Jen Chen
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Patent number: 11765861Abstract: A vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed to each other to define a chamber therebetween; and the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected to each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate also via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome.Type: GrantFiled: May 5, 2019Date of Patent: September 19, 2023Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventor: Hsiu-Wei Yang
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Patent number: 10788869Abstract: A heat-conducting case unit for handheld electronic device includes a ceramic back cover having an outer surface and an inner surface. The inner surface faces a receiving space of the handheld electronic device and has a heat conducting element provided thereon to contact with at least one heat source in the receiving space, and the heat conducting element has a thermal conductivity higher than that of the ceramic back cover. The outer surface is exposed to an external environment. Heat produced by the heat source is transferred via the heat conducting element to the ceramic back cover, from where the produced heat is dissipated into the external environment.Type: GrantFiled: July 11, 2018Date of Patent: September 29, 2020Assignee: Asia Vital Components Co., ltd.Inventor: Hsiu-Wei Yang
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Patent number: 10785894Abstract: A case heat dissipation unit of handheld electronic device includes a back cover including a ceramic layer. A titanium metal layer or a stainless steel metal layer is disposed on the ceramic layer in a position corresponding to at least one heat source. The ceramic layer is an outer surface of the handheld electronic device and exposed to an external environment. The titanium metal layer or the stainless steel metal layer faces a receiving space of the handheld electronic device in contact with the heat source in the receiving space. The titanium metal layer or the stainless steel metal layer serves to absorb the heat generated by the heat source and transfer the heat to the ceramic layer for dissipating the heat.Type: GrantFiled: July 11, 2018Date of Patent: September 22, 2020Assignee: Asia Vital Components Co., Ltd.Inventor: Hsiu-Wei Yang
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Patent number: 10602642Abstract: A back cover unit applied to portable device and having heat conduction function includes a ceramic back cover having an outer surface and an inner surface. The outer surface faces an external environment, while the inner surface faces a receiving space of a portable electronic device. A heat contact section is disposed on the inner surface in a position corresponding to at least one heat source disposed in the receiving space. The heat contact section has a contact face in contact with the heat source, whereby the heat generated by the heat source can be transferred through the heat contact section to the ceramic back cover to dissipate the heat.Type: GrantFiled: July 11, 2018Date of Patent: March 24, 2020Assignee: Asia Vital Components Co., Ltd.Inventor: Hsiu-Wei Yang
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Patent number: 10502496Abstract: A micro vapor chamber includes: a first plate body having a first side and a second side, the second side having at least one condensation section; a second plate body having a third side and a fourth side, the third side being provided with at least one evaporation section and multiple flow collection sections, the third side being correspondingly mated with the second side of the first plate body, the fourth side contacting with at least one heat source; and a mesh structure body disposed between the first plate body and the second plate body. The mesh structure body is a capillary structure having multiple meshes and a first face and a second face. The first and second faces of the mesh structure body are mated with the condensation section and the evaporation section and the flow collection sections respectively to together define multiple flow ways.Type: GrantFiled: July 6, 2010Date of Patent: December 10, 2019Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.Inventor: Hsiu-Wei Yang
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Publication number: 20190271510Abstract: A vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed to each other to define a chamber therebetween; and the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected to each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate also via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome. A manufacturing method of the above-described vapor chamber is also disclosed.Type: ApplicationFiled: May 5, 2019Publication date: September 5, 2019Inventor: Hsiu-Wei Yang
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Publication number: 20190261537Abstract: A vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed to each other to define a chamber therebetween; and the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected to each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate also via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome.Type: ApplicationFiled: May 5, 2019Publication date: August 22, 2019Inventor: Hsiu-Wei Yang
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Patent number: 10352625Abstract: A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.Type: GrantFiled: April 10, 2014Date of Patent: July 16, 2019Assignee: Asia Vital Components Co., Ltd.Inventor: Hsiu-Wei Yang
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Patent number: 10307874Abstract: The present invention relates to a method for sealing a heat transfer unit, which includes the steps of providing a heat transfer unit having at least one opening, welding the opening to form a welding section and close the opening, and pinching off the welding section and cutting part of the welding section to form a cutting end and complete sealing the opening of the heat transfer unit. By means of the method of the present invention, an extremely short dead zone can be obtained and high heat conduction efficiency is enhanced, further having the effects of reducing the arrangement space and shrinking steps of the heat pipe.Type: GrantFiled: January 6, 2015Date of Patent: June 4, 2019Assignee: Asia Vital Components Co., Ltd.Inventor: Hsiu-Wei Yang
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Publication number: 20180376620Abstract: A back cover unit applied to handheld electronic device with heat conduction and heat dissipation effect includes a ceramic back cover having an outer surface and an inner surface. The inner surface faces a receiving space of a handheld electronic device. A cooling chip is disposed on the inner surface in contact with at least one heat source in the receiving space. The outer surface of the ceramic back cover faces an external environment, whereby the heat generated by the heat source can be transferred through the cooling chip to the ceramic back cover to dissipate the heat.Type: ApplicationFiled: August 8, 2018Publication date: December 27, 2018Inventor: Hsiu-Wei Yang
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Publication number: 20180376619Abstract: A case heat dissipation unit of handheld electronic device includes a back cover including a ceramic layer. A titanium metal layer or a stainless steel metal layer is disposed on the ceramic layer in a position corresponding to at least one heat source. The ceramic layer is an outer surface of the handheld electronic device and exposed to an external environment. The titanium metal layer or the stainless steel metal layer faces a receiving space of the handheld electronic device in contact with the heat source in the receiving space. The titanium metal layer or the stainless steel metal layer serves to absorb the heat generated by the heat source and transfer the heat to the ceramic layer for dissipating the heat.Type: ApplicationFiled: July 11, 2018Publication date: December 27, 2018Inventor: Hsiu-Wei Yang
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Publication number: 20180368284Abstract: A back cover unit applied to portable device and having heat conduction function includes a ceramic back cover having an outer surface and an inner surface. The outer surface faces an external environment, while the inner surface faces a receiving space of a portable electronic device. A heat contact section is disposed on the inner surface in a position corresponding to at least one heat source disposed in the receiving space. The heat contact section has a contact face in contact with the heat source, whereby the heat generated by the heat source can be transferred through the heat contact section to the ceramic back cover to dissipate the heat.Type: ApplicationFiled: July 11, 2018Publication date: December 20, 2018Inventor: Hsiu-Wei Yang
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Publication number: 20180321717Abstract: A heat-conducting case unit for handheld electronic device includes a ceramic back cover having an outer surface and an inner surface. The inner surface faces a receiving space of the handheld electronic device and has a heat conducting element provided thereon to contact with at least one heat source in the receiving space, and the heat conducting element has a thermal conductivity higher than that of the ceramic back cover. The outer surface is exposed to an external environment. Heat produced by the heat source is transferred via the heat conducting element to the ceramic back cover, from where the produced heat is dissipated into the external environment.Type: ApplicationFiled: July 11, 2018Publication date: November 8, 2018Inventor: Hsiu-Wei Yang
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Patent number: 10112272Abstract: A manufacturing method of vapor chamber includes steps of: providing a first board body and a second board body; using mechanical processing to form a hooked section structure on one face of the first board body; using mechanical processing to form a hook section structure on one face of the second board body; and correspondingly mating the first and second board bodies with each other to make the hook section and the hooked section contact and hook and connect with each other and sealing the periphery of the first and second board bodies and vacuuming the first and second board bodies and filling therein a working fluid. According to the manufacturing method, the vapor chamber is manufactured without any additional support structure, but is still free from the problem of thermal expansion. Also, the vapor chamber can be thinned and lightweight.Type: GrantFiled: February 25, 2016Date of Patent: October 30, 2018Assignee: Asia Vital Components Co., Ltd.Inventors: Hsiu-Wei Yang, Fu-Kuei Chang
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Patent number: 10107558Abstract: A thermal module includes a housing having multiple independent compartments not in communication with each other. Each compartment communicates with an open end of at least one heat pipe. The open end communicates with a heat pipe chamber in the heat pipe, whereby the independent compartments communicate with the heat pipe chambers.Type: GrantFiled: September 2, 2013Date of Patent: October 23, 2018Assignee: Asia Vital Components Co., Ltd.Inventor: Hsiu-Wei Yang
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Patent number: 10101779Abstract: A heat dissipation unit of handheld electronic device is applied to and assembled with a handheld electronic device. The heat dissipation unit includes a main body having a heat absorption section and a heat dissipation section respectively disposed on two sides of the main body. The heat absorption section is made of ceramic material. The heat dissipation section is a heat dissipation conductor. The heat absorption section and the heat dissipation section are respectively correspondingly positioned in the handheld electronic device and outside the handheld electronic device. The heat generated inside the handheld electronic device can be quickly conducted from the ceramic-made heat absorption section to the heat dissipation section and then conducted from the heat dissipation section to outer side of the handheld electronic device. Accordingly, the lifetime of the handheld electronic device is prolonged and the efficiency of the handheld electronic device is enhanced.Type: GrantFiled: December 11, 2013Date of Patent: October 16, 2018Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventor: Hsiu-Wei Yang
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Patent number: 10029337Abstract: A method of manufacturing heat dissipation device includes the steps of providing at least one heat transfer unit; further providing at least one frame for connecting to the at least one heat transfer unit; and spot welding the heat transfer unit to the frame at a junction formed therebetween, so that the heat transfer unit is fixedly attached to the frame. With the above method, the steps for assembling the heat transfer unit to the frame are effectively reduced, and the material and production costs for applying adhesive agent or adhesive tape are also saved.Type: GrantFiled: April 2, 2015Date of Patent: July 24, 2018Assignee: Asia Vital Components Co., Ltd.Inventor: Hsiu-Wei Yang
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Patent number: 9903665Abstract: A heat dissipation unit and a thermal module thereof. The heat dissipation unit includes a metal main body having a chamber, an oxide coating and a working fluid. The oxide coating is coated on wall surface of the chamber instead of capillary structure. The oxide coating serves to enhance vapor/liquid circulation efficiency of the working fluid in the chamber of the heat dissipation unit so as to increase heat dissipation efficiency.Type: GrantFiled: February 17, 2015Date of Patent: February 27, 2018Assignee: Asia Vital Components Co., Ltd.Inventor: Hsiu-Wei Yang
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Patent number: 9879920Abstract: A vapor chamber structure includes a first board body, a second board body and a working fluid. The first board body has a hooked section. The second board body has a hook section. The hook section and the hooked section contact and hook and connect with each other. The vapor chamber structure has no additional support structure, but is still free from the problem of thermal expansion. Also, the vapor chamber structure can be both thinned and lightweight.Type: GrantFiled: February 25, 2016Date of Patent: January 30, 2018Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventors: Hsiu-Wei Yang, Fu-Kuei Chang