Abstract: A heat dissipation structure for heat dissipation device includes a heat dissipation device main body that internally defines a chamber, and the chamber is internally provided with at least a whisker layer and a working fluid. The whisker layer is provided on an inner wall surface of the chamber. By providing the whisker layer in the chamber, it is able to provide largely upgraded capillary effect in the chamber to thereby increase the vapor/liquid cycling efficiency of the working fluid in the heat dissipation device, enabling the latter to have upgraded heat transfer performance.

Abstract: The present invention relates to a method for manufacturing a flat plate heat pipe, which includes steps of: forming a wick structure layer and at least one wick structure post on the inner surface of a chamber of a pipe, pressing the pipe to become a flattened pipe with the wick structure post being connected therein, connecting a conduit to the chamber, sealing both sides of the flattened pipe, evacuating air inside the chamber through the conduit, filling a working fluid into the chamber, and sealing the conduit. According to this method, a flat plate heat pipe can be made in a simplified manner with increased yield and reduced cost.

Abstract: The present invention provides a heat pipe and a method for manufacturing the same. The heat pipe includes a main body having a chamber. The chamber has at least one wick region and at least one flowing channel region. The wick region is positioned adjacent to the flowing channel region and both of them axially extend in the chamber. The wick region is provided on an inner wall of the chamber. An area occupied by the wick region is smaller than a half of the circumference of the inner wall of the chamber. A wick structure in the heat pipe can be prevented from suffering damage during its production and the yield of production is increased.

Abstract: A heat pipe structure includes a tubular body. The tubular body has a chamber, a working fluid and a first capillary structure. The chamber is defined with at least one first section, a second section and a third section. The first, second and third sections are connected with each other. The first capillary structure is disposed in the second section. By means of the above arrangement, the pressure impedance of the chamber of the heat pipe is lowered to greatly increase vapor-liquid circulation efficiency of the working fluid in the chamber.

Abstract: A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a main body and at least one fixing hole. The main body has a first board body and a second board body corresponding to the first board body. The first and second board bodies are mated with each other to define a chamber. A working fluid and multiple support pillars are disposed in the chamber. At least one capillary structure is disposed on a surface of the chamber. The fixing hole is formed on the main body in a position where any support pillar is positioned. The fixing hole passes through the first and second board bodies and the support pillar. According to the above arrangement, the airtightness of the chamber of the main body can be ensured. Also, the heat spreader can be tightly connected with other components.

Abstract: A vapor chamber structure includes a main body formed from a first plate and a second plate, which are correspondingly closed to each other to define at least one open area on the main body and a chamber in the main body. The chamber is internally provided with at least one wick structure, a supporting structure, and a working fluid. The open area correspondingly extends through the first plate, the second plate and the chamber. When the main body is positioned on a substrate to contact with a heat source, the at least one open area allows other electronic elements higher than the heat source to extend therethrough without interfering with the direct contact of the main body with the heat source. A method of manufacturing the above-described vapor chamber structure is also disclosed.

Abstract: A heat dissipation device includes a heat dissipation element and a ceramic main body. The heat dissipation element includes a heat transfer section and a heat dissipation section located on one side of the heat transfer section; and the ceramic main body is directly connected to another side of the heat transfer section opposite to the heat dissipation section by way of welding or a direct bonding copper process, so as to overcome the problem of crack at an interface between the heat dissipation device and a heat source due to thermal fatigue. A method of manufacturing the above-described heat dissipation device is also disclosed.

Abstract: A vapor chamber structure and a method of manufacturing thereof are disclosed. The vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed each other to define a chamber therebetween; the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome.

Abstract: A heat dissipation device with mounting structure includes a main body and a plurality of mounting elements. The main body includes an internally defined chamber having a first side and an opposite second side; a plurality of supports located in the chamber and respectively having two ends connected to the first side and the second side of the chamber; a working fluid filled in the chamber; and a plurality of connection sections in the form of recesses formed on an outer surface of the main body at positions corresponding to the supports in the chamber. The mounting elements are connected to the connection sections. With these arrangements, the heat dissipation device with the mounting elements connected to one outer surface thereof can maintain the chamber in the main body in an airtight state and ensure tight contact of it with a heat-generating element.

Abstract: A heat dissipation unit and a manufacturing method thereof and a thermal module thereof. The heat dissipation unit includes a metal main body having a chamber, an oxide coating and a working fluid. The oxide coating is coated on wall surface of the chamber instead of capillary structure. The oxide coating serves to enhance vapor/liquid circulation efficiency of the working fluid in the chamber of the heat dissipation unit so as to increase heat dissipation efficiency.

Abstract: A heat pipe manufacturing method includes the steps of preparing a pipe and a wick structure; placing the wick structure in the pipe, vacuuming the pipe, and filling a working fluid in the pipe; and sealing the pipe. By manufacturing a heat pipe with this method, the risk of damaging the wick structure in the pipe during bending or pressing the pipe can be avoided to thereby ensure increased good yield. Further, with this method, the pipe can be pressed to form a thin heat pipe to thereby provide increased flexibility in production.

Abstract: A thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber and a working fluid. At least one first channel and at least one second channel are formed on an inner wall face of the chamber. The first and second channels extend to intersect each other. The mesh body is attached to the inner wall face of the chamber. The thin heat pipe structure is able to transfer heat in both axial direction and radial direction. By means of the manufacturing method, the heat pipe can be slimmed and the ratio of good products can be greatly increased.

Abstract: A thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a support body. The tubular body has at least one receiving space in which a working fluid is contained. The support body is disposed in the receiving space to partition the receiving space into a first chamber and a second chamber. By means of the manufacturing method of the thin heat pipe structure, the thin heat pipe structure can be made with greatly enhanced heat transfer efficiency. In addition, in the manufacturing process, the ratio of good products is increased to lower the manufacturing cost.

Abstract: A heat spreader structure and a manufacturing method thereof. The heat spreader structure includes a main body. The main body includes a first board body and a second board body corresponding to the first board body. The second board body is mated with the first board body to form the main body. The main body has a circulation area and a connection area. The circulation area is connected with the connection area to together define a chamber in which a working fluid is contained. The circulation area has a first capillary structure, while the connection area has a second capillary structure. In manufacturing, the heat spreader structure can be freely bent and shaped without damaging the internal capillary structures.

Abstract: A heat-dissipating unit having a hydrophilic compound film and a method for depositing a hydrophilic compound film are disclosed. The heat-dissipating unit includes a metallic body having a chamber and a working fluid. The chamber has a liquid-guiding structure constituted of an evaporating portion, a condensing portion and a connecting portion. At least one hydrophilic compound film is coated on surfaces of the chamber and the liquid-guiding structure. By this arrangement, the flowing of the working fluid in the heat-dissipating unit is enhanced to improve the heat-conducting efficiency of the heat-dissipating unit.

Abstract: A micro vapor chamber includes a first plate and a second plate. The first plate has a condensing region constituted of a plurality of protrusions. The second plate has a plurality of liquid-collecting regions and an evaporating region. The condensing region is located to correspond to the liquid-collecting regions and the evaporating region. The first plate is arranged to cover the second plate. The condensed working fluid are quickly collected on the protrusions to flow back to the evaporating region, thereby improving the liquid-vapor phase circulation of the working fluid in the micro vapor chamber greatly.

Abstract: A heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of first extended sections and a plurality of second extended sections. The first and the second extended sections are connected to and intersected with one another to thereby define a plurality of intersections and open spaces on the thin-sheet member. The bosses are provided on at least some of the intersections of the first and the second extended sections to enable increased supporting strength of the heat pipe structure as well as enhanced vapor-liquid circulation efficiency of the working fluid in the heat pipe structure.

Abstract: A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.

Abstract: A plate-type heat pipe sealing structure and a manufacturing method thereof are disclosed. The plate-type heat pipe includes a main body and a tube body. A notch is formed at one of two ends of the main body or one of four corners of the main body as a sealed section thereof. The tube body is disposed in the notch and connected with the main body. The main body of the plate-type heat pipe is cut by means of a mechanical processing method such as punching to form the notch. The notch of the main body is sealed by means of high frequency wave or copper welding. The tube body is positioned within the notch without protruding from the main body of the plate-type heat pipe. Accordingly, when assembled with a heat sink unit, the sealed section of the plate-type heat pipe will not interfere with the heat sink unit.

Abstract: A flat type heat pipe device includes a packaging unit and a bonding member. The packaging unit further includes a first shell member and a second shell member. The first shell member has a work zone, a first joining part surrounding the work zone and an upright stop part disposed between the work zone and the joining part. The second shell member provides a shape corresponding to the first shell member to cover the first shell member and has a shell lid part spacing apart from the work zone and a second joining part disposed on the first joining part. The bonding member is disposed between the first joining part and the second joining part to adhere the first joining part to the second joining part. When the first shell member is pressingly fit with second shell member, the stop part is capable of preventing the bonding member from entering the packaging unit.