Abstract: A thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber and a working fluid. At least one first channel and at least one second channel are formed on an inner wall face of the chamber. The first and second channels extend to intersect each other. The mesh body is attached to the inner wall face of the chamber. The thin heat pipe structure is able to transfer heat in both axial direction and radial direction. By means of the manufacturing method, the heat pipe can be slimmed and the ratio of good products can be greatly increased.

Abstract: A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.

Abstract: A manufacturing method of vapor chamber includes steps of: providing a first board body and a second board body; using mechanical processing to form a hooked section structure on one face of the first board body; using mechanical processing to form a hook section structure on one face of the second board body; and correspondingly mating the first and second board bodies with each other to make the hook section and the hooked section contact and hook and connect with each other and sealing the periphery of the first and second board bodies and vacuuming the first and second board bodies and filling therein a working fluid. According to the manufacturing method, the vapor chamber is manufactured without any additional support structure, but is still free from the problem of thermal expansion. Also, the vapor chamber can be thinned and lightweight.

Abstract: A vapor chamber structure includes a first board body, a second board body and a working fluid. The first board body has a hooked section. The second board body has a hook section. The hook section and the hooked section contact and hook and connect with each other. The vapor chamber structure has no additional support structure, but is still free from the problem of thermal expansion. Also, the vapor chamber structure can be both thinned and lightweight.

Abstract: A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a main body and at least one fixing hole. The main body has a first board body and a second board body corresponding to the first board body. The first and second board bodies are mated with each other to define a chamber. A working fluid and multiple support pillars are disposed in the chamber. At least one capillary structure is disposed on a surface of the chamber. The fixing hole is formed on the main body in a position where any support pillar is positioned. The fixing hole passes through the first and second board bodies and the support pillar. According to the above arrangement, the airtightness of the chamber of the main body can be ensured. Also, the heat spreader can be tightly connected with other components.

Abstract: A raised bodied vapor chamber structure is disclosed and includes a main body and a working fluid. The main body has a condensation section and an evaporation section and a chamber. The condensation section and the evaporation section are respectively disposed on two sides of the chamber. The evaporation section has a first face and a second face. A raised section is formed on the first face. The working fluid is filled in the chamber. The raised section is formed by means of mechanical processing as a support structure for enhancing the structural strength of the vapor chamber structure. The vapor chamber structure is manufactured at a much lower cost.

Abstract: A method of manufacturing heat dissipation device includes the steps of providing at least one heat transfer unit; further providing at least one frame for connecting to the at least one heat transfer unit; and spot welding the heat transfer unit to the frame at a junction formed therebetween, so that the heat transfer unit is fixedly attached to the frame. With the above method, the steps for assembling the heat transfer unit to the frame are effectively reduced, and the material and production costs for applying adhesive agent or adhesive tape are also saved.

Abstract: A heat dissipation unit includes a housing and a heat pipe. The housing has a chamber in which a working fluid is contained. Multiple support posts and multiple fixing members are disposed in the chamber. The heat pipe has a heat absorption section positioned in the chamber of the housing and securely supported by the fixing members, and a heat dissipation section extending from the heat absorption section through the housing and positioned outside the chamber of the housing.

Abstract: A heat pipe structure and a manufacturing method of the heat pipe structure. The heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber. The chamber has a first side and a second side. A working fluid is contained in the chamber. The wall faces of the first and second sides are respectively formed with a first channel set and a second channel set. A first contact section and a second contact section are respectively formed at the junctions between the first and second channel sets and the wall faces of the first and second sides. The mesh body is disposed in the chamber and attached to the first and second contact sections. Accordingly, the thickness of the heat pipe is greatly reduced and the manufacturing cost of the heat pipe is lowered.

Abstract: The present invention relates to a method for sealing a heat transfer unit, which includes the steps of providing a heat transfer unit having at least one opening, welding the opening to form a welding section and close the opening, and pinching off the welding section and cutting part of the welding section to form a cutting end and complete sealing the opening of the heat transfer unit. By means of the method of the present invention, an extremely short dead zone can be obtained and high heat conduction efficiency is enhanced, further having the effects of reducing the arrangement space and shrinking steps of the heat pipe.

Abstract: A heat spreader structure and a manufacturing method thereof. The heat spreader structure includes a main body. The main body includes a first board body and a second board body corresponding to the first board body. The second board body is mated with the first board body to form the main body. The main body has a circulation area and a connection area. The circulation area is connected with the connection area to together define a chamber in which a working fluid is contained. The circulation area has a first capillary structure, while the connection area has a second capillary structure. In manufacturing, the heat spreader structure can be freely bent and shaped without damaging the internal capillary structures.

Abstract: A micro vapor chamber includes a first plate and a second plate. The first plate has a condensing region constituted of a plurality of protrusions. The second plate has a plurality of liquid-collecting regions and an evaporating region. The condensing region is located to correspond to the liquid-collecting regions and the evaporating region. The first plate is arranged to cover the second plate. The condensed working fluid are quickly collected on the protrusions to flow back to the evaporating region, thereby improving the liquid-vapor phase circulation of the working fluid in the micro vapor chamber greatly.

Abstract: A heat dissipation unit and a thermal module thereof. The heat dissipation unit includes a metal main body having a chamber, an oxide coating and a working fluid. The oxide coating is coated on wall surface of the chamber instead of capillary structure. The oxide coating serves to enhance vapor/liquid circulation efficiency of the working fluid in the chamber of the heat dissipation unit so as to increase heat dissipation efficiency.

Abstract: A vapor chamber structure includes a main body assembled from a first and a second plate member, which are closed to each other to thereby define a chamber between them. The main body has a first zone, a second zone, and a first connection section defined thereon. The first and the second zone are located in two different horizontal planes and have a first wick structure provided within them; and the first connection section is located between and connected to the first and the second zone and has a second wick structure provided within it. With these arrangements, the vapor chamber structure can be used with a plurality of heat sources having their top surfaces located at different heights or with a heat source having several different heat-producing surfaces to provide increased flexibility in use.

Abstract: A heat dissipation unit of handheld electronic device is applied to and assembled with a handheld electronic device. The heat dissipation unit includes a main body having a heat absorption section and a heat dissipation section respectively disposed on two sides of the main body. The heat absorption section is made of ceramic material. The heat dissipation section is a heat dissipation conductor. The heat absorption section and the heat dissipation section are respectively correspondingly positioned in the handheld electronic device and outside the handheld electronic device. The heat generated inside the handheld electronic device can be quickly conducted from the ceramic-made heat absorption section to the heat dissipation section and then conducted from the heat dissipation section to outer side of the handheld electronic device. Accordingly, the lifetime of the handheld electronic device is prolonged and the efficiency of the handheld electronic device is enhanced.

Abstract: A plate-type heat pipe sealing structure and a manufacturing method thereof are disclosed. The plate-type heat pipe includes a main body and a tube body. A notch is formed at one of two ends of the main body or one of four corners of the main body as a sealed section thereof. The tube body is disposed in the notch and connected with the main body. The main body of the plate-type heat pipe is cut by means of a mechanical processing method such as punching to form the notch. The notch of the main body is sealed by means of high frequency wave or copper welding. The tube body is positioned within the notch without protruding from the main body of the plate-type heat pipe. Accordingly, when assembled with a heat sink unit, the sealed section of the plate-type heat pipe will not interfere with the heat sink unit.

Abstract: A heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber. The chamber has a first side and a second side. A working fluid is contained in the chamber. The wall faces of the first and second sides are respectively formed with a first channel set and a second channel set. A first contact section and a second contact section are respectively formed at the junctions between the first and second channel sets and the wall faces of the first and second sides. The mesh body is disposed in the chamber and attached to the first and second contact sections. Accordingly, the thickness of the heat pipe is greatly reduced and the manufacturing cost of the heat pipe is lowered.

Abstract: The present invention relates to a flat plate heat pipe and a method for manufacturing the same. The heat pipe includes a flattened pipe whose inner surface is coated with a wick structure layer. The interior of the flattened pipe is provided with a sintered supporting layer and a working fluid. The sintered supporting layer has a plurality of posts arranged in the flattened pipe to vertically support therein. With this arrangement, the thickness of the pipe can be reduced but the whole structural strength can be maintained to prevent deformation. Further, a return path for the working fluid can be provided in the pipe. By only sealing two sides of the pipe, a sealed chamber can be formed for the operation of the working fluid. By the inventive method, the manufacturing process can be simplified and a larger space inside the chamber can be obtained.

Abstract: A heat pipe structure and a manufacturing method of the heat pipe structure. The heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber. The chamber has a first side and a second side. A working fluid is contained in the chamber. The wall faces of the first and second sides are respectively formed with a first channel set and a second channel set. A first contact section and a second contact section are respectively formed at the junctions between the first and second channel sets and the wall faces of the first and second sides. The mesh body is disposed in the chamber and attached to the first and second contact sections. Accordingly, the thickness of the heat pipe is greatly reduced and the manufacturing cost of the heat pipe is lowered.

Abstract: A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.