Patents by Inventor Hsiung Hsu

Hsiung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12047543
    Abstract: An infrared cropping optical module includes: a housing; a linear optical sensing module, which is accommodated within the housing, outputs visible light and receives reflected visible light and transmitting infrared light to obtain a visible light image, generated after the linear optical sensing module scans a medium, and cropping information corresponding to the visible light image; an infrared linear light source, which is accommodated within the housing, is disposed on one side of the linear optical sensing module, and outputs first infrared light; and a calibration sheet, which is disposed on an optical path of the first infrared light and reflects external visible light. A scanner using the infrared cropping optical module for image cropping is also disclosed.
    Type: Grant
    Filed: August 7, 2023
    Date of Patent: July 23, 2024
    Inventor: Bo-Hsiung Hsu
  • Patent number: 12046497
    Abstract: A transfer system for wafer cassettes includes a tray and a rail compatible with the tray. The tray includes a base plate, a through hole, a wall, and a pair of first positioning features. The through hole is disposed on a center of the base plate, in which the through hole has a first direction axis and a second direction axis perpendicular to the first direction axis. The wall extends from a surface of the base plate and surrounding the through hole, in which the wall separates the base plate into an interior region and an exterior region. The pair of first positioning features having a first level height are in the interior region and arranged parallel to the first direction axis.
    Type: Grant
    Filed: August 2, 2022
    Date of Patent: July 23, 2024
    Assignee: VisEra Technologies Company Ltd.
    Inventors: Yi-Feng Yen, Shih-Lung Hsu, Kuo-Hsing Teng, Cheng-Hsiung Tung
  • Publication number: 20240242982
    Abstract: A semiconductor high pressure annealing device is described. The semiconductor high pressure annealing device includes a chamber body, a cover, a lifting mechanism, and a floating sealing structure. Air tightness between the chamber body and the cover is achieved by the floating sealing structure. A first sealing ring and a second sealing ring of the floating sealing structure are arranged on the top and the bottom for reducing the damage to the first sealing ring and the second sealing ring when the cover moves up and down. A preload spring assembly of the floating sealing structure can provide tension to assist in improving the air tightness between the chamber body and the cover.
    Type: Application
    Filed: January 10, 2024
    Publication date: July 18, 2024
    Inventors: Cheng-Hsiung LEE, Chun-Hung HUNG, Chun-Hung HUNG, Fu-Chieh HSU
  • Publication number: 20240241529
    Abstract: A dual-chamber pressure control method and a dual-chamber pressure control device are described. The dual-chamber pressure control method uses a stepped pressure adjustment to ensure that the pressure adjustment at each stage will not exceed a safe value of an internal chamber body. The dual-chamber pressure control device includes a dual-chamber member, an external chamber pressure control module, and an internal chamber pressure control module. The external chamber pressure control module is used to adjust an external chamber pressure of the dual-chamber member, such that an external chamber pressure value changes with time to show a stepped external chamber pressure adjustment line. The internal chamber pressure control module is used to adjust an internal chamber pressure of the dual-chamber member, such that an internal chamber pressure value changes with time to show a stepped internal chamber pressure adjustment line.
    Type: Application
    Filed: January 17, 2024
    Publication date: July 18, 2024
    Inventors: Fu-Chieh Hsu, Chun-Hung Hung, Chun-Hung Hung, Cheng-Hsiung Lee
  • Publication number: 20240202311
    Abstract: The present invention relates to a password generation and verification method. The method includes: in a user end verifier device, randomly generating and displaying a prompt message in response to a login request from a user; receiving a password inputted by the user based on the prompt message via the user end verifier device; transmitting the prompt message and the password from the user end verifier device to a remote end verifier device in response to the input of the password; in the remote end verifier device, executing a second verifier programming module to generate a second verification code in accordance with at least one predetermined password generation rule that is preselected by the user; and accepting the login request, when the password matches the second verification code.
    Type: Application
    Filed: April 12, 2023
    Publication date: June 20, 2024
    Inventors: Ho-Hsiung HSU, I-Shin MA
  • Patent number: 12013643
    Abstract: A method includes: providing a first layout of a first layer over a substrate, the first layer having at least one metal pattern, and generating a second layout by placing a cut mask at a first position relative to the substrate to remove material from a first region of the at least one metal pattern to provide a first metal pattern and placing the cut mask at a second position relative to the first layer over the substrate to remove material from a second region of the at least one metal pattern to provide a second metal pattern.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: June 18, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chin-Hsiung Hsu, Huang-Yu Chen, Tsong-Hua Ou, Wen-Hao Chen
  • Publication number: 20240145389
    Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.
    Type: Application
    Filed: July 28, 2023
    Publication date: May 2, 2024
    Inventors: Li-Chiu WENG, Yew Teck TIEO, Ming-Hsuan WANG, Chia-Cheng CHEN, Wei-Yi CHANG, Jen-Hang YANG, Chien-Hsiung HSU
  • Publication number: 20240114103
    Abstract: An infrared cropping optical module includes: a housing; a linear optical sensing module, which is accommodated within the housing, outputs visible light and receives reflected visible light and transmitting infrared light to obtain a visible light image, generated after the linear optical sensing module scans a medium, and cropping information corresponding to the visible light image; an infrared linear light source, which is accommodated within the housing, is disposed on one side of the linear optical sensing module, and outputs first infrared light; and a calibration sheet, which is disposed on an optical path of the first infrared light and reflects external visible light. A scanner using the infrared cropping optical module for image cropping is also disclosed.
    Type: Application
    Filed: August 7, 2023
    Publication date: April 4, 2024
    Inventor: BO-HSIUNG HSU
  • Patent number: 11949157
    Abstract: A dual polarization log-periodic antenna apparatus includes a log-periodic antenna and a conical reflector. The conical reflector is arranged below the log-periodic antenna. The log-periodic antenna is configured to transmit a plurality of radio waves. The conical reflector is configured to reflect the radio waves transmitted by the log-periodic antenna.
    Type: Grant
    Filed: September 7, 2022
    Date of Patent: April 2, 2024
    Assignees: GRAND-TEK TECHNOLOGY CO., LTD., RESILIENT TECHNOLOGY CO., LTD.
    Inventors: Kai-Hsiung Hsu, Jia-Jiu Song, Chien-Wen Hung
  • Patent number: 11949190
    Abstract: An electrical connector includes: an insulating body; and a first row of terminals and a second row of terminals housed in the insulating body, each terminal in the first row of terminals having a tail portion, a contact portion, and a body portion, the first row of terminals including a signal terminal pair having a pair of signal terminals and a ground terminal arranged on one side of the signal terminal pair, wherein a first center distance between the contact portions of the signal terminal pair is different from a second center distance between the contact portion of the ground terminal and the contact portion of an adjacent signal terminal.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: April 2, 2024
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Chih-Ping Chung, Chun-Hsiung Hsu, Kuei-Chung Tsai
  • Publication number: 20240079788
    Abstract: A dual polarization log-periodic antenna apparatus includes a log-periodic antenna and a conical reflector. The conical reflector is arranged below the log-periodic antenna. The log-periodic antenna is configured to transmit a plurality of radio waves. The conical reflector is configured to reflect the radio waves transmitted by the log-periodic antenna.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 7, 2024
    Inventors: Kai-Hsiung HSU, Jia-Jiu SONG, Chien-Wen HUNG
  • Publication number: 20240063322
    Abstract: Systems, apparatuses, and methods for optical sensing are provided. For example, an optical sensing apparatus can include a substrate, a light-receiving device, a light-emitting device, an encapsulating structure, a covering cap, and an adhesive layer. The light-receiving device and the light-emitting device can be disposed on and electrically connected to the substrate. The encapsulating structure can be disposed on the substrate and cover the light-emitting device and the light-receiving device. The encapsulating structure can include a top surface, a first side surface, and a lower surface. The first side surface and the lower surface can collectively form a recess. The covering cap can be disposed on the encapsulating structure and can include a first opening, a top portion, a protruding portion, and an extending portion. The adhesive layer can be arranged between the encapsulating structure and the covering cap to adhere the encapsulating structure and the covering cap.
    Type: Application
    Filed: June 30, 2023
    Publication date: February 22, 2024
    Inventors: Huei-Hsiung Hsu, Cheng-Te Yu, Yu-Ting Chiu
  • Publication number: 20240063586
    Abstract: An electrical connector assembly includes: an insulative housing; a terminal module assembly received in the insulative housing and including an upper part and a lower part stacked with each other in a vertical direction, each of the upper part and the lower part having a high-speed terminal module and a sideband terminal module, each of the high-speed terminal modules including plural ground terminals and differential pair terminals arranged alternately with the ground terminals in a transverse direction perpendicular to the vertical direction; a cable connected to the high-speed terminal module; and a ground bar located at a rear of the ground terminal and a metal shield member discrete from the ground terminal, the ground bar including a first bulged section, the metal shield member including a second bulged section, the first bulged section and the second bulged section cooperating with each other to surround the cable in a circumferential direction.
    Type: Application
    Filed: August 9, 2023
    Publication date: February 22, 2024
    Inventors: CHUN-HSIUNG HSU, YI-MIN HSU
  • Publication number: 20240063587
    Abstract: An electrical connector assembly includes: an insulative housing forming a front mating slot and a rear receiving space; a terminal module assembly received in the insulative housing and including an upper part and a lower part stacked with each other in a vertical direction, each of the upper part and the lower part comprising a high-speed terminal module and a sideband terminal module, the high-speed terminal module having an insulator and plural high-speed terminals fixed in the insulator, the high-speed terminals comprising plural ground terminals and differential pair terminals arranged alternately with the ground terminals in a transverse direction, each of the differential pair terminals and the ground terminals defining a mating portion, a tail opposite to the mating portion, and a transition portion therebetween; and a ground member mechanically and electrically connected to the transition portions of the ground terminals to form a common ground.
    Type: Application
    Filed: August 9, 2023
    Publication date: February 22, 2024
    Inventors: CHUN-HSIUNG HSU, YI-MIN HSU
  • Publication number: 20230420882
    Abstract: An electrical connector assembly includes: an insulative housing forming a front mating slot and a rear receiving space; a contact module received in the insulative housing and including an upper part and a lower part stacked with each other, each of the upper part and the lower part including a differential pair contact module having an insulator and a plurality of differential pair contact fixed in the insulator, each of the differential pair contact having a mating portion and a tail portion opposite to the mating portion; and a sideband contact module comprising sideband contacts, wherein the differential pair contacts and the sideband contacts are fixed to the insulator in different ways.
    Type: Application
    Filed: June 20, 2023
    Publication date: December 28, 2023
    Inventors: CHUN-HSIUNG HSU, YI-MIN HSU
  • Publication number: 20230335934
    Abstract: An electrical connector including: an insulative housing; four terminal modules received in the insulative housing and each having a row of terminals integrally formed with plural plastic fixing members, each terminal defining a contact portion, a tail portion opposite to the contact portion, and a holding portion therebetween; and a pair of metallic side plates fixing the four terminal modules together, each metallic side plates having plural holes, each plastic fixing member including a pair of positioning protrusions at two ends thereof to be received within corresponding holes, wherein the positioning protrusions respectively extend through the corresponding holes and are heat riveted to the metallic side plates.
    Type: Application
    Filed: April 1, 2023
    Publication date: October 19, 2023
    Inventors: DAI-PEI FU, CHUN-HSIUNG HSU
  • Publication number: 20230307870
    Abstract: A board connector includes a first housing including a base and two sidewalls and defining a receiving space, a plurality of first terminals and a first metallic shell including a first main portion and two extending portions extending from the first main portion and fitting covering outsides of the sidewalls. Each extending portion defines a locking hole. A cable connector includes a second housing, a plurality of second terminals and a second metallic shell comprising a second main portion covering a top of the second insulating housing and a pair of locking arms extending from the second main portion in the lateral direction. Each sidewall is sandwiched between the locking arm and an outside of the second housing and each locking arm is retained in the locking hole during the cable connector is engaged with the board connector.
    Type: Application
    Filed: March 23, 2022
    Publication date: September 28, 2023
    Inventors: XIAO-JUAN LIN, CHUN-HSIUNG HSU
  • Patent number: 11735862
    Abstract: An electrical connector assembly includes a board connector and a cable connector. The board connector includes a first seat comprising a base and two first sidewalls commonly defining a mating space, and a pair of first locking portions with locking heads projecting into the mating space, and a plurality of first terminals retained in the first seat and comprising contacting portions projecting into the mating space and leg portions. The cable connector includes a second seat including a pair of second locking portions to engage with the first locking portions and plural second terminals retained in the second seat. The first seat of the board connector further includes a second sidewall unitarily connecting with the base and first sidewalls at a same side and the second sidewall defines a first locking section to engage with a second locking section defined on the cable connector.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: August 22, 2023
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Xiao-Juan Lin, Chun-Hsiung Hsu
  • Publication number: 20230118936
    Abstract: A board connector includes a first housing including a base and two sidewalls, plural first terminals retained in the base and located between the two sidewalls, and a first metallic shell enclosing the first housing and including a pair of first engaging portions at the sidewalls and a pair of first locking portions located in front of the sidewalls. A cable connector includes a second insulating housing and defining two opposite sides, plural second terminals retained in the second housing, and a second metallic shell enclosing the second housing and including a pair of second locking portions and a pair of second engaging portions behind the second locking portions. The first locking portions are locked with the second engaging portion, and the second locking portion are locked with the first engaging portions after the board connector and the cable connector is mated with each other.
    Type: Application
    Filed: May 27, 2022
    Publication date: April 20, 2023
    Inventors: SHAN-LING FU, HOU-QUAN LIU, XIAO-JUAN LIN, CHUN-HSIUNG HSU
  • Patent number: RE49901
    Abstract: An electrical connector includes an insulative housing defining a front cavity for receiving and a rear cavity, a terminal assembly assembled in the rear cavity, and a ground member. The terminal assembly includes an upper terminal module, a lower terminal module sandwiching a shielding module therebetween. Said The upper terminal module includes a pair of upper ground terminals. Said The lower terminal module includes a plurality of lower ground terminals. Said The shielding module includes a metallic shielding plate. The ground member is associated with the shielding module to mechanically and electrically connect at least one of the upper ground terminals and the lower ground terminals with the shielding plate.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: April 2, 2024
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Terrance F. Little, Chih-Hsien Chou, Chun-Hsiung Hsu, Kuei-Chung Tsai