Patents by Inventor Hsuan Chu

Hsuan Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12176051
    Abstract: A test method is for testing a decision feedback equalization (DFE) of a memory device is provided. The memory device includes a memory bank. The test method includes: providing a first test data pattern having a first data transition frequency and a second test data pattern having a second data transition frequency different from the first data transition frequency; writing the first test data pattern into a first memory section of the memory bank with a first DFE; writing the second test data pattern into a second memory section of the memory bank with the first DFE; reading a first reading data pattern stored in the first memory section and a second reading data pattern stored in the second memory section; and generating a test result signal according to the first reading data pattern and the second reading data pattern.
    Type: Grant
    Filed: March 31, 2023
    Date of Patent: December 24, 2024
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Yi-Hsuan Chu
  • Publication number: 20240347486
    Abstract: An integrated circuit (IC) flip-chip and a light-emitting device are provided. The IC flip-chip includes a chip body, a plurality of metal pads, and a plurality of flip-chip pads. The chip body has a surface. The metal pads are disposed on the surface of the chip body. The flip-chip pads are disposed on the metal pads, and the flip-chip pads are electrically coupled to the metal pads through a redistribution layer therebetween. A distribution of the flip-chip pads is more even than a distribution of the metal pads.
    Type: Application
    Filed: May 29, 2024
    Publication date: October 17, 2024
    Inventors: CHEN-HSIU LIN, MIN-HSI CHEN, CHANG-HUNG HSIEH, SHAN-HUI CHEN, YU-HSUAN CHU
  • Publication number: 20240331791
    Abstract: A test method is for testing a decision feedback equalization (DFE) of a memory device is provided. The memory device includes a memory bank. The test method includes: providing a first test data pattern having a first data transition frequency and a second test data pattern having a second data transition frequency different from the first data transition frequency; writing the first test data pattern into a first memory section of the memory bank with a first DFE; writing the second test data pattern into a second memory section of the memory bank with the first DFE; reading a first reading data pattern stored in the first memory section and a second reading data pattern stored in the second memory section; and generating a test result signal according to the first reading data pattern and the second reading data pattern.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Applicant: NANYA TECHNOLOGY CORPORATION
    Inventor: Yi-Hsuan Chu
  • Patent number: 11901295
    Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang, Chin-Szu Lee, Hsiang Liu
  • Patent number: 11728170
    Abstract: A semiconductor device includes: a fin structure disposed on a substrate; a gate feature that traverses the fin structure to overlay a central portion of the fin structure; a pair of source/drain features, along the fin structure, that are disposed at respective sides of the gate feature; and a plurality of contact structures that are formed of tungsten, wherein a gate electrode of the gate feature and the pair of source/drain features are each directly coupled to a respective one of the plurality of contact structures.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: August 15, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hong-Ying Lin, Cheng-Yi Wu, Alan Tu, Chung-Liang Cheng, Li-Hsuan Chu, Ethan Hsiao, Hui-Lin Sung, Sz-Yuan Hung, Sheng-Yung Lo, C. W. Chiu, Chih-Wei Hsieh, Chin-Szu Lee
  • Patent number: 11635400
    Abstract: A gas sensor for sensing a gas in a humid environment includes a first electrode layer, a second electrode layer that is spaced apart from the first electrode layer, and a gas sensing layer that electrically interconnects the first electrode layer and the second electrode layer. The gas sensing layer is made of a hygroscopic electrically insulating material.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: April 25, 2023
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Hsiao-Wen Zan, Hsin-Fei Meng, Chien-Lung Wang, Sheng-Fu Horng, Hsuan Chu, Wei-Lun Chen, Ting-Hsuan Huang, Pin-Hsuan Li
  • Publication number: 20220408008
    Abstract: A high-dynamic-range (HDR) detecting system includes a camera module comprising an image sensor; and a vision module that receives data generated by the camera module and accordingly transmits feedback to the camera module. The camera module comprises a multiple-exposure unit that provides different exposure settings, according to which a plurality of images are captured by the image sensor. The vision module comprises an object detection device that detects objects in the plurality of images, thereby resulting in object detection results as metadata.
    Type: Application
    Filed: June 22, 2021
    Publication date: December 22, 2022
    Inventors: Yu-Hsuan Chu, Yi-Nung Liu
  • Publication number: 20220394221
    Abstract: A structured-light scanning system with thermal compensation includes a structured-light projector that generates a predetermined projected pattern of light, which is then projected onto and reflected from an object, thereby resulting in a reflected pattern of light; an image sensor that captures the reflected pattern of light; and a digital processing unit that generates a depth map according to the reflected pattern of light and a compensated projected pattern associated with a current temperature.
    Type: Application
    Filed: June 8, 2021
    Publication date: December 8, 2022
    Inventors: Chin-Jung Tsai, Nai-Ting Chang, Yu-Hsuan Chu
  • Patent number: 11470201
    Abstract: Systems and methods are provided that may be implemented in a real time manner by an information handling system (the “client system”) to monitor one or more characteristics of a voice over internet protocol (VOIP) discussion, to use these monitored VOIP characteristics to identify one or more condition/s in real time as they are identified to occur during the current VOIP discussion, and to determine to take one or more automatic actions based on the identified VOIP condition/s so as to inform and/or alert a current human user of the client system to the occurrence of the identified VOIP condition/s as they occur.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: October 11, 2022
    Assignee: Dell Products L.P.
    Inventors: Chia Hung Shih, Chien Yu Huang, Su Hsuan Chu, Vivek Viswanathan Iyer
  • Patent number: 11447312
    Abstract: A container includes a bottom box and a top lid. The bottom box includes a containing space adapted to contain the contents. The bottom box has a tilted shape wherein the bottom box has one side height greater than another side height. The top lid includes an integrally formed lens and formed with a plurality of air holes on a top surface thereof. The top lid is removably assembled with the bottom box.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: September 20, 2022
    Assignee: CHU'S CO., LTD.
    Inventor: Han-Hsuan Chu
  • Publication number: 20220227550
    Abstract: A container includes a bottom box and a top lid. The bottom box includes a containing space adapted to contain the contents. The bottom box has a tilted shape wherein the bottom box has one side height greater than another side height. The top lid includes an integrally formed lens and formed with a plurality of air holes on a top surface thereof. The top lid is removably assembled with the bottom box.
    Type: Application
    Filed: January 15, 2021
    Publication date: July 21, 2022
    Inventor: Han-Hsuan CHU
  • Publication number: 20220218758
    Abstract: The invention unexpectedly found that an isolated and modified QPSC population has multi-potentiality, including: osteoblasts (bone cells), chondrocytes (cartilage cells), and adipocytes (fat cells). The QPSC population of the invention features a desirable immunomodulation ability, including inducing, enhancing, or suppressing an immune response and thus has potential value in the prevention and/or treatment of various immune diseases/disorders/conditions. The invention has effective homing ability and regulation ability in complement-dependent cytotoxicity, including the ability to block the activation of host complements and direct migration to the target area and the ability to enhance cell viability, and thus offers better cell protection and therapeutic efficacy in vivo in the prevention and/or treatment of various acute tissue injury, ischemic or degenerative diseases/disorders/conditions.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 14, 2022
    Inventors: Oscar Kuang-Sheng Lee, Jennifer Hui-Chun Ho, Wei-Kee Ong, Yu-Hsuan Chu
  • Publication number: 20220223528
    Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.
    Type: Application
    Filed: April 4, 2022
    Publication date: July 14, 2022
    Inventors: Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang, Chin-Szu Lee, Hsiang Liu
  • Patent number: 11296027
    Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: April 5, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang, Chin-Szu Lee, Hsiang Liu
  • Publication number: 20220038581
    Abstract: Systems and methods are provided that may be implemented in a real time manner by an information handling system (the “client system”) to monitor one or more characteristics of a voice over internet protocol (VOIP) discussion, to use these monitored VOIP characteristics to identify one or more condition/s in real time as they are identified to occur during the current VOIP discussion, and to determine to take one or more automatic actions based on the identified VOIP condition/s so as to inform and/or alert a current human user of the client system to the occurrence of the identified VOIP condition/s as they occur.
    Type: Application
    Filed: July 30, 2020
    Publication date: February 3, 2022
    Inventors: Chia Hung Shih, Chien Yu Huang, Su Hsuan Chu, Vivek Viswanathan Iyer
  • Publication number: 20210335616
    Abstract: A semiconductor device includes: a fin structure disposed on a substrate; a gate feature that traverses the fin structure to overlay a central portion of the fin structure; a pair of source/drain features, along the fin structure, that are disposed at respective sides of the gate feature; and a plurality of contact structures that are formed of tungsten, wherein a gate electrode of the gate feature and the pair of source/drain features are each directly coupled to a respective one of the plurality of contact structures.
    Type: Application
    Filed: July 8, 2021
    Publication date: October 28, 2021
    Inventors: Hong-Ying LIN, Cheng-Yi WU, Alan TU, Chung-Liang CHENG, Li-Hsuan CHU, Ethan HSIAO, Hui-Lin SUNG, Sz-Yuan HUNG, Sheng-Yung LO, C.W. CHIU, Chih-Wei HSIEH, Chin-Szu LEE
  • Patent number: 11152306
    Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: October 19, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang, Chin-Szu Lee, Hsiang Liu
  • Publication number: 20210255130
    Abstract: A gas sensor for sensing a gas in a humid environment includes a first electrode layer, a second electrode layer that is spaced apart from the first electrode layer, and a gas sensing layer that electrically interconnects the first electrode layer and the second electrode layer. The gas sensing layer is made of a hygroscopic electrically insulating material.
    Type: Application
    Filed: August 19, 2020
    Publication date: August 19, 2021
    Inventors: Hsiao-Wen Zan, Hsin-Fei Meng, Chien-Lung Wang, Sheng-Fu Horng, Hsuan Chu, Wei-Lun Chen, Ting-Hsuan Huang, Pin-Hsuan Li
  • Patent number: 11062908
    Abstract: A semiconductor device includes: a fin structure disposed on a substrate; a gate feature that traverses the fin structure to overlay a central portion of the fin structure; a pair of source/drain features, along the fin structure, that are disposed at respective sides of the gate feature; and a plurality of contact structures that are formed of tungsten, wherein a gate electrode of the gate feature and the pair of source/drain features are each directly coupled to a respective one of the plurality of contact structures.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: July 13, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hong-Ying Lin, Cheng-Yi Wu, Alan Tu, Chung-Liang Cheng, Li-Hsuan Chu, Ethan Hsiao, Hui-Lin Sung, Sz-Yuan Hung, Sheng-Yung Lo, C. W. Chiu, Chih-Wei Hsieh, Chin-Szu Lee
  • Patent number: D970579
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: November 22, 2022
    Assignee: CHU'S CO., LTD.
    Inventor: Han-Hsuan Chu