Abstract: An antenna module includes a ground radiator, a first antenna, and a second antenna. The first antenna comprises a first radiator, a second radiator, and a third radiator. The first radiator and the second radiator resonate at a low frequency band and a first high frequency band, and a part of the first radiator and the third radiator resonate at a second high frequency band. The second antenna includes a fourth radiator, the second radiator, and a connecting section. The connecting section is connected between the fourth radiator and the second radiator. A part of the fourth radiator, the connecting section, and the second radiator resonate at the low frequency band and the second high frequency band, and the fourth radiator, the connecting section, and a part of the second radiator resonate at the first high frequency band.

Abstract: A memory device includes a substrate, an isolation structure, a first transistor, a second transistor, a first guard ring, and a dielectric guard ring. The substrate has a first region and a second region which are adjacent. The isolation structure is embedded in the substrate. The first transistor is disposed over the first region of the substrate and has a first conductivity type. The second transistor is disposed over the second region of the substrate and has a second conductivity type which is different from the first conductivity type. The first guard ring is disposed over the first region of the substrate and surrounds the first transistor. The first guard ring includes the same material as the first transistor and has the first conductivity type. The dielectric guard ring is disposed over the substrate and surrounds the first guard ring.

Abstract: Systems and methods for vehicle-to-vehicle communications are provided. An adverse system can obtain sensor data representative of an environment proximate to a targeted system. The adverse system can generate an intermediate representation of the environment and a representation deviation for the intermediate representation. The representation deviation can be designed to disrupt a machine-learned model associated with the target system. The adverse system can communicate the intermediate representation modified by the representation deviation to the target system. The target system can train the machine-learned model associated with the target system to detect the modified intermediate representation. Detected modified intermediate representations can be discarded before disrupting the machine-learned model.

Abstract: Some embodiments relate to an integrated circuit (IC) device including a substrate having first photodetector groups respectively associated with a plurality of color pixels and second photodetector groups respectively associated with a plurality of phase detection pixels. Each of the first and second photodetector groups includes one or more photodetectors. The device further includes a grid structure over the substrate, color filters over the substrate, and a crosstalk reduction structure. The grid structure includes light shields, each configured to redirect light away from a corresponding one of the second photodetector groups. Each color filter vertically spans the grid structure at a corresponding one of the first photodetector groups. The crosstalk reduction structure is level with the color filters and limits an amount of the light redirected by the light shield of each of the phase detection pixels to the first photodetector group of a neighboring one of the color pixels.

Abstract: An electronic device includes a metal back cover, a metal frame, and two radiators. The metal frame disposed at a side of the metal back cover includes two disconnecting parts, a second slot, and two connecting parts. A first slot is formed between each of the disconnecting parts and the metal back cover. The second slot is formed between the two disconnecting parts. The two connecting parts are connected to a side away from the second slot of the two disconnecting parts respectively and are connected to the metal back cover. Each of the radiators connects the metal back cover to the corresponding disconnecting part over the first slot. The two radiators are disposed symmetrically based on the second slot. Each radiator is coupled with the corresponding disconnecting part, the corresponding connecting part, and the metal back cover to resonate a first, a second, and a third frequency band.

Abstract: A plurality of holes in a top surface of a silicon medium form a plurality of sub-meta lenses to result in multiple focal points rather than a single point (resulting from using a single meta lens). As a result, optical paths for incoming light are reduced as compared with a single optical path associated with a single meta lens, which in turn reduces angular response of incident photons. Thus, a pixel sensor including the plurality of sub-meta lenses experiences improved light focus and greater signal-to-noise ratio. Additionally, dimensions of the pixel sensor are reduced (particularly a height of the pixel sensor), which allows for greater miniaturization of an image sensor that includes the pixel sensor.

Abstract: An antenna module includes a ground radiator, a first antenna, and a second antenna. The first antenna includes a first feeding end, a first segment, a second segment, a third segment, and a fourth segment. A first area of the first antenna and a second area including a part of the first antenna and a part of the ground radiator resonate at a first frequency band. A third area of the first antenna and the second area resonate at a second frequency band. An area including a part of the second antenna, the third segment, the first segment, and the second segment resonates at the first frequency band. An area of the second antenna and an area including the part of the second antenna, a part of the third segment, and another part of the ground radiator resonate at the second frequency band.

Abstract: An electronic device including a light-emitting element, an IC chip, a substrate, an optical waveguide layer, and an optical signal outlet is provided. The IC chip is configured to control the light-emitting element to emit an optical signal. The light-emitting element is disposed on a first surface of the substrate, and the IC chip is disposed on a second surface of the substrate. The optical waveguide layer is disposed on the first surface of the substrate, and the optical waveguide layer includes a core layer, a cladding layer, and a metal layer. The metal layer is disposed on at least a portion of an interface between the core layer and the cladding layer. The optical signal outlet corresponds to the light-emitting element, and the optical signal reaches the optical signal outlet after being transmitted in the core layer.

Abstract: An antenna assembly includes a patch antenna, a metal layer, and a feed-in signal layer. The metal layer is disposed on a side of the patch antenna and includes a first slot and a second slot. The feed-in signal layer is disposed on a side of the metal layer opposite the second antenna and includes a transmitting port, a receiving port, a hybrid coupler, and two microstrips. The transmitting port and the receiving port are connected to the hybrid coupler, and the two microstrips are extended in the direction away from the hybrid coupler. Projections of two ends of the two microstrips onto the metal layer are overlapped with the first slot and the second slot. An antenna array is also mentioned.

Abstract: An electronic package module and a method for fabrication of the same are provided. The method includes providing an electronic component assembly and a circuit substrate. The electronic component assembly includes two electronic components and a conductive structure. The electronic components are connected to each other through a conductive adhesive material, while the electronic components are connected to the conductive structure through another conductive adhesive material. A soldering material is formed on the circuit substrate, and the electronic component assembly is disposed on the soldering material. The melting points of the conductive adhesive materials are higher than the melting point of the soldering material. As a result, the conductive adhesive materials are prevented from failure during the soldering process, and thus the process yield is improved.

Abstract: An antenna structure is provided. The antenna structure includes a conductor substrate, a coupling feed-in element and a shielding element. The conductor substrate has a slot. The coupling feed-in element, partly overlapping the slot, is disposed on the conductor substrate. The shielding element, partly overlapping the slot, is separated from the coupling feed-in element and disposed on the conductor substrate, wherein the shielding element is movable along the slot.

Abstract: A memory controller coupled to a memory device for accessing the memory device and includes a Universal Asynchronous Receiver/Transmitter (UART) and a microprocessor. The microprocessor is coupled to the UART and configured to control access operations of the memory device. The microprocessor is configured to perform an interrupt service routine in response to an interrupt. When performing the interrupt service routine, the microprocessor is configured to determine whether a predetermined signal has been received by a specific pin and when determining that the predetermined signal has been received by the specific pin, the microprocessor is configured to output a debug message through a transmitting terminal of the UART.

Abstract: The present disclosure is related to the six isomer structures (OBI-821-1990-V1A, OBI-821-1990-V1B, OBI-821-1990-V2A, OBI-821-1990-V2B, OBI-821-1858-A, and OBI-821-1858-B) of isolated OBI-821 adjuvant and the method for evaluating the quality thereof. The method of the present disclosure adopts hydrophilic interaction liquid chromatography (HILIC) and reverse phase high performance liquid chromatography (RP-HPLC) either alone or in tandem and is able to separate the isomers of OBI-821 adjuvant in the consequent chromatography. Accordingly, the quality of OBI-821 adjuvant can be further evaluated.

Abstract: Systems and methods for vehicle-to-vehicle communications are provided. An adverse system can obtain sensor data representative of an environment proximate to a targeted system. The adverse system can generate an intermediate representation of the environment and a representation deviation for the intermediate representation. The representation deviation can be designed to disrupt a machine-learned model associated with the target system. The adverse system can communicate the intermediate representation modified by the representation deviation to the target system. The target system can train the machine-learned model associated with the target system to detect the modified intermediate representation. Detected modified intermediate representations can be discarded before disrupting the machine-learned model.

Abstract: An antenna module includes two antenna units, two isolation members, and a grounding member. Each antenna unit consists of two feeding ends, two first radiators, and two second radiators. The isolating members are disposed between the first and second portions of each antenna unit. The grounding member is disposed beside the two antenna units and the two isolation members. A first slot is formed among each first radiator, the second radiator, and the grounding member. The two second radiators are connected to the third radiator. A third slot is formed between the second radiator and the second portion. The two antenna units are symmetric to the fourth slot in a mirrored manner, and the two first portions have widths gradually changing along an extending direction of the fourth position.

Abstract: An electronic device includes a metal back cover and an antenna module. The metal back cover includes a slot. The antenna module is located in the metal back cover. The antenna module includes a first radiator, second radiator, third radiator, fourth radiator, and fifth radiator. The first radiator has a feeding end. The second radiator connected to the first radiator has a contact portion which is connected to the metal back cover. The third radiator is connected to the second radiator and is located beside the first radiator. The third radiator has a first grounding terminal. The fourth radiator is connected to the second radiator and has a second grounding terminal. The fifth radiator is connected to the third radiator and the fourth radiator. Distances between the feeding end and the slot, the first grounding terminal and the slot, and the second grounding terminal and the slot all range from 3.5 mm to 10 mm.

Abstract: An integrated circuit device includes a first semiconductor layer, a second semiconductor layer, a first source/drain epitaxial structure, a second source/drain epitaxial structure, and a first contact plug. The second semiconductor layer is above the first semiconductor layer. The first and second semiconductor layers are vertically spaced apart from each other. The first source/drain epitaxial structure is on a side of the first semiconductor layer. The second source/drain epitaxial structure is on a side of the second semiconductor layer and above the first source/drain epitaxial structure. The first source/drain epitaxial structure has a portion extending beyond a sidewall of the second source/drain epitaxial structure from a top view. The first contact plug is over a frontside of the first source/drain epitaxial structure. The first contact plug overlaps the portion of the first source/drain epitaxial structure from the top view.

Abstract: An image sensing device includes a germanium sensor within a semiconductor body and a metalens formed in the back side of the semiconductor body. The metalens is structured to focus infrared light on the germanium sensor and may have a lower profile than an equivalent microlens. Optionally, the metalens is combined with a microlens to achieve a desired focal length. The metalens, or the metalens in combination with a microlens, overcomes a manufacturing process limitation on the focal length of the microlens, which in turn eliminates the need for, or reduces the thickness of, a spacer between the microlens and the germanium sensor. Eliminating the spacer or reducing its thickness improves the angular response of the image sensing device.

Abstract: A method for saving power is provided. The method is used in a slave device. The method includes receiving a first switch request indicating to switch a clock source from a first clock to a second clock when the slave device enters sleep mode. The method includes transmitting a first clock source signal indicating to switch the clock source from the first clock to the second clock to registers. The method includes switching the clock source from the first clock to the second clock to the registers according to the first clock source signal.

Abstract: A method for saving power is provided. The method is used in a slave device. The method includes receiving a first system power management interface (SPMI) write command from an external device via a SPMI bus when the slave device is in sleep mode. The method includes turning on a system clock in response to the first SPMI write command indicating to turn on the system clock. The method includes allowing the external device to access the slave device.