Abstract: An electronic device includes a metal back cover and an antenna module. The metal back cover includes a slot. The antenna module is located in the metal back cover. The antenna module includes a first radiator, second radiator, third radiator, fourth radiator, and fifth radiator. The first radiator has a feeding end. The second radiator connected to the first radiator has a contact portion which is connected to the metal back cover. The third radiator is connected to the second radiator and is located beside the first radiator. The third radiator has a first grounding terminal. The fourth radiator is connected to the second radiator and has a second grounding terminal. The fifth radiator is connected to the third radiator and the fourth radiator. Distances between the feeding end and the slot, the first grounding terminal and the slot, and the second grounding terminal and the slot all range from 3.5 mm to 10 mm.

Abstract: A routing structure between dies is provided, including a trace layer, disposed on a substrate, wherein a plurality of routing paths is embedded in the trace layer. In addition, a first die and a second die are disposed on the trace layer and connected by the routing paths. A spacing gap between the first die and the second die is along a first direction and interfacing edges of the first die and the second die are extending along a second direction perpendicular to the first direction. Each of the routing paths includes a first straight portion in parallel to connect to the interfacing edges. The first straight portion has a slant angle with respect to the first direction other than 0° and 90°.

Abstract: A package structure and a manufacturing method for the same are provided. The package structure includes a circuit, a mold sealing layer, a conductive metal board, and a conductive layer. The circuit board includes a substrate and a first electronic element disposed on the substrate. The mold sealing layer is disposed on the substrate and covers the first electronic element. The mold sealing layer has a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface. The conductive metal board is disposed on the top surface and adjacent to the first electronic element. The conductive layer is disposed on the side surface and electrically connected to the conductive metal board. The conductive metal board and the conductive layer are each an independent component.

Abstract: An electronic device performance adjustment system and an electronic device performance adjustment method are provided. The electronic device performance adjustment system includes an electronic device, a power supply, and a battery. The electronic device is configured to have multiple operation powers. The power supply is coupled to the electronic device. The power supply is configured to provide a supply current to the electronic device. The battery is coupled to the electronic device and the power supply. The battery is configured to provide a battery current to the electronic device. The power supply is configured to charge the battery. The battery has a battery level. The electronic device further includes a controller coupled to the battery. The controller is configured to determine whether to adjust the operation power of the electronic device according to a change in the battery level.

Abstract: A micro light-emitting device includes an epitaxial structure, a first electrode, a second electrode and a conductive layer. The epitaxial structure includes a first-type semiconductor layer, a light-emitting layer, and a second-type semiconductor layer. The first-type semiconductor layer includes a first portion and a second portion. A bottom area of the first portion is smaller than a top area of the second portion. A thickness of the second portion is greater than 10% of a thickness of the first-type semiconductor layer. The first electrode is disposed on the epitaxial structure and located on the first portion of the first-type semiconductor layer. The second electrode is disposed on the epitaxial structure. The conductive layer is disposed between the first electrode and the first portion, wherein an orthographic projection area of the conductive layer on the first portion is greater than or equal to 90% of an area of the first portion.

Abstract: An escrowing system for cross-blockchain third-party settlement and a method thereof are disclosed. In the escrowing system, an initiating-end host and an accepting-end host escrow digital assets in smart contracts in different blockchains, respectively, and based on a result of delivery of trading entities outside the blockchain, the digital assets escrowed by the smart contracts are transferred or returned, and the arbitration host is permitted to perform trading arbitration, without managing the trading entities, to determine whether the delivery outside the blockchain succeeds. When the arbitration host determines that the delivery outside the blockchain succeeds, the arbitration host can transfer the digital assets escrowed by the initiating-end host and the accepting-end host without consent of the initiating-end host, so as to achieve a technical effect of improving reliability of escrow.

Abstract: A start of medicament delivery notification mechanism is presented where the notification mechanism is positioned within a housing of a medical device and includes a rear cap secured to a distal end of the housing, where the rear cap has a hollow tubular housing extending proximally from a distal end of the rear cap such that the tubular housing is cantilevered within and rotatably fixed relative to the housing and is parallel with a longitudinal axis of the housing. A rotator rotatably is positioned around the tubular housing such that rotator can rotate relative to the tubular housing from a first position to a second position, where the second position coincides with an initiation of a delivery of a dose of medicament. The rotator further has a contact surface that engages with and subsequently disengages from a corresponding contact surface located on the rear cap or on an inside surface of the housing.

Abstract: A cover assembly that covers a medicament delivery member of a medicament container. The assembly having a housing extending along a longitudinal axis, a proximal end and a distal end. A cover member bi-directionally movable along the longitudinal axis relative to the housing, where the cover member has a tubular portion arranged to protrude from the proximal end of the housing, a biasing element arranged between the housing and the cover member configured to move the cover member, a locking member having a fixed end which is pivotally arranged to the housing and a free end which is releasably connected to the cover member. The cover assembly also has an actuator unit connected to the housing configured to interact with the free end of the locking member such that the locking member is able to lock and unlock the cover member in different positions.

Abstract: A power module package structure includes, from top to bottom, a layer of power chips, an upper bonding layer, a thermally-conductive and electrically-insulating composite layer, and a heat dissipation layer. The thermally-conductive and electrically-insulating composite layer contains an insulating layer and an upper copper layer that is formed on the insulating layer. One or more layers of upper packaging materials are covered over the layer of power chips and the upper bonding layer and are in contact with an upper surface of the upper copper layer. One or more layers of lower packaging materials are in contact with the insulating layer and are in contact with sidewalls of the upper copper layer. The lower packaging material has a higher rigidity than the upper packaging material.

Abstract: An antenna module disposed on a substrate having a first and a second surface opposite to each other includes a microstrip line, a first radiator, a ground radiator and a ground plane. The microstrip line, the first radiator and the ground radiator are disposed on the first surface. The microstrip line includes a first and a second end opposite to each other. The first end includes a first feeding end. The first radiator is connected to the second end of the microstrip line. The ground radiator surrounds the microstrip line and the first radiator and has a first opening and two opposite grounding ends. The first end of the microstrip line is located in the first opening. A gap is formed between each grounding end and the first feeding end. The ground plane is disposed on the second surface. The ground radiator is connected to the ground plane.

Abstract: An electronic device and an antenna structure thereof are provided. The antenna structure includes a first radiating member, a feeding member disposed on the first radiating member, a second radiating member, and a grounding member. A first predetermined gap is between the feeding member and the first radiating member. The feeding member, the first predetermined gap, and the first radiating member resonate to generate a low frequency band and a high frequency band. The second radiating member including a main body and a grounding part is disposed on the first radiating member. A second predetermined gap is between the main body and the first radiating member. The grounding part, the main body, and the second predetermined gap resonate to increase a bandwidth of the low frequency band. The grounding member is disposed on the first radiating member and electrically connected to the grounding part.

Abstract: Provided is a memory device including a substrate, a plurality of first stack structures, and a plurality of second stack structures. The substrate includes an array region and a periphery region. The first stack structures are disposed on the substrate in the array region. Each first stack structure sequentially includes: a first tunneling dielectric layer, a first floating gate, a first inter-gate dielectric layer, a first control gate, a first metal layer, a first cap layer, and the first stop layer. The second stack structures are disposed on the substrate in the periphery region. Each second stack structure sequentially includes: a second tunneling dielectric layer, a second floating gate, a second inter-gate dielectric layer, a second control gate, a second metal layer, a second cap layer, and the second stop layer. The first stack structures have a pattern density greater than a pattern density of the second stack structures.

Abstract: A routing structure between dies is provided, including a trace layer, disposed on a substrate, wherein a plurality of routing paths is embedded in the trace layer. In addition, a first die and a second die are disposed on the trace layer and connected by the routing paths. A spacing gap between the first die and the second die is along a first direction and interfacing edges of the first die and the second die are extending along a second direction perpendicular to the first direction. Each of the routing paths includes a first straight portion in parallel to connect to the interfacing edges. The first straight portion has a slant angle with respect to the first direction other than 0° and 90°.

Abstract: A power pack assembly for a medicament delivery device is presented having a housing extending along a longitudinal axis and having a proximal and a distal end, a container carrier unit arranged longitudinally and bi-directionally movable in relation to the housing, a plunger pusher releasably connected to the container carrier unit, and an actuator unit connected to the plunger pusher, wherein the actuator unit is configured to drive the plunger pusher in a sequence in which the plunger pusher and the container unit are moved together distally relative to the housing until a virtual distal stop is met. Proximal movement of the plunger pusher causes the container carrier unit to interact with a proximal stop element of the housing whereby the plunger pusher is released from the container carrier unit and the plunger pusher continues to move proximally a further distance.

Abstract: A chip package structure includes a wiring board, a first chip, a second chip, a thermally conductive material, a molding compound and a heat dissipation part. The wiring board includes a plurality of circuit pads. The first chip is mounted on the wiring board and is electrically connected to at least one of the circuit pads. The first chip is located between the second chip and the wiring board. The thermally conductive material is located on the wiring board and penetrates the second chip and the first chip to extend to the wiring board. The molding compound is disposed on the wiring board, and the heat dissipation part is disposed on the molding material and thermally coupled to the thermally conductive material.

Abstract: The disclosure provides a method and a polar code decoder for determining a to-be-flipped bit position when performing a successive cancellation list flip operation. The method includes: obtaining a polar code decoding tree generated by performing a successive cancellation list (SCL) operation on a polar code segment, and the polar code segment includes multiple bit positions, and each bit position in the polar code decoding tree includes multiple surviving paths and multiple pruned paths; in a post-processing stage for the SCL operation, estimating a correct path probability of each of the surviving paths and the pruned paths of the i-th bit position and accordingly estimating a reliability for the i-th bit position; selecting a specific bit position among the bit positions based on the reliability of each bit position; and performing an SCL flip operation on the polar code decoding tree based on the specific bit position.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a circuit board, a barrier structure and a molding layer. The circuit board includes a substrate and a component disposed on the substrate. The substrate includes a molding area and a non-molding area, and the component is disposed on the molding area. The barrier structure is disposed on the substrate and located between the molding area and the non-molding area. The barrier structure has a first predetermined height. The molding layer is disposed on the molding area and covers the component. The molding layer has a second predetermined height. The first predetermined height of the barrier structure is less than or equal to the second predetermined height of the molding layer.

Abstract: A power module package structure includes, from top to bottom, a layer of power chips, an upper bonding layer, a thermally-conductive and electrically-insulating composite layer, and a heat dissipation layer. The thermally-conductive and electrically-insulating composite layer contains an insulating layer and an upper copper layer that is formed on the insulating layer. One or more layers of upper packaging materials are covered over the layer of power chips and the upper bonding layer and are in contact with an upper surface of the upper copper layer. One or more layers of lower packaging materials are in contact with the insulating layer and are in contact with sidewalls of the upper copper layer. The lower packaging material has a higher rigidity than the upper packaging material.

Abstract: An anonymous disclose and many-to-many recognition system based on blockchain and identity confirmation allowance and a method thereof are disclosed. In the system, an exposing host generates a one-time address and encrypt the disclosure data into the encrypted data, write the encrypted data into the blockchain; an identity confirmation host generates a valid flag, and an announcement host decrypts the encrypted data to generate a corresponding receipt flag, and garbles a correspondence between the decrypted disclosure data and the corresponding one-time address, to generate and write a shuffled recognition announcement to a blockchain, so that when the exposing host detects the presence of the self-owned disclosure data and one-time address in the shuffled recognition announcement, the exposing host writes a recognition flag into the blockchain. Therefore, the technical effect of improving anonymity and allowing identity confirmation can be achieved.

Abstract: A chip package structure includes a wiring board, a first chip, a second chip, a thermally conductive material, a molding compound and a heat dissipation part. The wiring board includes a plurality of circuit pads. The first chip is mounted on the wiring board and is electrically connected to at least one of the circuit pads. The first chip is located between the second chip and the wiring board. The thermally conductive material is located on the wiring board and penetrates the second chip and the first chip to extend to the wiring board. The molding compound is disposed on the wiring board, and the heat dissipation part is disposed on the molding material and thermally coupled to the thermally conductive material.