Patents by Inventor Hua Chen

Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200381346
    Abstract: A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming a dielectric layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding, and bonding a die stack to through-silicon vias in the device die.
    Type: Application
    Filed: August 17, 2020
    Publication date: December 3, 2020
    Inventors: Ming-Fa Chen, Chen-Hua Yu
  • Publication number: 20200381095
    Abstract: A method, a computer program product, and a computer system predict medication adherence of a patient. The method includes identifying risk factors associated with medication adherence of the patient. The method includes determining a likely behaviour for medication adherence of the patient based on the identified risk factors and a temporal causal model. The temporal causal model is based on features of a patient cluster to which the patient belongs. The features are nodes in the temporal causal model. The likely behaviour is based on causality measures for each identified risk factor to the nodes. The method includes determining a current medication adherence value of the patient. The current medication adherence value is indicative of a ratio between an actual medication regiment and an expected medication regiment. The method includes determining a future medication adherence value of the patient based on the current medication adherence value and the causality measures.
    Type: Application
    Filed: May 31, 2019
    Publication date: December 3, 2020
    Inventors: Zhiguo Li, Ching-Hua Chen, CHANDRAMOULI MADURI, PEI-YUN HSUEH
  • Publication number: 20200381409
    Abstract: A semiconductor package structure includes an interconnection structure having a first surface and a second surface opposite to the first surface, a die surrounded by a molding compound over the first surface of the interconnection structure, and a passive device surrounded by a dielectric structure over the second surface of the interconnection structure. The passive device is electrically coupled to the die by the interconnection structure.
    Type: Application
    Filed: May 29, 2019
    Publication date: December 3, 2020
    Inventors: YANG-CHE CHEN, CHEN-HUA LIN, HUANG-WEN TSENG, VICTOR CHIANG LIANG, CHWEN-MING LIU
  • Patent number: 10854458
    Abstract: A method of forming a semiconductor device includes providing a precursor. The precursor includes a substrate; a gate stack over the substrate; a first dielectric layer over the gate stack; a gate spacer on sidewalls of the gate stack and on sidewalls of the first dielectric layer; and source and drain (S/D) contacts on opposing sides of the gate stack. The method further includes recessing the gate spacer to at least partially expose the sidewalls of the first dielectric layer but not to expose the sidewalls of the gate stack. The method further includes forming a spacer protection layer over the gate spacer, the first dielectric layer, and the S/D contacts.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: December 1, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih Wei Lu, Chung-Ju Lee, Hai-Ching Chen, Chien-Hua Huang, Tien-I Bao
  • Patent number: 10850316
    Abstract: A roller assembly includes a workbench, a roller module located above the workbench, and a locking assembly coupled to the roller module and configured to position the roller module above the workbench. The roller module includes a driving device and a pressure roller. The driving device is coupled to the pressure roller through a crank assembly. The crank assembly drives the pressure roller to move along a track to roll on a work-piece positioned on the workbench.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: December 1, 2020
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Zhi-Yu Hu, Ting-Hui Deng, Chun-Xu Jin, Jin-Hua Ye, Long-Fong Chen
  • Patent number: 10853525
    Abstract: Systems and methods for a hack-proof security keyboard are described. In some embodiments, a keyboard module may include a first circuit configured to detect activation of a plurality of keys and a second circuit configured to detect activation of a subset of the plurality of keys, where the second circuit overlies the first circuit. In other embodiments, a method may include detecting an electrical signal received from a secondary membrane of a keyboard, where the keyboard includes a primary membrane configured to detect individual activation of any of a plurality of keys, and where the secondary membrane is configured to output the electrical signal in response to concurrent activation of a subset of the plurality of keys. The method may also include performing a selected action in response to the detection.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: December 1, 2020
    Assignee: Dell Products, L.P.
    Inventors: Yong-Teng Lin, Geroncio Ong Tan, Timothy C. Shaw, No-Hua Chuang, Erh-Chieh Chang, Chih-Hao Chen, Wen-Pin Huang
  • Patent number: 10850242
    Abstract: A device for mixing two gas streams, the device includes: an inner pipe, wherein: the inner pipe is arranged substantially concentrically within an outer pipe and forms an annulus between an outer diameter of the inner pipe and an inner diameter of the outside pipe; the inner pipe is closed at a downstream end; and the inner pipe comprises a plurality of perforations; and the outer pipe, wherein: a downstream end of the outer pipe extends into a reactor; the outer pipe is closed at the downstream end; and the downstream end of the outer pipe comprises a plurality of perforations. The mixed gas stream can enter the reactor. The reactor can be an Oxidative Coupling of Methane (OCM) reactor.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: December 1, 2020
    Inventors: Lei Chen, Sreekanth Pannala, Robert Broekhuis, Hua Bai, Pankaj Gautam, David West
  • Patent number: 10854780
    Abstract: A light emitting device including a light emitting unit and a phosphor resin layer is provided. The light emitting unit has a top surface and a bottom surface opposite to each other. Each of the light emitting units includes two electrodes. The two electrodes are disposed on the bottom surface. The phosphor resin layer is disposed on the top surface of the light emitting unit. One side of the phosphor resin layer has a mark. One of the two electrodes is closer to the mark with respect to the other one of the two electrodes.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: December 1, 2020
    Assignee: Genesis Photonics Inc.
    Inventors: Cheng-Wei Hung, Chin-Hua Hung, Xun-Xain Zhan, Chuan-Yu Liu, Yun-Chu Chen, Yu-Feng Lin
  • Patent number: 10853616
    Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: December 1, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu
  • Patent number: 10850446
    Abstract: In a three-dimensional printing method example, an epoxy mold compound build material is applied. A fusing agent is selectively applied on at least a portion of the epoxy mold compound build material. The epoxy mold compound build material is exposed to energy, thereby fusing the portion of the epoxy mold compound build material in contact with the fusing agent to form a layer.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: December 1, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Qin Liu, Michael G. Monroe
  • Patent number: 10854568
    Abstract: A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming an insulation layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, and bonding a device to the insulation layer and a portion of the plurality of bond pads through hybrid bonding.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: December 1, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Fa Chen, Chen-Hua Yu
  • Patent number: 10854803
    Abstract: A manufacturing method of a light emitting device package structure is provided. The method includes following operations: (i) providing a circuit redistribution structure; (ii) providing a first substrate; (iii) forming a circuit layer structure over the first substrate, wherein the circuit layer structure includes a first circuit layer; (iv) before or after operation (iii), placing a light emitting device between the first substrate and the circuit layer structure or over the circuit layer structure, wherein the light emitting device is electrically connected with the first circuit layer; and (v) placing the circuit redistribution structure over the light emitting device, wherein the circuit redistribution structure includes a first redistribution layer, a second redistribution layer, and a chip, and the first redistribution layer includes a second circuit layer and a conductive contact that contacts the second circuit layer.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: December 1, 2020
    Assignee: UNIMICRON TECHNOLOGY CORP.
    Inventors: Pei-Wei Wang, Cheng-Ta Ko, Yu-Hua Chen, De-Shiang Liu, Tzyy-Jang Tseng
  • Publication number: 20200373714
    Abstract: An electrical connector includes an insulative housing, a plurality of contacts assembled in the housing, a plurality of cylindrical mating ports located on and forwardly extending from a front face of the housing, and a plurality of LEDs (Light Emitting Diodes) disposed in the housing behind the front face thereof. The mating port includes a majority part and a minority part engaged with each other wherein the majority part has the material same with or similar to that of the housing and is spaced away from the LED while the minority part is essentially translucent or transparent for light transmission/guiding and intimately confronts the LED.
    Type: Application
    Filed: May 22, 2020
    Publication date: November 26, 2020
    Inventors: ZHONG-HUA ZHOU, ZHI-JIAN CHEN
  • Publication number: 20200373468
    Abstract: The application discloses a light-emitting device including a carrier, a light-emitting element and a connecting structure. The carrier includes a first connecting portion and a first necking portion extended from the first connecting portion. The first connecting portion has a first width, and the first necking portion has a second width. The second width is less than the first width. The light-emitting element includes a first light-emitting layer being able to emit a first light and a first contacting electrode formed under the first light-emitting layer. The first contacting electrode is corresponded to the first connecting portion. The connecting structure includes a first electrical connecting portion and a protecting portion surrounding the first electrical connecting portion. The first electrical connecting portion is electrically connected to the first connecting portion and the first contacting electrode.
    Type: Application
    Filed: August 11, 2020
    Publication date: November 26, 2020
    Inventors: Ching-Tai CHENG, Shau-Yi CHEN, Yih-Hua RENN, Wei-Shan HU, Pei-Hsuan LAN
  • Publication number: 20200370563
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet and at least one outlet. The impeller is disposed in the housing and rotates about an axis. The inlet is located in an axial direction of the axis and corresponds to the impeller. The outlet is located in a radial direction relative to the axis. The inlet is divided into a compression section and a release section in the rotation direction of the impeller, and the compression section has a uniform first radial dimension relative to the axis. The release section has an extended second radial dimension relative to the axis, and the second radial dimension is greater than the first radial dimension.
    Type: Application
    Filed: April 27, 2020
    Publication date: November 26, 2020
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen, Chun-Chieh Wang
  • Publication number: 20200373680
    Abstract: A communication device includes a display device, a first antenna element, a second antenna element, a third antenna element, and a fourth antenna element. The display device is surrounded by the first antenna element, the second antenna element, the third antenna element, and the fourth antenna element. Any adjacent two of the first antenna element, the second antenna element, the third antenna element, and the fourth antenna element have different polarization directions.
    Type: Application
    Filed: April 28, 2020
    Publication date: November 26, 2020
    Applicant: HTC Corporation
    Inventors: Cheng-Hung LIN, Szu-Po WANG, Chun-Chieh WANG, Yu-Yu CHEN, Shih-Hua WU, Dun-Yuan CHENG
  • Publication number: 20200368298
    Abstract: A composition having Lactobacillus Plantarum strain GMNL-662 for promoting bone regrowth is provided. The Lactobacillus Plantarum strain GMNL-662 has an ability to promote the expression of osteogenic genes, inhibit the expression of osteoclast related genes, and promote the expression of osteogenesis-related cytokine TGF-?, so that the bone loss is improved.
    Type: Application
    Filed: August 3, 2020
    Publication date: November 26, 2020
    Inventors: Yi-Hsing CHEN, Wan-Hua Tsai, Chia-Hsuan Chou, Chi Chien Lin
  • Publication number: 20200371617
    Abstract: A touch panel includes a touch sensing layer, a flexible circuit board and an anisotropic conductive film. The touch sensing layer includes sensing pads and a reserved room, and the reserved room is arranged outside the sensing pads. The flexible circuit board includes conductive pads, the outermost conductive pad is provided with a virtual pattern, and the position of the virtual pattern corresponds to the position of the reserved room. The anisotropic conductive film is arranged between the touch sensing layer and the flexible circuit board, and the sensing pads are respectively electrically connected to the conductive pads through the anisotropic conductive film.
    Type: Application
    Filed: June 4, 2019
    Publication date: November 26, 2020
    Inventors: PO-LIN CHEN, HSUAN-MAN CHANG, MIN-HUI YIN, CHU-JUNG LIN, MEI-HUA CHOU
  • Publication number: 20200369031
    Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.
    Type: Application
    Filed: August 12, 2020
    Publication date: November 26, 2020
    Inventors: Silam J. Choy, Michael W. Cumbie, Devin Alexander Mourey, Chien-Hua Chen
  • Patent number: D902982
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: November 24, 2020
    Assignee: TDK TAIWAN CORP.
    Inventors: Fu-Yuan Wu, Kun-Shih Lin, Shang-Yu Hsu, Yi-Ho Chen, Shih-Ting Huang, Shou-Jen Liu, Chien-Lun Huang, Yi-Hsin Nieh, Chen-Chi Kuo, Chia-Pin Hsu, Yu-Huai Liao, Shin-Hua Chen, Yu-Cheng Lin, Shao-Chung Chang, Kuo-Chun Kao, Chia-Hsiu Liu, Chao-Chun Chang, Yuan-Shih Liao