Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

Abstract: Embodiments of this application disclose a backscatter communication method and a related apparatus. The method includes: receiving, by a backscatter device, a first signal from an excitation device, the first signal carries a first sequence determined by the excitation device; modulating, by the backscatter device, backscatter device data to the first signal to obtain a second signal, wherein the backscatter device data is scrambled by the first sequence; backscattering, by the backscatter device, the second signal to a receiving device.

Abstract: A dental handpiece includes a barrel, an air turbine, a central shaft, a bearing and a seal. The barrel includes an axial open end. The air turbine is rotatably provided in the barrel. The central shaft is secured to the air turbine to rotate with the air turbine. The bearing is mounted in the barrel and supports the central shaft for rotation. The seal is trumpet-shaped and arranged between the open end of the barrel and the bearing. The seal includes a sealing portion sleeved over an outer cylindrical surface of the central shaft. The sealing portion is deformable to separate from the outer cylindrical surface of the central shaft or closely contact the outer cylindrical surface of the central shaft depending on a pressure difference between interior and exterior of the barrel.

Abstract: An integrated circuit comprising an n-type drift region, a gate structure directly on a first portion of the n-type drift region, a drain structure formed in a second portion of the n-type drift region, the gate structure and the drain structure being separated by a drift region length, a resist protective oxide (RPO) formed over a portion of the n-type drift region between the gate structure and the drain structure, a field plate contact providing a direct electrical connection to the resist protective oxide.

Abstract: The present disclosure provides a molding system for fabricating a FRP composite article. The molding system includes a detector, a resin dispenser, a processing module, and a molding machine. The detector is configured to capture a graph of a woven fiber from a top view. The resin dispenser is configured to provide a resin to the woven fiber to form a FRP. The processing module is configured to receive the graph and a plurality of parameters of the FRP. The processing module includes a CNN model, and is configured to use the CNN model to obtain a plurality of predicted mechanical properties of the FRP according to the graph and the plurality of parameters of the FRP. The molding machine is configured to mold the FRP to fabricate the FRP composite article according to the plurality of predicted mechanical properties.

Abstract: A fluid ejection device may include a fluid ejection die including nozzles and fluid feed holes. Each nozzle may have a nozzle orifice formed in a top surface of the fluid ejection die. The fluid feed holes may be formed in a bottom surface of the fluid ejection die and fluidly connected to the nozzles. The fluid ejection device may include a molded panel into which the fluid ejection die is at least partially embedded, the molded panel having a fluid slot formed therethrough such that the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die, the molded panel formed with a mold chase and a release liner coupled to and at least partially covering an interior surface of the mold chase, the mold chase having a fluid slot feature corresponding to the fluid slot.

Abstract: A controller includes a body and a surrounding part. The body has a control area for sending a control signal according to a movement of a thumb of a user. The surrounding part is connected to the body and used to surround and be fixed to a proximal phalange of an index finger of the user. The body is away from a joint between the proximal phalange and a metacarpal bone of the user.

Abstract: Methods for processing deposited metal nanowire inks with metal ions are used to form fused metal nanostructured networks. The metal nanowire inks include a hydrophilic polymer binder, such as a cellulose based binder. The metal nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

Abstract: A display method for a device having a foldable screen includes: detecting a status of the foldable screen; displaying an application interface on one or more of a first screen of the foldable screen or a second screen of the foldable screen according to a first display policy if the status of the foldable screen is a support state or a folded state; or if the status of the foldable screen is an unfolded state, displaying the application interface on the foldable screen in the unfolded state according to a second display policy, where in the unfolded state the first screen and the second screen form a same plane or form an approximately same plane, and where the first display policy is different from the second display policy.

Abstract: A package structure is provided. The package structure includes a semiconductor chip and a protective layer laterally surrounding the semiconductor chip. The package structure also includes a polymer-containing element over the protective layer. The protective layer is wider than the polymer-containing element.

Abstract: A real-time ground fusion system is based on binocular stereo vision and an intelligent terminal. The method for accomplish real-time ground fusion includes: S1 of obtaining a disparity map about a same road scenario, and converting a disparity map in a target region into a 3D point cloud; S2 of performing pose conversion on a current frame and a next frame adjacent to the current frame, and performing inverse conversion on a 3D point cloud of the current frame; and S3 of repeating S2 with each frame in the target region as the current frame, so as to achieve ground fusion. Through the conversion and fusion of adjacent frames, holes caused by the projection of the disparity map can be filled to assist driving and output accurate height data, thereby improving comfortableness.

Abstract: Systems, methods, and instrumentalities may be used for decoding and/or encoding a coding unit (CU). An intra-prediction mode for a CU may be determined. A split mode may be determined based on the intra-prediction mode, to generate a plurality of sub-partitions in the CU. A prediction for a first sub-partition of the plurality of sub-partitions in the CU may be based on a reference sample in a second sub-partition of the plurality of sub-partitions in the CU. The CU may be decoded and/or encoded, for example, based on the determined split mode.

Abstract: A package structure including a first substrate and a second substrate is provided. The first substrate includes first bumps with first lateral dimension and second bumps with second lateral dimension. The first bumps are distributed in a first region of the first substrate, and the second bumps are distributed in the second region of the first substrate, wherein the first lateral dimension is greater than the second lateral dimension, and a first bump height of the first bumps is smaller than a second bump height of the second bumps. The second substrate includes conductive terminals electrically connected to the first bumps and the second bumps.

Abstract: An SRAM cell includes a first n-type channel (n-channel) layer engaged with a first gate layer to form a first device; a first p-type channel (p-channel) layer engaged with the first gate layer to form a second device, the first gate layer stacked between the first n-channel layer and the first p-channel layer along a first direction; a second n-channel layer engaged with a second gate layer to form a third device, the second gate layer coupled to a first word line and the second n-channel layer coupled to the first n-channel layer along a second direction perpendicular to the first direction; a third n-channel layer engaged with a third gate layer to form a fourth device, the third n-channel layer spaced from the second n-channel layer along a third direction perpendicular to the first direction and the second direction; a second p-channel layer engaged with the third gate layer to form a fifth device, the third gate layer stacked between the third n-channel layer and the second p-channel layer along the fir

Abstract: Some implementations described herein include operating components in a lithography system at variable speeds to reduce, minimize, and/or prevent particle generation due to rubbing of or collision between contact parts of the components. In some implementations, a component in a path of transfer of a semiconductor substrate in the lithography system is operated at a relatively high movement speed through a first portion of an actuation operation, and is operated at a reduced movement speed (e.g., a movement speed that is less than the high movement speed) through a second portion of the actuation operation in which contact parts of the component are to interact. The reduced movement speed reduces the likelihood of particle generation and/or release from the contact parts when the contact parts interact, while the high movement speed provides a high semiconductor substrate throughput in the lithography system.

Abstract: A power supply system includes: first and second external path selection circuits respectively controlling first and second powers at first and second nodes to be electrically connected to first or second system ports; and an internal path selection circuit controlling a third power at a third node or a fourth power at a fourth node to be electrically connected to one or more power conversion modules. The first and the second external path selection circuits, the internal path selection circuit and the power conversion modules perform one of the following operations: (1) receiving at least one external power from one or more of the first and second system port, to generate third power at the third node and/or generate fourth power at the fourth node; or (2) converting power from a battery, to generate at least one output power at the first and/or second system port.

Abstract: Some implementations described herein provide a laser device. The laser device includes a first portion of the laser device, at a proximal end of the laser device, that includes one or more optical devices, where the first portion is configured to emit first electromagnetic waves having a first wavelength. The laser device includes a second portion of the laser device, at a distal end of the laser device, that includes an optical crystal configured to receive the first electromagnetic waves and to emit second electromagnetic waves having a second wavelength based on reception of the first electromagnetic waves, where the optical crystal includes a thin film coating disposed on an end of the optical crystal, the thin film coating configured to: support emission of the second electromagnetic waves from the optical crystal, and support internal reflection of the first electromagnetic waves within the optical crystal.

Abstract: The present disclosure discloses a manufacturing method and a manufacturing device for an interconnection piece. The manufacturing method comprises providing a solder strip, and performing forming treatment on the solder strip to obtain a plurality of structural solder strips; and providing a flexible insulating substrate, and compounding the plurality of structural solder strips on the flexible insulating substrate at intervals to obtain the interconnection piece. Each structural solder strip is provided with two soldering portions and a connecting portion located between the two soldering portions, and the connecting portion is respectively connected to the two soldering portions; at least a part of the connecting portion is located on the flexible insulating substrate, and the two soldering portions extend out of the flexible insulating substrate.

Abstract: A signal processing method applied to a transmit end includes obtaining an LDPC encoded signal based on a to-be-sent signal; then, modulating the LDPC encoded signal into a PAM8 symbol; and further, sending the PAM8 symbol to a receive end through a network cable.

Abstract: Disclosed are an aminosilane modified tackifier and a preparation method therefor, and a silane modified polyether adhesive and a preparation method therefor. The aminosilane modified tackifier has the following structure. The aminosilane modified tackifier is added in the silane modified polyether adhesive of the present disclosure, such that the silane modified polyether adhesive has high adhesion property with a base material, particularly high water-soaking adhesion property, and meanwhile has high comprehension properties such as high displacement capability, high elasticity recovery rate and high cohesion strength, and thus has significant advantages compared with the existing products in the market.